Patents by Inventor Shinji Kumon
Shinji Kumon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170103777Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.Type: ApplicationFiled: December 23, 2016Publication date: April 13, 2017Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoichi HITOMI, Shinji KUMON, Terutoshi MOMOSE, Katsuya SAKAYORI, Kiyohiro TAKACHI, Yoichi MIURA, Tsuyoshi YAMAZAKI
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Patent number: 9564153Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.Type: GrantFiled: November 24, 2014Date of Patent: February 7, 2017Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Hitomi, Shinji Kumon, Terutoshi Momose, Katsuya Sakayori, Kiyohiro Takachi, Yoichi Miura, Tsuyoshi Yamazaki
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Publication number: 20150079424Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.Type: ApplicationFiled: November 24, 2014Publication date: March 19, 2015Inventors: Yoichi HITOMI, Shinji KUMON, Terutoshi MOMOSE, Katsuya SAKAYORI, Kiyohiro TAKACHI, Yoichi MIURA, Tsuyoshi YAMAZAKI
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Patent number: 8927122Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.Type: GrantFiled: April 14, 2008Date of Patent: January 6, 2015Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Hitomi, Shinji Kumon, Terutoshi Momose, Katsuya Sakayori, Kiyohiro Takachi, Yoichi Miura, Tsuyoshi Yamazaki
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Patent number: 8399774Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.Type: GrantFiled: November 23, 2011Date of Patent: March 19, 2013Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Hitomi, Hiroaki Miyazawa, Shinji Kumon, Terutoshi Momose
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Publication number: 20120090878Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.Type: ApplicationFiled: November 23, 2011Publication date: April 19, 2012Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoichi HITOMI, Hiroaki MIYAZAWA, Shinji KUMON, Terutoshi MOMOSE
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Patent number: 8097811Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.Type: GrantFiled: April 4, 2008Date of Patent: January 17, 2012Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Hitomi, Hiroaki Miyazawa, Shinji Kumon, Terutoshi Momose
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Publication number: 20100047626Abstract: A substrate for suspension 10 comprises a metallic substrate 1, an insulating layer 2 formed on the metallic substrate 1, a conductor layer 3 formed on the insulating layer 2, and a cover layer 4 covering the conductor layer 3. The insulating layer 2 and the cover layer 4 are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.Type: ApplicationFiled: April 14, 2008Publication date: February 25, 2010Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Hitomi, Shinji Kumon, Terutoshi Momose, Katsuya Sakayori, Kiyohiro Takachi, Yoichi Miura, Tsuyoshi Yamazaki
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Publication number: 20080247131Abstract: A substrate for suspension 10 comprises a metallic substrate 1, an insulating layer 2 formed on the metallic substrate 1, having an opening for grounding terminal 3, and a grounding conductor 4 formed on the insulating layer 2. A grounding-terminal-forming material 5 is placed in the opening for grounding terminal 3 to form a grounding terminal 7 that connects the metallic substrate 1 and the grounding conductor 4. The grounding conductor 4 does not surround a portion 8 of the circumference of the opening for grounding terminal 3.Type: ApplicationFiled: April 4, 2008Publication date: October 9, 2008Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Hitomi, Hiroaki Miyazawa, Shinji Kumon, Terutoshi Momose
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Patent number: 7185429Abstract: A flexible multilayer wiring board manufactured by laminating a metal foil via an insulating layer to cover the first layer circuit wiring formed on a conductive substrate, and a resist layer is formed to cover the second layer circuit wiring formed by pattern-etching the metal foil. Using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, into interlayer via holes each formed applying a laser beam to the resist layer to establish interlayer connection between the first and second layer circuit wirings. Using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, into hole portions of an insulating layer formed to cover the second layer circuit wiring to form external connection terminals. Then, the conductive substrate is removed entirely or partly to expose the first layer circuit wiring.Type: GrantFiled: February 9, 2006Date of Patent: March 6, 2007Assignees: Sony Corporation, Dai Nippon Insatsu Kabushiki KaishaInventors: Hidetoshi Kusano, Shinji Kumon
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Patent number: 7115818Abstract: Metal foil is laminated via an insulating layer so as to cover the first layer circuit wiring formed on a conductive substrate, and a resist layer is formed so as to cover the second layer circuit wiring formed by pattern-etching the metal foil. Using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, in interlayer via holes each formed by applying a laser beam to the resist layer, thereby to establish interlayer connection between the first layer circuit wiring and the second layer circuit wiring. Subsequently, the resist layer is removed, and then, using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, in hole portions of an insulating layer formed so as to cover the second layer circuit wiring, thereby to form external connection terminals.Type: GrantFiled: January 14, 2003Date of Patent: October 3, 2006Assignees: Sony Corporation, Dai Nippon Insatsu Kabushiki KaishaInventors: Hidetoshi Kusano, Shinji Kumon
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Publication number: 20060124351Abstract: Metal foil is laminated via an insulating layer so as to cover the first layer circuit wiring formed on a conductive substrate, and a resist layer is formed so as to cover the second layer circuit wiring formed by pattern-etching the metal foil. Using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, in interlayer via holes each formed by applying a laser beam to the resist layer, thereby to establish interlayer connection between the first layer circuit wiring and the second layer circuit wiring. Subsequently, the resist layer is removed, and then, using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, in hole portions of an insulating layer formed so as to cover the second layer circuit wiring, thereby to form external connection terminals.Type: ApplicationFiled: February 9, 2006Publication date: June 15, 2006Applicants: Sony Corporation, Dai Nippon Insatsu Kabushiki KaishaInventors: Hidetoshi Kusano, Shinji Kumon
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Publication number: 20030161129Abstract: Metal foil is laminated via an insulating layer so as to cover the first layer circuit wiring formed on a conductive substrate, and a resist layer is formed so as to cover the second layer circuit wiring formed by pattern-etching the metal foil. Using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, in interlayer via holes each formed by applying a laser beam to the resist layer, thereby to establish interlayer connection between the first layer circuit wiring and the second layer circuit wiring. Subsequently, the resist layer is removed, and then, using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, in hole portions of an insulating layer formed so as to cover the second layer circuit wiring, thereby to form external connection terminals.Type: ApplicationFiled: January 14, 2003Publication date: August 28, 2003Applicant: Sony CorporationInventors: Hidetoshi Kusano, Shinji Kumon