Patents by Inventor Shinji Asayama

Shinji Asayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and method of manufacturing the same
    Patent number: 10512168
    Abstract: The electronic device includes a printed circuit board having a first main surface, an electronic part mounted on the first main surface, and a first connection member connecting the printed circuit board and the electronic part. The printed circuit board includes at least one projection formed on the first main surface so as to project in a direction crossing the first main surface. The projection is formed outside the bottom surface of the electronic part which is located at the side of the first main surface. The first connection member is in contact with at least part of the projection, at least part of the bottom surface of the electronic part, and at least part of a lateral surface of the electronic part intersecting the bottom surface.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: December 17, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Shinji Asayama
  • ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20190075660
    Abstract: The electronic device includes a printed circuit board having a first main surface, an electronic part mounted on the first main surface, and a first connection member connecting the printed circuit board and the electronic part. The printed circuit board includes at least one projection formed on the first main surface so as to project in a direction crossing the first main surface. The projection is formed outside the bottom surface of the electronic part which is located at the side of the first main surface. The first connection member is in contact with at least part of the projection, at least part of the bottom surface of the electronic part, and at least part of a lateral surface of the electronic part intersecting the bottom surface.
    Type: Application
    Filed: February 9, 2017
    Publication date: March 7, 2019
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Shinji Asayama