Patents by Inventor Shinji Morimoto
Shinji Morimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7543376Abstract: Provided is an FPC, which comprises an insulating layer 2, wiring layers 3 and 4 laminated above and under the insulating layer 2, and a layer connection for connecting the wiring layers 3 and 4 electrically. The layer connection is constituted to comprise: a conductor press-fit hole 5 of a cone shape extending through the insulating layer 2 and the upper and lower wiring layers 3 and 4 and expanded to the side of one wiring layer 3; and a conductor 6 filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer 3 deformed into the cone shape of the conductor press-fit hole 5, and is protruded from the other wiring lower layer 4 to have its surface partially coated and jointed.Type: GrantFiled: January 12, 2007Date of Patent: June 9, 2009Assignee: Panasonic CorporationInventors: Toyokazu Yoshino, Katsuya Okamoto, Shigeki Ogata, Shinji Morimoto, Kouji Nakashima
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Publication number: 20080275085Abstract: The present invention provides a novel piperidine derivative and a tachykinin receptor antagonist containing same, as well as a compound represented by the formula: wherein R1 is carbamoylmethyl, methylsulfonylethylcarbonyl and the like; R2 is methyl or cyclopropyl; R3 is a hydrogen atom or methyl; R4 is a chlorine atom or trifluoromethyl; R5 is a chlorine atom or trifluoromethyl; and a group represented by the formula: is a group represented by the formula: wherein R6 is a hydrogen atom, methyl, ethyl or isopropyl; R7 is a hydrogen atom, methyl or a chlorine atom; and R8 is a hydrogen atom, a fluorine atom, a chlorine atom or methyl; or 3-methylthiophen-2-yl, and a salt thereof.Type: ApplicationFiled: April 23, 2008Publication date: November 6, 2008Inventors: Junya Shirai, Shinji Morimoto, Hideyuki Sugiyama, Nobuki Sakauchi, Takeshi Yoshikawa
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Patent number: 7427717Abstract: A flexible printed wiring board has a configuration which is equipped with a solder resist portion formed by coating through the use of a screen printing method on a region including a component mounting portion of a conductor pattern, and a cover lay film pasted in such a manner that an outer circumference portion of an opening portion overlaps an upper portion of a circumference portion of the solder resist portion. A manufacturing method of a flexible printed wiring board of the invention has a configuration which is equipped with a conductor pattern forming process, a solder resist forming process, and a cover lay film pasting process.Type: GrantFiled: May 18, 2005Date of Patent: September 23, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shinji Morimoto, Koji Nakashima, Toyokazu Yoshino, Katsuya Okamoto
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Publication number: 20080211761Abstract: A display unit having a pivot function and prolonged lives of light sources has been implemented according to the present invention. The display unit includes; a screen that is changeable between a first position and a second position and displays an image; at least one first light source that illuminates the screen in the first position; at least one second light source that illuminates the screen in the second position; and a turn-on control section that controls turning on of the first light source and the second light source according to a position. A display device and an information processing apparatus each provided with the display unit have also been implemented according to the present invention.Type: ApplicationFiled: December 20, 2007Publication date: September 4, 2008Applicant: FUJITSU LIMITEDInventor: Shinji Morimoto
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Patent number: 7263769Abstract: A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electrically-conductive member having a metal layer formed thereon at least on the surface thereof which is press-fitted into the hole to electrically conduct the circuit layer.Type: GrantFiled: October 19, 2005Date of Patent: September 4, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shinji Morimoto, Kouji Nakashima, Toyokazu Yoshino, Katsuya Okamoto
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Publication number: 20070148829Abstract: Provided is an FPC, which comprises an insulating layer 2, wiring layers 3 and 4 laminated above and under the insulating layer 2, and a layer connection for connecting the wiring layers 3 and 4 electrically. The layer connection is constituted to comprise: a conductor press-fit hole 5 of a cone shape extending through the insulating layer 2 and the upper and lower wiring layers 3 and 4 and expanded to the side of one wiring layer 3; and a conductor 6 filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer 3 deformed into the cone shape of the conductor press-fit hole 5, and is protruded from the other wiring lower layer 4 to have its surface partially coated and jointed.Type: ApplicationFiled: January 12, 2007Publication date: June 28, 2007Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Toyokazu YOSHINO, Katsuya OKAMOTO, Shigeki OGATA, Shinji MORIMOTO, Kouji NAKASHIMA
