Abstract: A vehicular air conditioning unit includes an air-conditioning case and a blower. The blower includes a blower fan accommodated in the air-conditioning case and configured to rotate about a fan axis to cause the air to flow through the case passage, and a blower motor accommodated in the air-conditioning case and configured to rotate the blower fan. The air-conditioning case includes a case body having a case opening hole that is located outward of the blower in a radial direction of the fan axis and opens in the radial direction, and an opening hole cover fixed to the case body to close the case opening hole. The opening hole cover is detachable from the case body. The case opening hole has a size that allows the blower to pass through the case opening hole when the blower is taken out from the air-conditioning case.

Abstract: An air conditioning unit for a vehicle includes: an air conditioning case, a blower that draws air from an opening and blows the air radially outward from its rotation axis, a cooler disposed upstream of the blower, and a heater is disposed downstream of the blower. The air conditioning case includes an upper bypass passage through which the air bypasses the heater on an upper side of the heater, a lower bypass passage through which the air bypasses the heater on a lower side of the heater, a first opening provided downstream of the upper bypass passage, and a second opening provided downstream of the lower bypass passage. The opening of the blower faces an air outflow face of the cooler. A passage area of the upper bypass passage is larger than a passage area of the lower bypass passage.

Abstract: Embodiments are described herein for systems and methods for plasma processing tool matching after preventative maintenance (PM). Before the PM, the plasma processing tool is operated to run a process on a test wafer, and measurements are taken for pre-PM operational data associated with the process during the operating. After the PM, the plasma processing tool is again operated to run the process on a test wafer, and measurements are taken for post-PM operational data associated with the process during the operating. A prediction model is then applied to the pre-PM operational data and the post-PM operational data to generate an estimated difference in a product parameter, and the prediction model is configured to provide an estimate for the product parameter based upon operational data. One or more control settings for the plasma processing tool are then adjusted to compensate for the estimated difference in the product parameter.

Abstract: A vehicular air conditioning unit includes an air-conditioning case and a blower. The blower includes a blower fan accommodated in the air-conditioning case and configured to rotate about a fan axis to cause the air to flow through the case passage, and a blower motor accommodated in the air-conditioning case and configured to rotate the blower fan. The air-conditioning case includes a case body having a case opening hole that is located outward of the blower in a radial direction of the fan axis and opens in the radial direction, and an opening hole cover fixed to the case body to close the case opening hole. The opening hole cover is detachable from the case body. The case opening hole has a size that allows the blower to pass through the case opening hole when the blower is taken out from the air-conditioning case.

Abstract: A display device includes a first substrate, a sealing layer located along an edge of the first substrate, a second substrate coupled with the first substrate via the sealing layer, a display part located on the second main surface and within a sealed space, and a filler filling the sealed space and including a particle solid drying agent dispersed therein. The display part includes an organic EL element located on the second substrate, the organic EL element including a first electrode, an organic EL layer, and a second electrode stacked in order from the second substrate. Additionally, the display part includes an organic sacrifice layer located on and in contact with the second electrode, and a first inorganic protective layer located on and in contact with the organic sacrifice layer. The filler is located between the first inorganic protective layer and the first substrate.

Abstract: An air conditioning unit for a vehicle includes: an air conditioning case, a blower that draws air from an opening and blows the air radially outward from its rotation axis, a cooler disposed upstream of the blower, and a heater is disposed downstream of the blower. The air conditioning case includes an upper bypass passage through which the air bypasses the heater on an upper side of the heater, a lower bypass passage through which the air bypasses the heater on a lower side of the heater, a first opening provided downstream of the upper bypass passage, and a second opening provided downstream of the lower bypass passage. The opening of the blower faces an air outflow face of the cooler. A passage area of the upper bypass passage is larger than a passage area of the lower bypass passage.

Abstract: An organic EL display device includes a rectangular first substrate, an organic EL diode unit formed on the first substrate, a rectangular second substrate formed on the organic EL diode unit, a frame-shaped adhesive section configured to attach the first substrate to the second substrate to surround the organic EL diode unit, an extraction interconnection group constituted by a plurality of extraction interconnections extracted from the organic EL diode unit, and a dummy interconnection group formed at an adhesive region at which the adhesive section of the first substrate is attached and constituted by a plurality of dummy interconnections that are separated from each other, wherein the extraction interconnection and the dummy interconnection cross the adhesive section in the same direction.

Abstract: An organic EL display device includes a first substrate, a frame-shaped sealing layer disposed along an edge of the first substrate, a second substrate, an organic EL element portion disposed in a sealed space surrounded with the first substrate, the sealing layer, and the second substrate, and a filler that fills the sealed space. The filler has a first filler that includes a powdered drying agent, and is in contact with the sealing layer on an inside of the sealing layer, and a second filler that is in contact with the first filler on an inside of the first filler. At least an area overlapping the organic EL element portion is filled with the second filler.

Abstract: A display device includes a first substrate, a sealing layer located along an edge of the first substrate, a second substrate coupled with the first substrate via the sealing layer, a display part located on the second main surface and within a sealed space, and a filler filling the sealed space and including a particle solid drying agent dispersed therein. The display part includes an organic EL element located on the second substrate, the organic EL element including a first electrode, an organic EL layer, and a second electrode stacked in order from the second substrate. Additionally, the display part includes an organic sacrifice layer located on and in contact with the second electrode, and a first inorganic protective layer located on and in contact with the organic sacrifice layer. The filler is located between the first inorganic protective layer and the first substrate.

