Abstract: A flat-panel display is hermetically sealed by a process in which a first plate structure (30) is positioned generally opposite a second plate structure (32) such that sealing material (34) provided over the second plate structure lies between the plate structures. In a gravitational sealing technique, the first plate structure is positioned vertically below the second plate structure. The sealing material is heated so that it moves vertically downward under gravitational influence to meet the first plate structure and seal the plate structures together. In a global-heating gap-jumping technique, the plate structures and sealing material are globally heated to cause the sealing material to jump a gap between the sealing material and the first plate structure. When the first plate structure is positioned vertically above the second plate structure, the sealing material moves vertically upward to meet the first plate structure and close the gap.

Abstract: A flat-panel display is hermetically sealed by a process in which a first plate structure (30) is positioned generally opposite a second plate structure (32) such that sealing material (34) provided over the second plate structure lies between the plate structures. In a gravitational sealing technique, the first plate structure is positioned vertically below the second plate structure. The sealing material is heated so that it moves vertically downward under gravitational influence to meet the first plate structure and seal the plate structures together. In a global-heating gap-jumping technique, the plate structures and sealing material are globally heated to cause the sealing material to jump a gap between the sealing material and the first plate structure. When the first plate structure is positioned vertically above the second plate structure, the sealing material moves vertically upward to meet the first plate structure and close the gap.

Abstract: A bump formation method and a bump forming apparatus for forming bumps on a semiconductor wafer. The apparatus includes a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is carried out continuously to the ICs included in one basic block. Position recognition to the other basic block is carried out only when the bump formation operation is shifted from one basic block to the other basic block. Thus, in comparison with the conventional art, in which the position recognition operation is carried out every time bumps are formed to each IC, the number of times of the recognition is greatly reduced, so that the productivity can be improved.

Abstract: To prevent lowering of the brightness of a displayed image, realize satisfactory strength against high pressure and reliably form spacers, an image display apparatus incorporates an anode substrate having a structure in which at least an image display portion is formed on a first substrate; a cathode substrate in which at least an electron emission units are formed on a second substrate and which is disposed opposite to the anode substrate; and spacers each of which formed into a substantially rectangular shape and which are stood erect between the anode substrate and the cathode substrate, wherein the two long sides of the spacer are secured to at least either of the anode substrate or the cathode substrate, and tensions are added to the spacers in the lengthwise direction of the spacers.

Abstract: To prevent lowering of the brightness of a displayed image, realize satisfactory strength against high pressure and reliably form spacers, an image display apparatus incorporates an anode substrate having a structure in which at least an image display portion is formed on a first substrate; a cathode substrate in which at least an electron emission units are formed on a second substrate and which is disposed opposite to the anode substrate; and spacers each of which formed into a substantially rectangular shape and which are stood erect between the anode substrate and the cathode substrate, wherein the two long sides of the spacer are secured to at least either of the anode substrate or the cathode substrate, and tensions are added to the spacers in the lengthwise direction of the spacers.

Abstract: The present invention relates to a method and device for assembling two elements spaced apart by means of a peripheral seal, consisting of adding a seal on a surface of a first element facing a surface to be assembled of a second element, bringing the assembly thus constituted, in vacuum conditions, to a temperature enabling the melting of the seal while temporarily maintaining, by means of spacers having a thickness higher than the thickness of the seal and distributed outside the seal, the surface of the second element distant from the seal, and enabling the elements to come closer to each other to assemble them, sealably, by means of the melting seal.

Abstract: When electrodes in two-layer composition, provided with a color filter in the inside thereof, are provided on the inner surface of a liquid crystal cell board, it is aimed to prevent creation of faulty connections in contact holes and to transmit a driving voltage normally even if faulty connections may occur. A first-layer transparent electrode 1a is formed on the board, then resist is coated so that the contact holes 6 are open on the side surface in one side of the electrode pattern, on which a color filter 3 is formed. After that, said resist is removed and a second-layer transparent electrode 1b is formed in film.

Abstract: A method is provided for forming a color filter for a liquid crystal display apparatus which requires considerably reduced area on a transparent substrate for performing electrodeposition of the color filter. The method includes coating non-extended liquid crystal driving terminal portions with a protective film with a notch etched therein for exposing an end edge portion of the non-extended driving terminal; and coating the non-extended driving terminals with a transverse strip of conductive material to place the non-extended terminals into a conducting state.