Patents by Inventor Shinji Kaino

Shinji Kaino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for bonding semiconductor laser element and apparatus therefor
    Patent number: 4817849
    Abstract: A method for bonding a semiconductor laser element, wherein a laser chip (4) is mounted on a stem (1) and a driving electric power is supplied to the laser chip through members for mounting the laser chip so that the laser chip emits a laser light, then the direction of the laser light is examined, and position of the laser chip is adjusted, in a manner that the direction of the laser light becomes within a predetermined range, and subsequently the laser chip is bonded on the pedestal (2) upon detection of entering the direction in the range, by flowing a large current through in the pedestal (2).
    Type: Grant
    Filed: September 8, 1987
    Date of Patent: April 4, 1989
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akihiro Yamamoto, Yutaka Makino, Shinji Kaino