Abstract: A superconducting wire connector includes superconducting wires and a sintered body containing MgB2. The superconducting wires are connected by the sintered body. At least one of the superconducting wires includes a superconducting core having a first outer surface. The sintered body is in contact with the first outer surface. A method of connecting superconducting wires by a sintered body containing MgB2 includes exposing a superconducting core of at least one of the superconducting wires by removing a portion, positioned in the middle in a longitudinal direction of the at least one of the superconducting wires, of a metal sheath disposed around the superconducting core, disposing the at least one of the superconducting wires through a container, filling the container with a raw material of MgB2, and forming the sintered body being in contact with an outer surface of the superconducting core by sintering the raw material filled in the container.

Abstract: A spacecraft includes: a main-reflection unit configured to reflect and emit a radio wave outside, a sub-reflection unit configured to face the main-reflection unit, a radiator arranged to face the sub-reflection unit and configured to radiate the radio wave in a direction of the sub-reflection unit, a main body configured to be able to accommodate at least one part of the sub-reflection unit therein, and a delivery device connected to the sub-reflection unit and configured to deliver the sub-reflection unit, at least one part of which is accommodated in the main body, to a position where the sub-reflection unit is able to reflect the radio wave radiated from the radiator to the main-reflection unit and cause the main-reflection unit to radiate the radio wave outside.

Abstract: Spacecraft and antenna apparatus that can be more easily deployed from a stored state can include: a main-reflection unit including a plurality of ribs formed to be deployable in a stored state in which the ribs are folded and a sheet body provided between a plurality of the ribs and configured to be capable of reflecting a radio wave radiated from a radiator and emitting the radio wave outside, and a restriction member configured to restrict deployment of the plurality of ribs in the stored state, and release the restriction by operation of a restriction release member different from the main-reflection unit.

Abstract: There are provided an electronic element mounting board and an electronic device capable of suppressing transmission of incident light to an electronic device through a circumferential edge part of an opening of a board and thus of reducing a noise level in receiving an image. An electronic element mounting board includes an insulating substrate. The insulating substrate has an opening and a lower surface, and an electronic element is disposed on the lower surface so as to overlap the opening in a plan view. A circumferential edge part of the opening of the insulating substrate has a porosity lower than a porosity of a portion outside the circumferential edge part. Since it is possible to suppress transmission of incident light to the electronic element through the circumferential edge part, it is possible to reduce a noise level in receiving an image in the electronic element.

Abstract: An imaging element mounting substrate includes: an insulating base comprising insulating layers, the insulating base surface comprising an opening which is located at a center thereof; a connection electrode disposed at a lower surface of the insulating base around the opening; and light-transmission control layers between the insulating layers, and comprising inner edges located on an outside of the opening. An inner edge of one light-transmission control layer lies closer to the opening than an inner edge of another light-transmission control layer as seen in a transparent plan view, and the insulating base has, in an inner periphery of the opening of an insulating layer constituting a lower surface of the insulating base, an inclined portion which is inclined such that the opening becomes smaller in size from the lower surface as approaching an upper surface of the insulating base.

Abstract: An imaging element mounting substrate includes: an insulating base comprising insulating layers, the insulating base surface comprising an opening which is located at a center thereof; a connection electrode disposed at a lower surface of the insulating base around the opening; and light-transmission control layers between the insulating layers, and comprising inner edges located on an outside of the opening. An inner edge of one light-transmission control layer lies closer to the opening than an inner edge of another light-transmission control layer as seen in a transparent plan view, and the insulating base has, in an inner periphery of the opening of an insulating layer constituting a lower surface of the insulating base, an inclined portion which is inclined such that the opening becomes smaller in size from the lower surface as approaching an upper surface of the insulating base.

Abstract: There are provided an electronic element mounting board and an electronic device capable of suppressing transmission of incident light to an electronic device through a circumferential edge part of an opening of a board and thus of reducing a noise level in receiving an image. An electronic element mounting board includes an insulating substrate. The insulating substrate has an opening and a lower surface, and an electronic element is disposed on the lower surface so as to overlap the opening in a plan view. A circumferential edge part of the opening of the insulating substrate has a porosity lower than a porosity of a portion outside the circumferential edge part. Since it is possible to suppress transmission of incident light to the electronic element through the circumferential edge part, it is possible to reduce a noise level in receiving an image in the electronic element.

Abstract: A image pickup device includes a wiring substrate and an image pickup device. A wiring substrate includes an insulating substrate and a plurality of connection electrodes. The insulating substrate has a penetrating hole, and has an inclined area where its lower surface is inclined downward toward the opening. The plurality of connection electrodes are disposed in a surrounding region around the penetrating hole on the lower surface of the insulating substrate, and are to be electrically connected to an image sensor. The image pickup device is mounted on the lower surface of the insulating substrate of the wiring substrate, and is electrically connected to the plurality of connection electrodes.