Abstract: There are provided an electronic element mounting board and an electronic device capable of suppressing transmission of incident light to an electronic device through a circumferential edge part of an opening of a board and thus of reducing a noise level in receiving an image. An electronic element mounting board includes an insulating substrate. The insulating substrate has an opening and a lower surface, and an electronic element is disposed on the lower surface so as to overlap the opening in a plan view. A circumferential edge part of the opening of the insulating substrate has a porosity lower than a porosity of a portion outside the circumferential edge part. Since it is possible to suppress transmission of incident light to the electronic element through the circumferential edge part, it is possible to reduce a noise level in receiving an image in the electronic element.

Abstract: An imaging element mounting substrate includes: an insulating base comprising insulating layers, the insulating base surface comprising an opening which is located at a center thereof; a connection electrode disposed at a lower surface of the insulating base around the opening; and light-transmission control layers between the insulating layers, and comprising inner edges located on an outside of the opening. An inner edge of one light-transmission control layer lies closer to the opening than an inner edge of another light-transmission control layer as seen in a transparent plan view, and the insulating base has, in an inner periphery of the opening of an insulating layer constituting a lower surface of the insulating base, an inclined portion which is inclined such that the opening becomes smaller in size from the lower surface as approaching an upper surface of the insulating base.

Abstract: An imaging element mounting substrate includes: an insulating base comprising insulating layers, the insulating base surface comprising an opening which is located at a center thereof; a connection electrode disposed at a lower surface of the insulating base around the opening; and light-transmission control layers between the insulating layers, and comprising inner edges located on an outside of the opening. An inner edge of one light-transmission control layer lies closer to the opening than an inner edge of another light-transmission control layer as seen in a transparent plan view, and the insulating base has, in an inner periphery of the opening of an insulating layer constituting a lower surface of the insulating base, an inclined portion which is inclined such that the opening becomes smaller in size from the lower surface as approaching an upper surface of the insulating base.

Abstract: There are provided an electronic element mounting board and an electronic device capable of suppressing transmission of incident light to an electronic device through a circumferential edge part of an opening of a board and thus of reducing a noise level in receiving an image. An electronic element mounting board includes an insulating substrate. The insulating substrate has an opening and a lower surface, and an electronic element is disposed on the lower surface so as to overlap the opening in a plan view. A circumferential edge part of the opening of the insulating substrate has a porosity lower than a porosity of a portion outside the circumferential edge part. Since it is possible to suppress transmission of incident light to the electronic element through the circumferential edge part, it is possible to reduce a noise level in receiving an image in the electronic element.

Abstract: A image pickup device includes a wiring substrate and an image pickup device. A wiring substrate includes an insulating substrate and a plurality of connection electrodes. The insulating substrate has a penetrating hole, and has an inclined area where its lower surface is inclined downward toward the opening. The plurality of connection electrodes are disposed in a surrounding region around the penetrating hole on the lower surface of the insulating substrate, and are to be electrically connected to an image sensor. The image pickup device is mounted on the lower surface of the insulating substrate of the wiring substrate, and is electrically connected to the plurality of connection electrodes.