Patents by Inventor Shinji Hoshino

Shinji Hoshino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240034477
    Abstract: In an aircraft that flies utilizing power generated by an engine or power charged in a battery, a temperature control system includes a battery that stores power for starting the engine and flying, a temperature adjusting apparatus for warming or cooling the battery by each of at least the power charged in the battery and power feeding from an external power source, and a control section for detecting presence or absence of the power feeding, and if the power feeding is present, controlling the apparatus to warm or cool the battery using the power feeding, and if the power feeding is absent, controlling the apparatus to warm or cool the battery using charged power of the battery. Even if the power feeding has been lost, it is possible to maintain a temperature and a state of charge of the battery enabling the engine to start and fly.
    Type: Application
    Filed: March 20, 2023
    Publication date: February 1, 2024
    Inventors: Masashi ETO, Akinori KITA, Shinji HOSHINO, Koji HOSONO
  • Patent number: 11835889
    Abstract: An image forming apparatus includes: a colorant image former; an image holder configured to hold a colorant image formed by the colorant image former and to be rotationally driven; a transfer member configured to transfer the colorant image onto a recording medium, which is transported from an upstream side, by sandwiching the recording medium between the transfer member and the image holder, and rotationally driving the transfer member to transport the recording medium to a downstream side; and a contact-and-separation mechanism configured to relatively contact or separate the image holder and the transfer member, in which, in response to an abnormality being detected, the image forming apparatus operates in a mode in which the contact-and-separation mechanism relatively separates the image holder and the transfer member, and then rotational driving of the transfer member is stopped after rotational driving of the image holder is stopped.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: December 5, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Yoko Miyamoto, Takashi Hoshino, Shinji Okuyama, Tomoaki Yoshioka, Toshiaki Baba, Chihiro Iijima
  • Patent number: 11772343
    Abstract: The invention relates to a functionalized laminated optical element comprising: —An optical base element; —A functional film structure consisting of a single layer or a multilayer structure; —A layer of a pressure-sensitive adhesive of optical quality, placed between one surface of the optical base element and the functional film structure so as to permanently retain said functional film structure on the surface of the optical base element. Said functionalized laminated optical element maintains its integrity after typical processing of an optical article which includes wheel edging. More particularly the invention relates to the use of a specific adhesive system for improving the wheel edging resistance of functionalized laminated optical element. The functional laminated optical may be an ophthalmic lens.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: October 3, 2023
    Assignee: Essilor International
    Inventors: Violaine Coue, Catherine Berger, Manuela Desousa, Tatsuya Suzuki, Katsuhiko Kamiya, Kiyoe Shigetomi, Shinji Hoshino, Junichi Nakayama
  • Patent number: 11739498
    Abstract: A work vehicle includes: a cab to be boarded by an operator, the cab including a roof; and a first antenna mounted on the roof. The first antenna is positioned selectively at one of a position lower than a topmost portion of the roof, and a position protruding upward relative to the topmost portion of the roof.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: August 29, 2023
    Assignee: KOMATSU LTD.
    Inventors: Masashi Hoshino, Atsushi Karami, Hirofumi Kotaki, Shinji Hirose, Masamichi Miyazaki
  • Patent number: 11676757
    Abstract: An insulating layer, which is composed of a material having a higher insulating property than a core, partially covers a surface of the core. A plating layer, which functions as an electrode, is stacked on a surface of the insulating layer. The surface area of the insulating layer is larger than the surface area of the plating layer and the plating layer is stacked inside a region covered by the insulating layer.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: June 13, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shinji Otani, Yuuta Hoshino, Toshihiko Kobayashi, Tomotaka Gotohda
  • Publication number: 20230178107
    Abstract: Provided are a magnetic tape including a non-magnetic support and a magnetic layer including a ferromagnetic powder, a magnetic tape cartridge and a magnetic tape apparatus including this magnetic tape. An amount of a fluid lubricant collected by wiping a surface of the magnetic layer by a nonwoven fabric is in a range of 5 to 400 ng/m2 as a value per unit area of the surface of the magnetic layer.
