Patents by Inventor Shinji Hiramitsu

Shinji Hiramitsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10720383
    Abstract: In a semiconductor device, a first semiconductor chip and a second semiconductor chip are aligned in a direction orthogonal to a plate thickness direction of the first semiconductor chip. A pair of first heat sinks is disposed on opposite sides of the first semiconductor chip in the first direction, and a pair of second heat sinks disposed on opposite sides of the second semiconductor chip in the first direction. The semiconductor chips and the heat sinks are sealed in a resin molded body. A plurality of main terminals are aligned in the second direction and project from a same side surface of a resin molded body. The main terminals includes a positive electrode terminal, a negative electrode terminal, an output terminal, and an auxiliary terminal. The first relay members are disposed in the resin molded body, and electrically connecting the main terminals and the corresponding heat sinks.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: July 21, 2020
    Assignee: DENSO CORPORATION
    Inventor: Shinji Hiramitsu
  • Publication number: 20200135702
    Abstract: In a semiconductor module, two switching elements are connected in parallel to each other. Each of the switching elements includes a first main electrode formed on one surface side, and a second main electrode and a gate electrode formed on a rear surface side opposite to the one surface side. A first conductor plate is coupled with two first main terminals at first coupling portions and is electrically connected with the first main electrodes. A second conductor plate is coupled with one second main terminal at a second coupling portion and is electrically connected with the second main electrodes. The second coupling portion is disposed between the switching elements in an alignment direction of the switching elements, and the first coupling portions are provided on both sides of the second coupling portion in the alignment direction.
    Type: Application
    Filed: December 31, 2019
    Publication date: April 30, 2020
    Inventors: Shunsuke ARAI, Shinji HIRAMITSU, Takuo NAGASE
  • Patent number: 10535577
    Abstract: In a semiconductor device, a plurality of semiconductor chips included in an upper-arm circuit are connected in parallel between a pair of upper-arm plates, while a plurality of semiconductor chips included in a lower-arm circuit are connected in parallel between a pair of lower-arm plates. In each of the arm circuits, the plurality of semiconductor chips are arranged in a direction perpendicular to a direction in which emitter electrodes and pads are arranged, the pads are disposed on the same side of the emitter electrodes, and signal terminals extend in the same direction. A series-connecting part between the upper- and lower-arm circuits includes a joint part 20 continued to respective side surfaces of the corresponding upper- and lower-arm plates. Each of inductances of respective parallel-connecting parts of the upper- and lower-arm plates which connect the semiconductor chips in parallel is smaller than an inductance of the series-connecting part.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: January 14, 2020
    Assignee: DENSO CORPORATION
    Inventors: Hiroshi Ishino, Hideki Kawahara, Shinji Hiramitsu, Shunsuke Arai
  • Publication number: 20190333843
    Abstract: In a semiconductor device, a first semiconductor chip and a second semiconductor chip are aligned in a direction orthogonal to a plate thickness direction of the first semiconductor chip. A pair of first heat sinks is disposed on opposite sides of the first semiconductor chip in the first direction, and a pair of second heat sinks disposed on opposite sides of the second semiconductor chip in the first direction. The semiconductor chips and the heat sinks are sealed in a resin molded body. A plurality of main terminals are aligned in the second direction and project from a same side surface of a resin molded body. The main terminals includes a positive electrode terminal, a negative electrode terminal, an output terminal, and an auxiliary terminal. The first relay members are disposed in the resin molded body, and electrically connecting the main terminals and the corresponding heat sinks.