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Publication number: 20060272850Abstract: An interlayer connection conductor 1 is formed of a substantially spherical interlayer connector that is formed by forced in through holes 108, in a thickness direction, on a flexible printed circuit board having wiring layers 106, 107 on at leas one surface of an insulating layer The interlayer connection conductor includes a small cylindrical piece of metal core 102 formed by cutting a metal fine wire and a solder metal 103 coated around the surface of the metal core.Type: ApplicationFiled: June 5, 2006Publication date: December 7, 2006Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Shinji MORIMOTO, Toyokazu YOSHINO, Shigeki OGATA, Kouji NAKASHIMA, Katsuya OKAMOTO
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Patent number: 7070345Abstract: A printing system and a printing method, the printing method including the steps of horizontally placing cloth on a table, moving a nozzle head for ink jet printing in main and auxiliary scanning directions by a carriage for printing, extracting the presence area of printed data from print data, disassembling the presence area into a plurality of blocks, and controlling the carriage so that the nozzle head moves in the blocks for printing.Type: GrantFiled: July 22, 2003Date of Patent: July 4, 2006Assignee: Shima Seiki Manufacturing, Ltd.Inventors: Shinji Morimoto, Takahiko Tamura
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Publication number: 20060102386Abstract: A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electrically-conductive member having a metal layer formed thereon at least on the surface thereof which is press-fitted into the hole to electrically conduct the circuit layer.Type: ApplicationFiled: October 19, 2005Publication date: May 18, 2006Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Shinji Morimoto, Kouji Nakashima, Toyokazu Yoshino, Katsuya Okamoto
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Publication number: 20050277104Abstract: An automatic cutting machine teaching device includes image processing means and judgment means. The image processing means displays an image of a cutting area on a monitor and superimposes a cutting pattern of corrected making data on a position corresponding to the image of the cutting area displayed on the monitor. The judgment means judges whether the cutting pattern is entirely contained within the cutting area. If the cutting pattern is not entirely contained in the cutting area, the judgment means decides to cause an error and displays a portion of the cutting pattern out of the cutting area on the monitor.Type: ApplicationFiled: July 22, 2003Publication date: December 15, 2005Inventors: Shinji Morimoto, Kazunari Hama
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Publication number: 20050276646Abstract: A printing system and a printing method, the printing method comprising the steps of horizontally placing cloth on a table, moving a nozzle head for ink jet printing in main and auxiliary scanning directions by a carriage for printing, extracting the presence area of printed data from print data, disassembling the presence area into a plurality of blocks, and controlling the carriage so that the nozzle head moves in the blocks for printing.Type: ApplicationFiled: July 22, 2003Publication date: December 15, 2005Inventors: Shinji Morimoto, Takahiko Tamura
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Publication number: 20050257952Abstract: A flexible printed wiring board has a configuration which is equipped with a solder resist portion formed by coating through the use of a screen printing method on a region including a component mounting portion of a conductor pattern, and a cover lay film pasted in such a manner that an outer circumference portion of an opening portion overlaps an upper portion of a circumference portion of the solder resist portion A manufacturing method of a flexible printed wiring board of the invention has a configuration which is equipped with a conductor pattern forming process, a solder resist forming process, and a cover lay film pasting process.Type: ApplicationFiled: May 18, 2005Publication date: November 24, 2005Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Shinji Morimoto, Koji Nakashima, Toyokazu Yoshino, Katsuya Okamoto
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Publication number: 20040101206Abstract: A preview image display method for displaying an original image (G1) on an original image display window (W1) to subject the original image to a special effect treatment. A preview display window (W2) is set in the original image display window (W1), and a preview image (G2), obtained by subjecting the original image in the preview display window to special effect treatment, is displayed in the preview display window (W2) at the same display magnification as that of the original image.Type: ApplicationFiled: December 19, 2002Publication date: May 27, 2004Inventors: Shinji Morimoto, Norihisa Matsumoto