    Type: Application
    Filed: January 30, 2023
    Publication date: June 8, 2023
    Applicant: FUJIFILM Corporation
    Inventors: Shinji TSUJIMOTO, Shunichi HOSHINO, Yoshihiro SAWAYASHIKI
  • Publication number: 20210402738
    Abstract: The present invention provides a sheet having an elastomer layer having a Shore A hardness of less than 40, wherein the elastomer layer has an adhesion force to stainless steel of not more than 11 oz/in at 90 degree peel strength.
    Type: Application
    Filed: September 13, 2021
    Publication date: December 30, 2021
    Applicants: Nitto Denko Corporation, NITTO, INC.
    Inventors: Derek JORGENSEN, Shinji HOSHINO, Yu-chu CHEN, Masatoshi SUZUKI
  • Patent number: 10836937
    Abstract: Provided is a PSA composition for forming a PSA comprising a (meth)acrylic polymer, comprising, as monomeric components constituting the (meth)acrylic polymer: (A) a C2-18 alkyl (meth)acrylate, (B) an alicyclic monomer, and (C) a monomer having at least either a hydroxyl group or a carboxyl group. The average number of carbons of alkyl group in the (A) is 8 or less. The monomeric components comprise the (C) at 3% by weight or greater while the weights Wb and Wc of the (B) and (C) satisfy a relationship 0.8?Wb/Wc.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: November 17, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Tatsuya Suzuki, Katsuhiko Kamiya, Kiyoe Shigetomi, Shinji Hoshino
  • Publication number: 20200290312
    Abstract: The present invention provides a sheet having an elastomer layer having a Shore A hardness of less than 40, wherein the elastomer layer has an adhesion force to stainless steel of not more than 11 oz/in at 90 degree peel strength.
    Type: Application
    Filed: April 1, 2020
    Publication date: September 17, 2020
    Applicants: Nitto Denko Corporation, NITTO, INC.
    Inventors: Derek JORGENSEN, Shinji HOSHINO, Yu-chu CHEN, Masatoshi SUZUKI
  • Publication number: 20190111641
    Abstract: The invention relates to a functionalized laminated optical element comprising: —An optical base element; —A functional film structure consisting of a single layer or a multilayer structure; —A layer of a pressure-sensitive adhesive of optical quality, placed between one surface of the optical base element and the functional film structure so as to permanently retain said functional film structure on the surface of the optical base element. Said functionalized laminated optical element maintains its integrity after typical processing of an optical article which includes wheel edging. More particularly the invention relates to the use of a specific adhesive system for improving the wheel edging resistance of functionalized laminated optical element. The functional laminated optical may be an ophthalmic lens.
    Type: Application
    Filed: March 29, 2016
    Publication date: April 18, 2019
    Inventors: Violaine COUE, Catherine BERGER, Manuela DESOUSA, Tatsuya SUZUKI, Katsuhiko KAMIYA, Kiyoe SHIGETOMI, Shinji HOSHINO, Junichi NAKAYAMA
  • Publication number: 20180093451
    Abstract: The present invention provides a sheet having an elastomer layer having a Shore A hardness of less than 40, wherein the elastomer layer has an adhesion force to stainless steel of not more than 11 oz/in at 90 degree peel strength.
    Type: Application
    Filed: April 7, 2016
    Publication date: April 5, 2018
    Applicants: Nitto Denko Corporation, NITTO, INC.
    Inventors: Derek JORGENSEN, Shinji HOSHINO, Yu-chu CHEN, Masatoshi SUZUKI
  • Publication number: 20160369136
    Abstract: Provided is a PSA composition for forming a PSA comprising a (meth)acrylic polymer, comprising, as monomeric components constituting the (meth)acrylic polymer: (A) a C2-18 alkyl (meth)acrylate, (B) an alicyclic monomer, and (C) a monomer having at least either a hydroxyl group or a carboxyl group. The average number of carbons of alkyl group in the (A) is 8 or less. The monomeric components comprise the (C) at 3% by weight or greater while the weights Wb and Wc of the (B) and (C) satisfy a relationship 0.8?Wb/Wc.