    Type: Application
    Filed: July 9, 2019
    Publication date: October 31, 2019
    Inventor: Shinji HIRAMITSU
  • Publication number: 20190088568
    Abstract: In a semiconductor device, a plurality of semiconductor chips included in an upper-arm circuit are connected in parallel between a pair of upper-arm plates, while a plurality of semiconductor chips included in a lower-arm circuit are connected in parallel between a pair of lower-arm plates. In each of the arm circuits, the plurality of semiconductor chips are arranged in a direction perpendicular to a direction in which emitter electrodes and pads are arranged, the pads are disposed on the same side of the emitter electrodes, and signal terminals extend in the same direction. A series-connecting part between the upper- and lower-arm circuits includes a joint part 20 continued to respective side surfaces of the corresponding upper- and lower-arm plates. Each of inductances of respective parallel-connecting parts of the upper- and lower-arm plates which connect the semiconductor chips in parallel is smaller than an inductance of the series-connecting part.
    Type: Application
    Filed: April 27, 2017
    Publication date: March 21, 2019
    Inventors: Hiroshi ISHINO, Hideki KAWAHARA, Shinji HIRAMITSU, Shunsuke ARAI
  • Patent number: 10109557
    Abstract: An electronic device includes: a resin substrate that includes insulation resin on which wiring made of conductive material is provided; a heat-generation element that is a circuit element mounted on a first surface of the resin substrate, and is operated to generate heat; and a sealing resin that is provided on the first surface, and seals the heat-generation element. An opposite surface of the sealing resin opposite to a surface of the sealing resin in contact with the first surface is thermally connected to a heat radiation member and mounted on the heat radiation member. Each of the resin substrate and the sealing resin has a bend shape convex toward the opposite surface when each of surrounding temperatures is a normal temperature and has a linear expansion coefficient for maintaining a bend shape convex toward the opposite surface when each of the surrounding temperatures is a high temperature.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: October 23, 2018
    Assignee: DENSO CORPORATION
    Inventors: Tetsuto Yamagishi, Toshihiro Nagaya, Masayuki Takenaka, Shinji Hiramitsu
  • Patent number: 9832872
    Abstract: A manufacturing method of an electronic device, including: a circuit board with a substrate through hole; a circuit element; and a resin mold with a mold through hole, using a first mold, a second mold having a cavity, and a pressing member protruding from a bottom of the cavity includes: fixing the circuit board to the first mold; fixing the second mold to the first mold to cover an opening of the substrate through hole by the pressing member; and forming the resin mold while covering the circuit element with the constituent material in the cavity. The circuit board is deformed by press-contacting the pressing member to the circuit board in a state where a part of the pressing member is inserted into the substrate through hole so that an opening area of the substrate through hole decreases toward a reverse surface from the one surface.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: November 28, 2017
    Assignee: DENSO CORPORATION
    Inventors: Tetsuto Yamagishi, Masayuki Takenaka, Toshihiro Nagaya, Shinji Hiramitsu
  • Publication number: 20170330818
    Abstract: An electronic device includes: a resin substrate that includes insulation resin on which wiring made of conductive material is provided; a heat-generation element that is a circuit element mounted on a first surface of the resin substrate, and is operated to generate heat; and a sealing resin that is provided on the first surface, and seals the heat-generation element. An opposite surface of the sealing resin opposite to a surface of the sealing resin in contact with the first surface is thermally connected to a heat radiation member and mounted on the heat radiation member. Each of the resin substrate and the sealing resin has a bend shape convex toward the opposite surface when each of surrounding temperatures is a normal temperature and has a linear expansion coefficient for maintaining a bend shape convex toward the opposite surface when each of the surrounding temperatures is a high temperature.
