Abstract: On-vehicle electrical loads (121,122) are connected to an on-vehicle battery (101) via a series circuit including a load switching element (221,222) and a reverse current interrupting element (200a) for a load circuit, and a feeding switching element (120A) that is closed in response to closure of a power supply switch (110). The element (FET) (200a) is closed when the switch (110) is closed and a power supply voltage is applied to a load power supply terminal (Vba) connected to the element (120A), to thereby be energized in an energization direction of an internal parasitic diode thereof. The element (200a) is de-energized when the switch (110) is opened. Thus, malfunction is prevented, which occurs when the element (120A) is opened, a short-to-power flows backward via the element (200a) into the terminal (Vba) so as to feed power to another device connected to the element (200a).

Abstract: On-vehicle electrical loads (121,122) are connected to an on-vehicle battery (101) via a series circuit including a load switching element (221,222) and a reverse current interrupting element (200a) for a load circuit, and a feeding switching element (120A) that is closed in response to closure of a power supply switch (110). The element (FET) (200a) is closed when the switch (110) is closed and a power supply voltage is applied to a load power supply terminal (Vba) connected to the element (120A), to thereby be energized in an energization direction of an internal parasitic diode thereof. The element (200a) is de-energized when the switch (110) is opened. Thus, malfunction is prevented, which occurs when the element (120A) is opened, a short-to-power flows backward via the element (200a) into the terminal (Vba) so as to feed power to another device connected to the element (200a).

Abstract: Provided is a small and low-cost resin-sealed electronic control device including a first electronic board and a second electronic board respectively bonded onto an upper surface and a lower surface of a support plate, each of the first electronic board and the second electronic board having an increased mounting area on which circuit components are mounted. A first electronic board (30A) and a second electronic board (40A) respectively bonded onto an upper surface and a lower surface of a support plate (20A) include outer circuit components (31, 41) and inner circuit components (33, 43) respectively mounted on outer surfaces and inner surfaces thereof. The inner circuit components (33, 43) are fitted into a window hole portion (21) of the support plate (20A) and are sealed with a filler (25).

Abstract: Provided is a small resin-sealed electronic control device with a reduced plane area and volume, which can provide an enlarged area on which circuit components are mounted without increasing a plane area of electronic boards. In the resin-sealed electronic control device, a support member (20A) includes a first support plate (21a), a second support plate (22a), and a pair of rising portions (23a) which form a space portion with a first electronic board (30A) and a second electronic board (40A). An exterior covering material (11) is formed by injecting a melted synthetic resin into the space portion and spaces outside the space portion along the pair of rising portions (23a). Inner circuit components (33) are situated inside window holes formed through the support plate (20A) and face one of the first electronic board (30A) and the second electronic board (40A) opposed to each other with a gap interposed therebetween.

Abstract: Provided is a small resin-sealed electronic control device with a reduced plane area and volume, which can provide an enlarged area on which circuit components are mounted without increasing a plane area of electronic boards. In the resin-sealed electronic control device, a support member (20A) includes a first support plate (21a), a second support plate (22a), and a pair of rising portions (23a) which form a space portion with a first electronic board (30A) and a second electronic board (40A). An exterior covering material (11) is formed by injecting a melted synthetic resin into the space portion and spaces outside the space portion along the pair of rising portions (23a). Inner circuit components (33) are situated inside window holes formed through the support plate (20A) and face one of the first electronic board (30A) and the second electronic board (40A) opposed to each other with a gap interposed therebetween.

Abstract: Provided is a resin-sealed electronic control device reduced in size, which includes a double-sided mounting board as at least one of a plurality of electronic boards obtained by division so that a large mounting surface with a small plane area is ensured. Each of a first electronic board (30A) and a second electronic board (40A) bonded onto an upper surface and a lower surface of each of a pair of separate beam members (20A) includes two surfaces on which outer circuit components (31, 32, 41, 42) and an inner circuit component (33, 43) are respectively mounted. A height of each of the inner circuit components is equal to or less than a thickness of each of the separate beam members (20A). Heat-generating components (32, 42) in the outer circuit components are provided to be adjacent to and opposed to the separate beam members (20A).