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Patent number: 6407116Abstract: A compound represented by the formula: [wherein ring A represents a homocycle optionally having substituents or a nitrogen-containing heterocycle optionally having substituents; D and E are O or S; one of R1 and R2 represents a group represented by the formula: (wherein Ar1 and Ar2 represent an aromatic group optionally having substituents; Ar1 and Ar2 may form a condensed cyclic group optionally having substituents together with an adjacent carbon atom; ring B represents a nitrogen-containing heterocycle optionally having substituents; X and Y are a bond, O, S(O)p (p is an integer of 0 to 2), NR4 (R4 is H or a lower alkyl group) or a bivalent straight-chained lower hydrocarbon group, which may contain 1 to 3 hetero atoms, optionally having substituents; and R3 represents H, a hydroxy group optionally having substituents or an optionally esterified carboxyl group); and the other is a hydrogen atom, a cyano group or a hydrocarbon group optionally having substituents&rsqType: GrantFiled: February 25, 2000Date of Patent: June 18, 2002Assignee: Takeda Chemical Industries, Inc.Inventors: Masahiro Kajino, Shinji Morimoto, Atsuhiro Inaba, Hideaki Nagaya
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Patent number: 5993624Abstract: A carbon dioxide gas sensor for detecting carbon dioxide gas concentration wherein the carbon dioxide gas detection part consists essentially of a carbonate, a carbonate decomposition catalyst and a semiconductor oxide, particularly preferably BaCO3, CeO.sub.2 and CuO mixed in a specific molar ratio.A process for producing the carbon dioxide detection part of a carbon dioxide gas sensor, wherein the raw-materials in the form of acetic acid salts are uniformly dissolved in a solvent, then dried and ground to produce a ceramic material with a small average particle diameter.Type: GrantFiled: December 3, 1996Date of Patent: November 30, 1999Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shogo Matsubara, Shoichi Shimizu, Shinji Morimoto, Shinichiro Kaneko
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Patent number: 5713125Abstract: Electronic parts are mounted onto a substrate. A parts supply device holds a plurality of electronic parts and moves to be positioned at a predetermined parts take-out position. The parts supply device includes a readable and writable memory for storing data indicative of the plurality of electronic parts held therein. A reading device reads the data stored in the readable and writable memory provided in the parts supply device when the parts supply device moves relative to the reading device to the predetermined parts take-out position. The electronic part is extracted from the parts supply device position at the predetermined parts take-out position and mounted on a substrate.Type: GrantFiled: January 4, 1995Date of Patent: February 3, 1998Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Nobuhisa Watanabe, Masatoshi Yanagawa, Noriaki Yoshida, Takashi Noyama, Masao Iritani, Shinji Morimoto
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Patent number: 5400497Abstract: An apparatus is for mounting electronic parts onto a substrate. The apparatus includes a parts supply device for holding a plurality of electronic parts and for moving to be positioned at a predetermined parts take-out position. The parts supply device includes a readable and writable memory for storing data indicative of the plurality of electronic parts held therein. The apparatus further includes a reading device for reading the data stored in the readable and writable memory provided in the parts supply device when the parts supply device moves relative to the reading device to the predetermined parts take-out position. The electronic part is extracted from the parts supply device position at the predetermined parts take-out position and mounted on a substrate.Type: GrantFiled: June 4, 1993Date of Patent: March 28, 1995Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Nobuhisa Watanabe, Masatoshi Yanagawa, Noriaki Yoshida, Takashi Noyama, Masao Iritani, Shinji Morimoto
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Patent number: 5235164Abstract: A parts supply device includes a mounting device for mounting a unit accommodating electronic parts on a parts mounting machine, a parts feeding device for sequentially feeding the parts held by the unit to a predetermined removing position according to an operation of the machine for removing the parts from the parts supply device, a storing device for storing data as to the number of parts held by the unit, and a calculating device for rewriting the parts number data stored in the storing device according to the operation of the machine for removing the parts from the supply device.Type: GrantFiled: September 16, 1991Date of Patent: August 10, 1993Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Takashi Noyama, Yoshifumi Nakao, Masanori Yasutake, Satoshi Tanaka, Shinji Morimoto, Noriaki Yoshida