Patents by Inventor Shinji Hanatani

Shinji Hanatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4855846
    Abstract: In a device for loading a tape-like substance, in which the tape-like substance, such as tape, film or the like paid out of a supply reel is conveyed with air to a take-up reel's side through a duct as a tape path having a peripheral path provided along the periphery of a guide drum, a movable guide for leading the tape-like substance together with the air to the beginning of the peripheral path is disposed, so that it can be smoothly operated to load the tape-like substance.
    Type: Grant
    Filed: January 6, 1988
    Date of Patent: August 8, 1989
    Assignee: Sony Corporation
    Inventors: Shinji Hanatani, Yoshiaki Sugiyama, Hisayoshi Chino
  • Patent number: 3942934
    Abstract: A mold assembly for use in a packaging machine for making a blistered package, which forms a plurality of blisters in a web of thermoplastic resin film forming a part of the blistered package. The mold assembly comprises a preforming structural body formed with a plurality of preforming molds and a finishing structural body formed with the corresponding number of finishing molds arranged in the same pattern as the preforming molds. The thermoplastic resin web is first subjected to a preforming process with the preforming structural body and then to a final forming process with the finishing structural body thereby to avoid excessive and quick reduction of the wall thickness which may otherwise be observable in any of the finally formed blisters. A method for this purpose is also disclosed.
    Type: Grant
    Filed: October 11, 1974
    Date of Patent: March 9, 1976
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Takenori Momiyama, Keiiti Mizutani, Masakazu Oi, Shinji Hanatani