    Type: Application
    Filed: December 11, 2015
    Publication date: November 16, 2017
    Inventors: Tetsuto YAMAGISHI, Toshihiro NAGAYA, Masayuki TAKENAKA, Shinji HIRAMITSU
  • Patent number: 9780684
    Abstract: A power converter includes: a circuit board having an insulating substrate and a plurality of wirings in the insulating substrate; and first and second switching elements on a first surface of the circuit board that are connected in series. The first switching element has first and second electrodes. The second switching element has a third electrode and a fourth electrode. The circuit board has a first wiring connected to the first electrode, a second wiring connected to the second and third electrodes, a third wiring connected to the fourth electrode, a fourth wiring as an output wiring connected to the third electrode, and a fifth wiring connected to the third wiring. The first, second, third and fourth wirings are arranged in order on the first surface, and the fifth wiring on a second surface opposite to the first surface is opposed to the first, second, and third wirings.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: October 3, 2017
    Assignee: DENSO CORPORATION
    Inventor: Shinji Hiramitsu
  • Publication number: 20170229371
    Abstract: An electronic device includes: a heating element; an insulation metal component; and a sealing component. The insulation metal component includes a first metal part to which the heating element is mounted, a second metal part having a portion exposed from the sealing component, and an insulation part interposed between the first metal part and the second metal part. The second metal part has a central part and a peripheral part having a thickness thinner than that of the central part. The second metal part has one surface opposing and in tight contact with the insulation part, and an exposed surface opposite from the sealing component within an area corresponding to the central part. The second metal part has a recess recessed from a virtual straight line that connects an end of the one surface to an end of the exposed surface at a shortest distance around the central part.
    Type: Application
    Filed: February 8, 2016
    Publication date: August 10, 2017
    Inventor: Shinji HIRAMITSU
  • Publication number: 20170135210
    Abstract: A manufacturing method of an electronic device, including: a circuit board with a substrate through hole; a circuit element; and a resin mold with a mold through hole, using a first mold, a second mold having a cavity, and a pressing member protruding from a bottom of the cavity includes: fixing the circuit board to the first mold; fixing the second mold to the first mold to cover an opening of the substrate through hole by the pressing member; and forming the resin mold while covering the circuit element with the constituent material in the cavity. The circuit board is deformed by press-contacting the pressing member to the circuit board in a state where a part of the pressing member is inserted into the substrate through hole so that an opening area of the substrate through hole decreases toward a reverse surface from the one surface.
    Type: Application
    Filed: September 14, 2015
    Publication date: May 11, 2017
    Inventors: Tetsuto YAMAGISHI, Masayuki TAKENAKA, Toshihiro NAGAYA, Shinji HIRAMITSU
  • Publication number: 20160255714
    Abstract: A power converter includes: a circuit board having an insulating substrate and a plurality of wirings in the insulating substrate; and first and second switching elements on a first surface of the circuit board that are connected in series. The first switching element has first and second electrodes. The second switching element has a third electrode and a fourth electrode. The circuit board has a first wiring connected to the first electrode, a second wiring connected to the second and third electrodes, a third wiring connected to the fourth electrode, a fourth wiring as an output wiring connected to the third electrode, and a fifth wiring connected to the third wiring. The first, second, third and fourth wirings are arranged in order on the first surface, and the fifth wiring on a second surface opposite to the first surface is opposed to the first, second, and third wirings.
    Type: Application
    Filed: February 17, 2016
    Publication date: September 1, 2016
    Inventor: Shinji HIRAMITSU
  • Publication number: 20160095264
    Abstract: A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and conductive plates, wherein the module case includes a heat-radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening that is closed by the heat-radiation member, and wherein a heat-radiation fin unit having a plurality of heat-radiation fins vertically arranged thereon is provided at a center of the heat-radiation member, and a joint portion with the frame body is provided at an peripheral edge of the heat-radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body has a higher rigidity than that of the heat-radiation member.
