Patents by Inventor Shinji Kajiwara

Shinji Kajiwara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088786
    Abstract: A driving device includes an output terminal to output a first control signal, and input terminals configured to be connected respectively with a corresponding terminal of light emitting elements driven by a voltage generated based on the first control signal. A constant-current driver is connected to each of the input terminals, and a control portion is configured to generate a pulse signal based on a signal which is input from the input terminals. An open detection portion is connected with each of the input terminals and configured to determine a connection state of the light emitting elements based on a signal that is input into the input terminals. A current set terminal is configured to be connected to a first resistor, and an over voltage protection circuit is configured to be coupled to a potential between a second resistor and a third resistor.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Shinji Kawata, Yoichi Kajiwara
  • Patent number: 8198954
    Abstract: An impedance matched circuit board utilizes a series of vias, one signal via that is surrounded by four ground vias in order to effect impedance matching with a coaxial signal transmission line. The vias are plated and extend through the thickness of the circuit board. Both opposing surfaces of the circuit board are provided with a conductive ground layer and each such ground layer has an opening formed there that encompasses one or more of the vias. On the top surface the opening surrounds the signal and ground via and on the bottom surface the opening only partially surrounds the signal via and the opening includes a convex portion formed therein.
    Type: Grant
    Filed: August 22, 2007
    Date of Patent: June 12, 2012
    Assignee: Molex Incorporated
    Inventors: Kimiyasu Makino, Shinji Kajiwara
  • Publication number: 20100289596
    Abstract: An impedance matched circuit board utilizes a series of vias, one signal via that is surrounded by four ground vias in order to effect impedance matching with a coaxial signal transmission line. The vias are plated and extend through the thickness of the circuit board. Both opposing surfaces of the circuit board are provided with a conductive ground layer and each such ground layer has an opening formed there that encompasses one or more of the vias. On the top surface the opening surrounds the signal and ground via and on the bottom surface the opening only partially surrounds the signal via and the opening includes a convex portion formed therein.
    Type: Application
    Filed: August 22, 2007
    Publication date: November 18, 2010
    Applicant: Molex Incorporated
    Inventors: Kimiyasu Makino, Shinji Kajiwara