Patents by Inventor Shinji Kake

Shinji Kake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9125315
    Abstract: To provide a method for producing a conductive film with excellent transparency and conductivity by a simple method suitable for large-area production. A method for producing a conductive film comprising a step of placing a template (B), having openings in a mesh structure running from the side that is to contact a substrate (A) through to the back side, on the surface of the substrate (A), and spreading a dispersion (D) of conductive particles (P) on the surface of the substrate (A) on which the template (B) has been placed, and drying it, thereby forming a mesh-like structure (C) of the conductive particles (P) near the points of contact between the substrate (A) and the template (B), and then removing the template (B) from the substrate (A) to form a mesh-like structure (C) of the conductive particles (P) on the surface of the substrate (A).
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: September 1, 2015
    Assignees: Kyoto University, SANYO CHEMICAL INDUSTRIES, LTD., Mitsubishi Rayon Co., Ltd.
    Inventors: Ko Higashitani, Yasuhiro Tsudo, Masaki Nakayama, Shinji Kake
  • Publication number: 20120325545
    Abstract: To provide a method for producing a conductive film with excellent transparency and conductivity by a simple method suitable for large-area production. A method for producing a conductive film comprising a step of placing a template (B), having openings in a mesh structure running from the side that is to contact a substrate (A) through to the back side, on the surface of the substrate (A), and spreading a dispersion (D) of conductive particles (P) on the surface of the substrate (A) on which the template (B) has been placed, and drying it, thereby forming a mesh-like structure (C) of the conductive particles (P) near the points of contact between the substrate (A) and the template (B), and then removing the template (B) from the substrate (A) to form a mesh-like structure (C) of the conductive particles (P) on the surface of the substrate (A).
    Type: Application
    Filed: January 18, 2011
    Publication date: December 27, 2012
    Applicants: Kyoto University, Mitsubishi Rayon Co., Ltd., SANYO CHEMICAL INDUSTRIES, LTD.
    Inventors: Ko Higashitani, Yasuhiro Tsudo, Masaki Nakayama, Shinji Kake