Abstract: A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

Abstract: A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

Abstract: In a radar apparatus, a high-frequency integrated circuit is mounted to a board, and a shielding case encloses the high-frequency integrated circuit. A radio-absorbing and heat-dissipative gel is arranged to cover at least part of the high-frequency integrated circuit and to be in contact with the shielding case.

Abstract: A radar apparatus includes a board, a high-frequency integrated circuit mounted to the board, a metallic housing arranged to face the high-frequency integrated circuit, and a radio-absorbing and heat-dissipating unit. The radio-absorbing and heat-dissipating unit includes a radio-absorbing and heat-dissipative gel. The radio-absorbing and heat-dissipating unit is configured to cover at least part of the high-frequency integrated circuit and to be in contact with the metallic case.

Abstract: A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

Abstract: A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

Abstract: A pressure sensor detects a pressure of a pressure transmitting medium. The pressure sensor includes a sensor substrate and a protection film. The sensor substrate includes a recess recessed relative to a periphery thereof and a thin portion thinner than the periphery due to the recess. The protection film is provided on a bottom surface of the recess that is one side of the thin portion and a part of a lateral surface of the recess, and the protection film suppresses an adhesion of a contamination contained in the pressure transmitting medium. The pressure sensor includes an adhesion suppressing portion that includes an uneven section formed in at least a part of the lateral surface, and a liquid repellent film repellent to liquid in the pressure transmitting medium and provided as the protection film on the uneven section to exhibit a lotus effect.

Abstract: A pressure sensor generates an electrical output according to a fluid pressure in a detection space applied to a diaphragm. The diaphragm is flexibly deformable in a thickness direction. The pressure sensor includes a pressure receiving recess defining the detection space and a protection film covering the pressure receiving recess. The protection film has a corner portion provided in an inner corner area of the pressure receiving recess and a thin film portion having a uniform thickness. The corner portion is located outside the diaphragm in an in-plane direction orthogonal to the thickness direction.

Abstract: A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

Abstract: A pressure sensor detects a pressure of a pressure transmitting medium. The pressure sensor includes a sensor substrate and a protection film. The sensor substrate includes a recess recessed relative to a periphery thereof and a thin portion thinner than the periphery due to the recess. The protection film is provided on a bottom surface of the recess that is one side of the thin portion and a part of a lateral surface of the recess, and the protection film suppresses an adhesion of a contamination contained in the pressure transmitting medium. The pressure sensor includes an adhesion suppressing portion that includes an uneven section formed in at least a part of the lateral surface, and a liquid repellent film repellent to liquid in the pressure transmitting medium and provided as the protection film on the uneven section to exhibit a lotus effect.

Abstract: The present disclosure provides a pressure sensor configured to generate an electrical output according to a fluid pressure in a detection space applied to a diaphragm. The diaphragm is flexibly deformable in a thickness direction. The pressure sensor includes a pressure receiving recess defining the detection space and a protection film covering the pressure receiving recess. The protection film has a corner portion provided in an inner corner area of the pressure receiving recess. The corner portion is located outside the diaphragm in an in-plane direction orthogonal to the thickness direction.

Abstract: Provided is a brake pedal device for an automotive vehicle that is capable of rotating a lower portion of a brake pedal toward a front side of a vehicle body by using force generated by a collision and suitably preventing disengagement of a link member under normal conditions before the collision. A brake pedal device includes a brake pedal 6 pivotally supported to be freely rotatable on a rotation center axis (X) provided at a pedal bracket 3 fixed to a vehicle body, and a link member 4 which is rotatably connected to the brake pedal by a connection part 5 and has a master cylinder connection part 44 coupled to a master cylinder 9 through a push rod 8, a collision part 43 which collides with a part of the vehicle body in a frontal collision of a vehicle, and an engagement part 42 which engages with the brake pedal and disengages toward a front side of the vehicle body in the collision between the collision part and the part of the vehicle body.