    Type: Application
    Filed: December 8, 2015
    Publication date: March 31, 2016
    Inventors: Yujiro KANEKO, Tokihito SUWA, Shinji HIRAMITSU, Takahiro SHIMURA
  • Patent number: 9241429
    Abstract: A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and conductive plates, wherein the module case includes a heat-radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening that is closed by the heat-radiation member, and wherein a heat-radiation fin unit having a plurality of heat-radiation fins vertically arranged thereon is provided at a center of the heat-radiation member, and a joint portion with the frame body is provided at an peripheral edge of the heat-radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body has a higher rigidity than that of the heat-radiation member.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: January 19, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yujiro Kaneko, Tokihito Suwa, Shinji Hiramitsu, Takahiro Shimura
  • Patent number: 9000582
    Abstract: A power semiconductor module includes: a circuit body having a power semiconductor element and a conductor member connected to the power semiconductor element; a case in which the circuit body is housed; and a connecting member which connects the circuit body and the case. The case includes: a first heat dissipating member and a second heat dissipating member which are disposed in opposed relation to each other while interposing the circuit body in between; a side wall which joins the first heat dissipating member and the second heat dissipating member; and an intermediate member which is formed on the periphery of the first heat dissipating member and connected to the side wall, the intermediate member including a curvature that is projected toward a housing space of the case.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: April 7, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Shinji Hiramitsu, Atsushi Koshizaka, Masato Higuma, Hiroshi Tokuda, Keiji Kawahara
  • Patent number: 8847374
    Abstract: A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by way of a second solder material on the other main surface of the power semiconductor element. A first protrusion section protruding from the base section of the applicable first conductor plate and including a first protrusion surface formed over the upper side, is formed over the first conductor plate. A second protrusion section including a second protrusion surface formed facing opposite one of the main surfaces of the power semiconductor element. The first solder material is interposed between the power semiconductor element and the first conductor plate while avoiding the plural control electrodes.
    Type: Grant
    Filed: September 5, 2011
    Date of Patent: September 30, 2014
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Eiichi Ide, Shinji Hiramitsu, Hiroshi Hozoji, Nobutake Tsuyuno, Kinya Nakatsu, Takeshi Tokuyama, Akira Matsushita, Yusuke Takagi
  • Publication number: 20140098588
    Abstract: A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and conductive plates, wherein the module case includes a heat-radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening that is closed by the heat-radiation member, and wherein a heat-radiation fin unit having a plurality of heat-radiation fins vertically arranged thereon is provided at a center of the heat-radiation member, and a joint portion with the frame body is provided at an peripheral edge of the heat-radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body has a higher rigidity than that of the heat-radiation member.
    Type: Application
    Filed: May 22, 2012
    Publication date: April 10, 2014
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Yujiro Kaneko, Tokihito Suwa, Shinji Hiramitsu, Takahiro Shimura
  • Patent number: 8659130
    Abstract: A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: February 25, 2014
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yusuke Takagi, Kaoru Uchiyama, Tokihito Suwa, Kinya Nakatsu, Takeshi Tokuyama, Shinji Hiramitsu
  • Publication number: 20130328185
    Abstract: A power semiconductor module includes: a circuit body having a power semiconductor element and a conductor member connected to the power semiconductor element; a case in which the circuit body is housed; and a connecting member which connects the circuit body and the case. The case includes: a first heat dissipating member and a second heat dissipating member which are disposed in opposed relation to each other while interposing the circuit body in between; a side wall which joins the first heat dissipating member and the second heat dissipating member; and an intermediate member which is formed on the periphery of the first heat dissipating member and connected to the side wall, the intermediate member including a curvature that is projected toward a housing space of the case.
    Type: Application
    Filed: February 21, 2012
    Publication date: December 12, 2013
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Shinji Hiramitsu, Atsushi Koshizawa, Masato Higuma, Hiroshi Tokuda, Keiji Kawahara
  • Publication number: 20130175678
    Abstract: A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by way of a second solder material on the other main surface of the power semiconductor element. A first protrusion section protruding from the base section of the applicable first conductor plate and including a first protrusion surface formed over the upper side, is formed over the first conductor plate. A second protrusion section including a second protrusion surface formed facing opposite one of the main surfaces of the power semiconductor element. The first solder material is interposed between the power semiconductor element and the first conductor plate while avoiding the plural control electrodes.
    Type: Application
    Filed: September 5, 2011
    Publication date: July 11, 2013
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Eiichi Ide, Shinji Hiramitsu, Hiroshi Hozoji, Nobutake Tsuyuno, Kinya Nakatsu, Takeshi Tokuyama, Akira Matsushita, Yusuke Takagi