Abstract: In an aircraft that flies utilizing power generated by an engine or power charged in a battery, a temperature control system includes a battery that stores power for starting the engine and flying, a temperature adjusting apparatus for warming or cooling the battery by each of at least the power charged in the battery and power feeding from an external power source, and a control section for detecting presence or absence of the power feeding, and if the power feeding is present, controlling the apparatus to warm or cool the battery using the power feeding, and if the power feeding is absent, controlling the apparatus to warm or cool the battery using charged power of the battery. Even if the power feeding has been lost, it is possible to maintain a temperature and a state of charge of the battery enabling the engine to start and fly.

Abstract: The invention relates to a functionalized laminated optical element comprising: —An optical base element; —A functional film structure consisting of a single layer or a multilayer structure; —A layer of a pressure-sensitive adhesive of optical quality, placed between one surface of the optical base element and the functional film structure so as to permanently retain said functional film structure on the surface of the optical base element. Said functionalized laminated optical element maintains its integrity after typical processing of an optical article which includes wheel edging. More particularly the invention relates to the use of a specific adhesive system for improving the wheel edging resistance of functionalized laminated optical element. The functional laminated optical may be an ophthalmic lens.

Abstract: The present invention provides a sheet having an elastomer layer having a Shore A hardness of less than 40, wherein the elastomer layer has an adhesion force to stainless steel of not more than 11 oz/in at 90 degree peel strength.

Abstract: Provided is a PSA composition for forming a PSA comprising a (meth)acrylic polymer, comprising, as monomeric components constituting the (meth)acrylic polymer: (A) a C2-18 alkyl (meth)acrylate, (B) an alicyclic monomer, and (C) a monomer having at least either a hydroxyl group or a carboxyl group. The average number of carbons of alkyl group in the (A) is 8 or less. The monomeric components comprise the (C) at 3% by weight or greater while the weights Wb and Wc of the (B) and (C) satisfy a relationship 0.8?Wb/Wc.

Abstract: The present invention provides a sheet having an elastomer layer having a Shore A hardness of less than 40, wherein the elastomer layer has an adhesion force to stainless steel of not more than 11 oz/in at 90 degree peel strength.

Abstract: The invention relates to a functionalized laminated optical element comprising: —An optical base element; —A functional film structure consisting of a single layer or a multilayer structure; —A layer of a pressure-sensitive adhesive of optical quality, placed between one surface of the optical base element and the functional film structure so as to permanently retain said functional film structure on the surface of the optical base element. Said functionalized laminated optical element maintains its integrity after typical processing of an optical article which includes wheel edging. More particularly the invention relates to the use of a specific adhesive system for improving the wheel edging resistance of functionalized laminated optical element. The functional laminated optical may be an ophthalmic lens.

Abstract: The present invention provides a sheet having an elastomer layer having a Shore A hardness of less than 40, wherein the elastomer layer has an adhesion force to stainless steel of not more than 11 oz/in at 90 degree peel strength.

Abstract: Provided is a PSA composition for forming a PSA comprising a (meth)acrylic polymer, comprising, as monomeric components constituting the (meth)acrylic polymer: (A) a C2-18 alkyl (meth)acrylate, (B) an alicyclic monomer, and (C) a monomer having at least either a hydroxyl group or a carboxyl group. The average number of carbons of alkyl group in the (A) is 8 or less. The monomeric components comprise the (C) at 3% by weight or greater while the weights Wb and Wc of the (B) and (C) satisfy a relationship 0.8?Wb/Wc.

Abstract: The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame.

Abstract: The present invention provides a pressure-sensitive adhesive tape for resin encapsulation in production of a resin encapsulation type semiconductor device, which includes a base material layer which does not have a glass transition temperature in a temperature region of 260° C. or lower and a pressure-sensitive adhesive layer laminated on the base material layer, and a method for producing a resin encapsulation type semiconductor device using the pressure-sensitive adhesive tape. The pressure-sensitive adhesive tape according to the present invention highly prevents resin leakage even under severe conditions as in MAP-QFN production process, does not affect certainty of wire bonding and has excellent peelability after resin encapsulation.

Abstract: The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %.

Abstract: The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step.

Abstract: A workpiece composed of a glass plate and a display panel joined to each other via an adhesive sheet is suction-held on both surfaces thereof by a pair of upper and lower holding members. The glass plate is detached from the display panel through swinging downward one end of the lower holding member around a support shaft provided on the other end side thereof with an entire surface of the glass plate being held in a planar state with a suction surface of the lower holding member.

Abstract: The present invention provides an optical double-sided pressure-sensitive adhesive sheet excellent in reworkability, step absorbability and anti-foaming release property. The invention relates to an optical double-sided pressure-sensitive adhesive sheet including an acrylic pressure-sensitive adhesive layer which contains an acrylic polymer (X), wherein: the acrylic polymer (X) is formed from a monomer component including an alkyl(meth)acrylate having a linear or branched alkyl group having 1 to 14 carbon atoms in an amount of 50 to 100 wt % based on a total amount of the monomer component (100 wt %) forming the acrylic polymer (X), and a content of a polar group-containing monomer is 0 to 15.0 wt % based on the total amount thereof; and a gel fraction of the acrylic pressure-sensitive adhesive layer is from 20 to 74 wt %.

Abstract: The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step.

Abstract: The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %.

Abstract: An adhesive tape for resin-encapsulating used in a method of manufacture of a resin-encapsulated semiconductor device has a base material layer and an adhesive agent layer laminated on the base material layer, a total film thickness of the base material layer and the adhesive agent layer of 25 to 40 ?m. According to the adhesive tape for resin encapsulating of the present invention, resin leakage can be efficiently prevented during the resin encapsulating operation.

Abstract: A tip dresser 1 dresses electrode tips 4, 5. The tip dresser 1 is rotated around a rotation axis and includes a holder 2 configured to be rotated around a rotation axis and to have concave tapers 2c, 2d, which make the rotation axis a center, on both faces of the holder 2; and a cutter 3 configured to be fixed to the holder 2 and to be protruded to sides of the electrode tips 4, 5 from the tapers 2c, 2d only at portions of the cutter 3 more inside than outer diameters D1, D2 of the electrode tips 4, 5.

Abstract: A tip dresser 1 dresses electrode tips 4, 5. The tip dresser 1 is rotated around a rotation axis and includes a holder 2 configured to be rotated around a rotation axis and to have concave tapers 2c, 2d, which make the rotation axis a center, on both faces of the holder 2; and a cutter 3 configured to be fixed to the holder 2 and to be protruded to sides of the electrode tips 4, 5 from the tapers 2c, 2d only at portions of the cutter 3 more inside than outer diameters D1, D2 of the electrode tips 4, 5.

Abstract: In order to prevent an electrode tip 8 from being burred during dressing process, thereby attaining high quality and stability of the electrode tip, a tip dresser features a screw-threaded circumference 5 formed around the rotatable cutter holder 1 for securing a one- or two-piece formed cutter element 2, for permitting the holder 1 to be rotated in one direction A manually or by a suitable driver. Frusto-conical recesses are symmetrically formed in both sides of the holder 1 for receiving the electrode tips, allowing the cutter element 2 to be mounted so as to slightly extend by a predetermined amount beyond the conically recessed surface.