Patents by Inventor Shinji Kadoriku

Shinji Kadoriku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6323440
    Abstract: A part holder comprising holding members (8, 9) extending upward on a base (10) to hold a part (11), insertion holes (12) penetrating the base (10) and passing lead wires (12) of the part (11) through when the part (11) is held by the holding members, and supports (17) extending downward on the base (10) and adapted to be supported on a substrate (15), on which a predetermined electric circuit is formed.
    Type: Grant
    Filed: July 28, 2000
    Date of Patent: November 27, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshio Maruyama, Takahiro Matsuo, Osamu Hikita, Shinji Kadoriku
  • Publication number: 20010038157
    Abstract: An injection-compression molding apparatus includes a stationary mold provided with a nozzle for injecting molten resin, and a movable mold driven by a servo motor. In compressing the resin, high-speed position control of the movable mold is first performed, which is then switched to speed feedback control which enables delicate regulation of clamping pressure in accordance with pressure fluctuations in the resin.
    Type: Application
    Filed: March 27, 2001
    Publication date: November 8, 2001
    Inventors: Hiroshi Yutani, Shinji Kadoriku, Akira Yabe, Tadao Murata, Ryoma Murase
  • Publication number: 20010002005
    Abstract: The present invention is a part retainer for housing and retaining various electronic and mechanical parts (27) wherein a retaining unit (2) has an engaging piece (7) that stably stops at both a position at which it protrudes toward the opening of a part housing space (5) and a position at which it withdraws, and which can move between these two positions under a specified or more amount of force, and wherein when protruding toward the opening, the engaging piece (7) prevents the part (27) housed in the housing space (5) from jumping out.
    Type: Application
    Filed: September 24, 1999
    Publication date: May 31, 2001
    Inventors: YOSHIO MARUYAMA, YOSHINORI WADA, SHINJI KADORIKU, OSAMU YAMAZAKI, OSAMU HIKITA, DAISUKE NAGANO
  • Patent number: 6099287
    Abstract: A stamper protecting layer is interposed between a mold and a stamper of an optical disk molding apparatus, so that forces generated by extension and shrinkage of the stamper in a diametrical direction of the stamper relative to the mold when an optical disk are molded is absorbed by the stamper protecting layer. With this arrangement, the stamper is prevented from being deformed. Accordingly quality and production of the optical disks are improved.
    Type: Grant
    Filed: April 14, 1998
    Date of Patent: August 8, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaaki Higashida, Shinji Kadoriku, Hiroshi Yutani, Yoshio Maruyama
  • Patent number: 6003675
    Abstract: The present invention is a part retainer for housing and retaining various electronic and mechanical parts wherein a retaining unit has an engaging piece that stably stops at both a position at which it protrudes toward the opening of a part housing space and a position at which it withdraws, and which can move between these two positions under a specified or more amount of force, and wherein when protruding toward the opening, the engaging piece prevents the part housed in the housing space from falling out.
    Type: Grant
    Filed: May 12, 1997
    Date of Patent: December 21, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshio Maruyama, Yoshinori Wada, Shinji Kadoriku, Osamu Yamazaki, Osamu Hikita, Daisuke Nagano
  • Patent number: 5982623
    Abstract: A module is provided for a packaged IC designed to radiate heat by sealing the packaged IC. At least outer lead parts the packaged IC which are mounted on an electronic circuit board are sealed by a sealing material of a high thermal conductivity to form a sealing part.
    Type: Grant
    Filed: January 23, 1996
    Date of Patent: November 9, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takahiro Matsuo, Yoshio Maruyama, Osamu Hikita, Shinji Kadoriku
  • Patent number: 5961898
    Abstract: A molding apparatus for light-permeable articles which includes a nozzle that is movable up and down. A suction path and a suction device connected to the suction path are provided so as to suck a gas at a contact face of a sprue bush and its vicinity during the up/down movement of the nozzle. Accordingly, foreign substances, invading the mold can be sucked up before the apparatus performs a molding operation. Therefore, foreign substances are prevented from being mixed into the molded product. The molded product is accordingly improved in quality and yield.
    Type: Grant
    Filed: October 2, 1997
    Date of Patent: October 5, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaaki Higashida, Shinji Kadoriku, Tokiharu Nakagawa, Akinobu Katayama, Hiroshi Yutani, Yoshio Maruyama
  • Patent number: 5931282
    Abstract: A component carrier assembly includes component holders each for holding a component therein and connected to one another in a form of a tape carrier. Each holder is provided with a cavity to accommodate the component, a closure for shutting an opening of the cavity, and a device for securing the lid structure in a closed position. An apparatus for feeding the component carrier includes a device for transferring the component carrier, a device for forcibly opening a closure of a component holder transferred to a predetermined position, and a device for forcibly closing the closure of the component holder after a component is removed from the cavity.
    Type: Grant
    Filed: April 2, 1997
    Date of Patent: August 3, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshio Maruyama, Shinji Kadoriku, Toshiaki Yamauchi, Naomi Kuromoto, Hiroshi Yamauchi
  • Patent number: 5868978
    Abstract: The separation of a lower mold from an upper mold in an injection molding machine is either temporarily paused or carried out at a lower speed so as to maintain deformation of a thin component within a permissible range, while a jet of air is applied to help remove the thin component from the upper mold. Also, the ejecting operation of the thin component is either temporarily paused or carried out at a lower speed before the deformation of the thin component exceeds the permissible limit while a jet of air is applied to help remove the thin component from the lower mold.
    Type: Grant
    Filed: October 15, 1997
    Date of Patent: February 9, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shinji Kadoriku, Yoshio Maruyama, Takaaki Higashida, Hiroshi Yutani, Keizo Matsumura
  • Patent number: 5769236
    Abstract: A component collective includes component holders respectively holding components therein and connected to one another in the form of a tape carrier. Each of holders is provided with a cavity to accommodate the component, a lid for shutting an opening of the cavity, and a keeping device for keeping the lid at a closed position. An apparatus for feeding the component collective includes a device for transferring the component collective, a device for forcibly opening the lid means of the component holder transferred to a predetermined position, and a device for forcibly closing the lid of the component holder after a component is removed from the cavity.
    Type: Grant
    Filed: July 20, 1995
    Date of Patent: June 23, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshio Maruyama, Shinji Kadoriku, Toshiaki Yamauchi, Shoriki Narita, Naomi Kuromoto, Hiroshi Yamauchi
  • Patent number: 4938682
    Abstract: A mold clamping apparatus of an injection molding machine is provided, which is capable of uniformly applying a pressing force to a movable platen. A pair of annular wedge type connection members (21, 22) are disposed within annular hollow portions (16a) of driving pulleys (16), which are respectively fitted on ball screws (14, 15) threadedly engaged with heads of upper and lower toggle sections disposed symmetrically with respect to an axis of the mold clamping apparatus. To make an adjustment for eliminating mismatch between operational phases of the toggle sections of the toggle mechanism due to flexure of the same mechanism, an urged contact state of the connection member is released by loosening bolts (23), and the ball screws, rendered to be rotatable relative to the driving pulleys, are manually rotated so that the heads are aligned with each other. After completion of the adjustment, the driving pulleys are again rendered rotatable in unison with the ball screws.
    Type: Grant
    Filed: March 30, 1989
    Date of Patent: July 3, 1990
    Assignee: Fanuc Ltd
    Inventors: Shinji Kadoriku, Kikuo Watanabe