    Type: Application
    Filed: June 14, 2016
    Publication date: December 22, 2016
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tatsuya SUZUKI, Katsuhiko KAMIYA, Kiyoe SHIGETOMI, Shinji HOSHINO
  • Patent number: 8540337
    Abstract: A disclosed image forming apparatus is capable of solving the problems of deterioration of a foam application function and driving systems caused by the dried and fixed foam remaining without being applied. The image forming apparatus includes a foam forming section forming foam, a reservoir section supplying foam formed by the foam forming section to an application roller, a discharge channel through which extra foam is collected from the reservoir section, and a heating unit for heating the extra foam to return the extra foam to a liquid form. The discharged liquid prepared by defoaming the foam discharged through the discharge channel is returned to a container containing the defoamed liquid.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: September 24, 2013
    Assignee: Ricoh Company
    Inventors: Shinji Imoto, Kazuyoshi Matsumoto, Minori Ichimura, Manabu Izumikawa, Yasuhisa Kato, Yasuo Katano, Seiji Hoshino, Masaaki Tsuda
  • Publication number: 20130240141
    Abstract: The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame.
    Type: Application
    Filed: March 13, 2012
    Publication date: September 19, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuki SOEJIMA, Shinji HOSHINO, Takamasa HIRAYAMA, Kazuyuki KIUCHI
  • Publication number: 20130237017
    Abstract: The present invention provides a pressure-sensitive adhesive tape for resin encapsulation in production of a resin encapsulation type semiconductor device, which includes a base material layer which does not have a glass transition temperature in a temperature region of 260° C. or lower and a pressure-sensitive adhesive layer laminated on the base material layer, and a method for producing a resin encapsulation type semiconductor device using the pressure-sensitive adhesive tape. The pressure-sensitive adhesive tape according to the present invention highly prevents resin leakage even under severe conditions as in MAP-QFN production process, does not affect certainty of wire bonding and has excellent peelability after resin encapsulation.
    Type: Application
    Filed: March 8, 2012
    Publication date: September 12, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hiroyuki KONDO, Shinji HOSHINO, Yukio ARIMITSU, Akinori NISHIO
  • Patent number: 8502397
    Abstract: The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: August 6, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Yuichiro Yanagi, Kazuyuki Kiuchi, Shinji Hoshino
  • Patent number: 8436481
    Abstract: The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: May 7, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Shinji Hoshino, Yukio Arimitsu, Kazuyuki Kiuchi, Akihisa Murata
  • Publication number: 20130020031
    Abstract: A workpiece composed of a glass plate and a display panel joined to each other via an adhesive sheet is suction-held on both surfaces thereof by a pair of upper and lower holding members. The glass plate is detached from the display panel through swinging downward one end of the lower holding member around a support shaft provided on the other end side thereof with an entire surface of the glass plate being held in a planar state with a suction surface of the lower holding member.
    Type: Application
    Filed: July 19, 2012
    Publication date: January 24, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Masato FUJITA, Shinji Hoshino, Takahiro Nonaka
  • Publication number: 20130005928
    Abstract: The present invention provides an optical double-sided pressure-sensitive adhesive sheet excellent in reworkability, step absorbability and anti-foaming release property. The invention relates to an optical double-sided pressure-sensitive adhesive sheet including an acrylic pressure-sensitive adhesive layer which contains an acrylic polymer (X), wherein: the acrylic polymer (X) is formed from a monomer component including an alkyl(meth)acrylate having a linear or branched alkyl group having 1 to 14 carbon atoms in an amount of 50 to 100 wt % based on a total amount of the monomer component (100 wt %) forming the acrylic polymer (X), and a content of a polar group-containing monomer is 0 to 15.0 wt % based on the total amount thereof; and a gel fraction of the acrylic pressure-sensitive adhesive layer is from 20 to 74 wt %.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 3, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinji HOSHINO, Masato FUJITA, Takahiro NONAKA
  • Publication number: 20110151625
    Abstract: The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 23, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinji HOSHINO, Yukio ARIMITSU, Kazuyuki KIUCHI, Akihisa MURATA