Patents by Inventor Shinji Kawachi

Shinji Kawachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9981695
    Abstract: A vehicle lower-body structure includes a front pillar, including a front-pillar outer panel and a front-pillar inner panel, and a side sill, including a side-sill outer panel and a side-sill inner panel and joined to a lower portion of the front pillar. The front-pillar outer panel is joined to an outer surface of the side-sill outer panel. The front-pillar inner panel is held between the side-sill outer panel and the side-sill inner panel. The side-sill outer panel and the side-sill inner panel respectively include vertical beads in front of a reinforcement member disposed at a front portion of the side sill and below the front pillar, the vertical beads extending vertically.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: May 29, 2018
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Kenji Sunohara, Hitoshi Inoue, Shinji Kawachi
  • Publication number: 20170203792
    Abstract: A vehicle lower-body structure includes a front pillar, including a front-pillar outer panel and a front-pillar inner panel, and a side sill, including a side-sill outer panel and a side-sill inner panel and joined to a lower portion of the front pillar. The front-pillar outer panel is joined to an outer surface of the side-sill outer panel. The front-pillar inner panel is held between the side-sill outer panel and the side-sill inner panel. The side-sill outer panel and the side-sill inner panel respectively include vertical beads in front of a reinforcement member disposed at a front portion of the side sill and below the front pillar, the vertical beads extending vertically.
    Type: Application
    Filed: January 12, 2017
    Publication date: July 20, 2017
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Kenji Sunohara, Hitoshi Inoue, Shinji Kawachi
  • Patent number: 5591684
    Abstract: Glass bubbles for use as fillers in a plastic resin substrate of an electrical printed circuit board are light in weight, low in density, and small in alkali amount leached sufficiently to insure electrical insulation resistance of the substrate, and consist essentially of, by weight, SiO.sub.2 40.0-60.0%, Al.sub.2 O.sub.3 5.0-22.0%, B.sub.2 O.sub.3 1.0-15.0%, CaO 10.0-30.0%, BaO 0-15.0%, MgO 0-10.0%, ZnO 0-10.0%, SrO 0-10.0%, Na.sub.2 O+K.sub.2 O+Li.sub.2 O 0-1.9%, As.sub.2 O.sub.3 +Sb.sub.2 O.sub.3 0-1.54, V.sub.2 O.sub.5 0-10.0%, TiO.sub.2 0-10.0%, and SO.sub.3 0.05-1.7%.
    Type: Grant
    Filed: October 3, 1994
    Date of Patent: January 7, 1997
    Assignee: Nippon Electric Glass Co., Ltd.
    Inventors: Shinji Kawachi, Yoshifumi Sato, Yasuhiro Nishimura
  • Patent number: 5292690
    Abstract: A glass composition for glass bubbles used as reinforcing fillers in plastic resin articles has an improved compressive strength and the reduced alkali amount leached from the glass. The glass composition consists essentially of, by weight percentages, SiO.sub.2 40-59%, R.sub.2 O 2-17%, R.sub.2 O being at least one selected from Li.sub.2 O, Na.sub.2 O, and K.sub.2 O, B.sub.2 O.sub.3 1-25%, RO 5-25%, RO being at least one selected from CaO, MgO, BaO, ZnO, and SrO, RO.sub.2 6-40%, RO.sub.2 being at least one selected from TiO.sub.2 and ZrO.sub.2, Al.sub.2 O.sub.3 0-13%, P.sub.2 O.sub.5 0-3%, and SO.sub.3 0.1-1.0%.
    Type: Grant
    Filed: March 26, 1992
    Date of Patent: March 8, 1994
    Assignee: Nippon Electric Glass Company, Ltd.
    Inventors: Shinji Kawachi, Yoshifumi Sato