Abstract: A capacitance operation device includes an operation plate, an electrode, and an electrode film. The operation plate has an operation surface to be contact-operated by an operation body. The electrode outputs a detection signal according to a change in capacitance generated between the electrode and the operation body. The electrode film supports the electrode. The operation plate has a rear surface on a side opposite to the operation surface. The rear surface is formed with a groove. The groove is filled with an adhesive agent, and the electrode film is adhered to the operation plate with the adhesive agent.

Abstract: A capacitance operation device includes an operation plate, an electrode, and an electrode film. The operation plate has an operation surface to be contact-operated by an operation body. The electrode outputs a detection signal according to a change in capacitance generated between the electrode and the operation body. The electrode film supports the electrode. The operation plate has a rear surface on a side opposite to the operation surface. The rear surface is formed with a groove. The groove is filled with an adhesive agent, and the electrode film is adhered to the operation plate with the adhesive agent.

Abstract: According to one embodiment, a memory system includes a plurality of nonvolatile semiconductor memories configured to hold data, or a conversion table for converting a logical address of the data into a physical address of the data, a table memory configured to hold the conversion table, an interface configured to exchange data and a table with the plurality of nonvolatile semiconductor memories based on a command issue request.

Abstract: A memory control device according to an example of the invention comprises an allocation section allocating a plurality of memory regions of a memory module, an available space storage section storing data in available space of a first memory region that is one of the plurality of memory regions and, when no more space becomes available in the first memory region, store data in available space of a following second memory region, and a copying section copying a plurality of items of to-be-copied data that is stored in the first memory region but not in the second memory region to the second memory region after no more space becomes available in the first memory region in such a manner that a copying operation is divided into a plurality of times.

Abstract: According to one embodiment, a memory system includes a first memory chip includes a first temporary memory and a first block, a second memory chip includes a second temporary memory and a second block, and a memory controller that controls writing of logical pages to the first and second memory chips. The memory controller forms a second unit having the same page number as the first unit by the first temporary memory and the lowermost physical page in the first block, forms a third unit having the same page number as the first unit by the second temporary memory and the lowermost physical page in the second block, and writes the logical pages by an interleave operation in order of the second unit, the third unit, the first unit in the first block, and the first unit in the second block.

Abstract: According to one embodiment, a memory system includes a first memory chip includes a first temporary memory and a first block, a second memory chip includes a second temporary memory and a second block, and a memory controller that controls writing of logical pages to the first and second memory chips. The memory controller forms a second unit having the same page number as the first unit by the first temporary memory and the lowermost physical page in the first block, forms a third unit having the same page number as the first unit by the second temporary memory and the lowermost physical page in the second block, and writes the logical pages by an interleave operation in order of the second unit, the third unit, the first unit in the first block, and the first unit in the second block.

Abstract: A semiconductor memory card that has a sufficient storage capacity when an EC application writes data to a storage is provided. A usage area for the EC application in an EEPROM 3 in a TRM 1 is expanded. The expansion is such that a partition generated in a flash memory 2 outside the TRM 1 is assigned to the EC application while a partition table is allocated in the internal EEPROM 3. Because the partition table is in the TRM 1, only a CPU 7 in the TRM 1 is able to access the generated partition table. Secrecy of stored contents increases because the access to the expanded area is limited to the CPU 7 in the TRM 1.

Abstract: A semiconductor memory card that has a sufficient storage capacity when an EC application writes data to a storage is provided. A usage area for the EC application in an EEPROM 3 in a TRM 1 is expanded. The expansion is such that a partition generated in a flash memory 2 outside the TRM 1 is assigned to the EC application while a partition table is allocated in the internal EEPROM 3. Because the partition table is in the TRM 1, only a CPU 7 in the TRM 1 is able to access the generated partition table. Secrecy of stored contents increases because the access to the expanded area is limited to the CPU 7 in the TRM 1.