Abstract: An object of the present invention is to provide a compound that has a specific chemical structure having an activation effect on SIRT6 and is useful as an active component for preventing and treating inflammatory diseases, and the present invention relates to a compound represented by Formula (1) or a pharmaceutically acceptable salt thereof, where each symbol in Formula (1) has the same definition as that described in the specification.

Abstract: According to one embodiment, a semiconductor storage device includes a plurality of electrode films on a substrate, spaced from one another in a first direction. A charge storage film is provided on a side face the electrode films via a first insulating film. A semiconductor film is provided on a side face of the charge storage film via a second insulating film. The charge storage film includes a plurality of insulator regions contacting the first insulating film, a plurality of semiconductor or conductor regions provided between the insulator regions and another insulator region.

Abstract: A polycarbonate polyol represented by the following Formula (A-1): [in Formula (A-1), R1 represents a hydrogen atom, an alkyl group or a hydroxyalkyl group, R2 represents an alkanediyl group, n and m each represent an integer of 1 or more; and a plurality of R2's may be the same as or different from each other].

Abstract: Provided is a liquid crystal display device capable of switching between a transparent state and a scattering state, reducing or preventing a decrease in transmittance in the transparent state, and reducing or preventing a decrease in luminance in the panel central portion in the scattering state. The liquid crystal display device includes, sequentially from its viewing surface side toward its back surface side: a first liquid crystal panel; a light source; and a second liquid crystal panel, the first liquid crystal panel including a polymer dispersed liquid crystal containing a polymer network and liquid crystal components, the light source being configured to irradiate a back surface side main surface of the first liquid crystal panel with light from an oblique direction.

Abstract: Substrates can be suppressed from being separated from supporting grooves. A substrate processing apparatus includes a substrate holding unit and a processing tub. The substrate holding unit is configured to hold multiple substrates. The processing tub is configured to store a processing liquid therein. The substrate holding unit comprises a supporting body, an elevating device and a restriction unit. The supporting body has multiple supporting grooves and is configured to support the multiple substrates with a vertically standing posture from below in the multiple supporting grooves, respectively. The elevating device is configured to move the supporting body between a standby position above the processing tub and a processing position within the processing tub. The restriction unit is configured to be moved up and down along with the supporting body by the elevating device and configured to restrict an upward movement of the substrates with respect to the supporting body.

Abstract: To provide a light emitting diode package of which the height of protrusion of a thermal via is decreased without decreasing the flexural strength of an insulating substrate. A light emitting diode package comprising a light emitting diode element mounted on a substrate, wherein the substrate is obtained by firing a glass ceramic composition containing a powder of glass containing, as represented by mole percentage, from 57 to 65% of SiO2, from 13 to 18% of B2O3, from 9 to 23% of CaO, from 3 to 8% of Al2O3 and from 0.5 to 6% of at least one of K2O and Na2O in total, and a ceramic filler.

Abstract: To provide a glass containing little B2O3, whereby when its powder is fired, its thermal expansion curve does not have an inflection point, a non-lead glass is provided containing, as represented by mol % based on the following oxides, from 35 to 41.5% of SiO2, from 8 to 25% of MgO, more than 27 to 35% of CaO, from 0 to 2% of SrO, from 0 to 4% of BaO, from 5 to 15% of ZnO and from 4.5 to 10% of Al2O3, wherein the total content of these components is at least 97%, and when SrO and BaO are contained, the total content of SrO and BaO is at most 2%; as well as a non-lead glass containing, as represented by mol % based on the following oxides, from 39.5 to 41.5% of SiO2, from 10 to less than 13% of MgO, from 18 to 22% of CaO, more than 12 to 15% of SrO, from 0 to 1% of BaO, from 6 to 11% of ZnO and from 4.5 to 7% of Al2O3, wherein the total content of these components is at least 97%.

Abstract: To provide a light emitting diode package of which the height of protrusion of a thermal via is decreased without decreasing the flexural strength of an insulating substrate. A light emitting diode package comprising a light emitting diode element mounted on a substrate, wherein the substrate is obtained by firing a glass ceramic composition containing a powder of glass containing, as represented by mole percentage, from 57 to 65% of SiO2, from 13 to 18% of B2O3, from 9 to 23% of CaO, from 3 to 8% of Al2O3 and from 0.5 to 6% of at least one of K2O and Na2O in total, and a ceramic filler.

Abstract: To provide a glass containing little B2O3, whereby when its powder is fired, its thermal expansion curve does not have an inflection point. Non-lead glass comprising, as represented by mol % based on the following oxides, from 35 to 41.5% of SiO2, from 8 to 25% of MgO, more than 27 to 35% of CaO, from 0 to 2% of SrO, from 0 to 4% of BaO, from 5 to 15% of ZnO and from 4.5 to 10% of Al2O3, wherein the total content of these components is at least 97%, and when SrO and BaO are contained, the total content of SrO and BaO is at most 2%. Non-lead glass comprising, as represented by mol % based on the following oxides, from 39.5 to 41.5% of SiO2, from 10 to less than 13% of MgO, from 18 to 22% of CaO, more than 12 to 15% of SrO, from 0 to 1% of BaO, from 6 to 11% of ZnO and from 4.5 to 7% of Al2O3, wherein the total content of these components is at least 97%.

Abstract: An integrated circuit package is mounted on a socket pedestal. External terminals such as ball electrodes may be provided in an array on a mounting surface. Recessed sections can also be provided in the mounting surface in a peripheral section of a region where the external terminals are arranged. The recessed sections can be used for positioning. When the integrated circuit package is subject to an electrical characteristic test (or a burn-in test), the recessed sections can be coupled to protrusions provided on a side of a socket and positioned. As a result, the external terminals can be securely and accurately connected to socket terminals. Thus, integrated circuit packages are provided which have arrayed electrodes for face-down mounting, and which improves the connection accuracy with respect to a socket for conducting electrical characteristic tests.

Abstract: An integrated circuit package is mounted on a socket pedestal. External terminals such as ball electrodes may be provided in an array on a mounting surface. Recessed sections can also be provided in the mounting surface in a peripheral section of a region where the external terminals are arranged. The recessed sections can be used for positioning. When the integrated circuit package is subject to an electrical characteristic test (or a burn-in test), the recessed sections can be coupled to protrusions provided on a side of a socket and positioned. As a result, the external terminals can be securely and accurately connected to socket terminals. Thus, integrated circuit packages are provided which have arrayed electrodes for face-down mounting, and which improves the connection accuracy with respect to a socket for conducting electrical characteristic tests.