Abstract: The organic EL display module includes an organic EL display device having flexibility, a touch panel having flexibility, a first adhesive portion for attaching the organic EL display device and the touch panel to each other, a curved and flexible intermediate housing disposed on an opposite side from the organic EL display device with respect to the touch panel, and a second adhesive portion for attaching the touch panel and the intermediate housing to each other.

Abstract: An organic EL display device includes a rectangular first substrate, an organic EL diode unit formed on the first substrate, a rectangular second substrate formed on the organic EL diode unit, a frame-shaped adhesive section configured to attach the first substrate to the second substrate to surround the organic EL diode unit, an extraction interconnection group constituted by a plurality of extraction interconnections extracted from the organic EL diode unit, and a dummy interconnection group formed at an adhesive region at which the adhesive section of the first substrate is attached and constituted by a plurality of dummy interconnections that are separated from each other, wherein the extraction interconnection and the dummy interconnection cross the adhesive section in the same direction.

Abstract: The organic EL display module includes an organic EL display device having flexibility, a touch panel having flexibility, a first adhesive portion for attaching the organic EL display device and the touch panel to each other, a curved and flexible intermediate housing disposed on an opposite side from the organic EL display device with respect to the touch panel, and a second adhesive portion for attaching the touch panel and the intermediate housing to each other.

Abstract: A highly reliable organic electroluminescence device and a manufacturing method includes at least one organic electroluminescence element, a structure, a to-be-covered portion and a passivation film. On a substrate, the organic electroluminescence element includes an anode, an organic layer including an organic light emitting layer, and a cathode. The structure is disposed on the substrate, and thickness of the structure is greater than that of the organic electroluminescence element. The to-be-covered portion is disposed at a step bottom portion of the structure and is formed such that the curvature radius of the cross-sectional shape of the to-be-covered portion at the step bottom portion is at least 0.3 micrometers. The passivation film covers the organic electroluminescence element, the structure and the to-be-covered portion.

Abstract: A highly reliable organic electroluminescence device and a manufacturing method includes at least one organic electroluminescence element, a structure, a to-be-covered portion and a passivation film. On a substrate, the organic electroluminescence element includes an anode, an organic layer including an organic light emitting layer, and a cathode. The structure is disposed on the substrate, and thickness of the structure is greater than that of the organic electroluminescence element. The to-be-covered portion is disposed at a step bottom portion of the structure and is formed such that the curvature radius of the cross-sectional shape of the to-be-covered portion at the step bottom portion is at least 0.3 micrometers. The passivation film covers the organic electroluminescence element, the structure and the to-be-covered portion.

Abstract: A highly reliable organic electroluminescence device is provided. An organic electroluminescence device 1 includes at least one layer of inorganic barrier film 4, at least one organic electroluminescence element 5, and a sealed portion. The inorganic barrier film 4 is formed to contact to a flexible substrate 2 or at least one layer of organic resin film 3 formed on the substrate 2. The organic electroluminescence element 5 is formed on the inorganic barrier film 4 and includes an anode 51, an organic layer 52 including an organic light emitting layer, and a cathode 53. The sealed portion includes at least one of a flexible sealing film 8 and a sealing membrane 6, and blocks at least one organic electroluminescence element 5 from the air outside. The formed surface of the inorganic barrier film 4 is held to maintain a state in which a compressive stress is applied.

Abstract: The present invention relates to a manufacturing method for a semiconductor device, the method includes a process for forming an interlayer film on a substrate, a process for forming an opening in the interlayer, a process for forming a conductive layer which fills the opening, and a process for forming a cap film on the surface of the conductive layer. In the process for forming the cap film, a reduction process for the surface of the conductive layer and the forming of the film are performed simultaneously.

Abstract: The present invention is a film forming method for an SiOCH film, comprising a unit-film-forming step including: a deposition step of depositing an SiOCH film element by using an organic silicon compound as a raw material and by using a plasma CVD method; and a hydrogen plasma processing step of providing a hydrogen plasma process to the deposited SiOCH film element, wherein the unit-film-forming step is repeated several times so as to form an SiOCH film on a substrate.

Abstract: The present invention relates to a method of lowering dielectric constant of an insulating film including Si, O and CH formed by a chemical vapor deposition process. A process gas containing hydrogen atoms is supplied into a reaction vessel. A microwave is introduced into the reaction vessel to supply a uniform electromagnetic wave, thereby a plasma containing a hydrogen radical is generated in the reaction vessel. The structure of the insulating film is modified by the hydrogen radical contained in the plasma irradiated to the insulating film, lowering the dielectric constant of the film. The microwave is supplied into the reaction vessel through a radial-slot antenna.

Abstract: A method of cleaning a semiconductor substrate conductive layer surface that can remove a residual organic material and a natural oxide satisfactorily and does not adversely affect a k value without damaging the side-wall insulation film of a via hole. A semiconductor device, including insulation films formed on the surface of a conductive layer of a semiconductor substrate and a via hole formed in an insulation film to partly expose the conductive layer, is carried into a reaction vessel, plasma including hydrogen is generated in the reaction vessel to clean the surface of the conductive layer at the bottom of the via hole, a residual organic material is decomposed and removed by ashing, and a copper oxide film on the surface of the conductive layer is reduced to Cu.

Abstract: An oxide film-forming apparatus, comprising: a process chamber for disposing an electronic device substrate at a predetermined position; water vapor supply means for supplying water vapor into the process chamber; and plasma exciting means for activating the water vapor with plasma, whereby the surface of the electronic device substrate can be irradiated with the plasma based on the water vapor.