Patents by Inventor Shinji Moriyama
Shinji Moriyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8581395Abstract: A hybrid integrated circuit device having high mount reliability includes a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include ones which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: GrantFiled: June 14, 2012Date of Patent: November 12, 2013Assignee: Renesas Electronics CorporationInventors: Shinji Moriyama, Tomio Yamada
-
Publication number: 20120248630Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include ones which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: ApplicationFiled: June 14, 2012Publication date: October 4, 2012Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Shinji MORIYAMA, Tomio YAMADA
-
Patent number: 8222734Abstract: A hybrid integrated circuit device having high mount reliability includes a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include ones which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: GrantFiled: November 29, 2011Date of Patent: July 17, 2012Assignee: Renesas Electronics CorporationInventors: Shinji Moriyama, Tomio Yamada
-
Publication number: 20120106110Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include ones which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: ApplicationFiled: November 29, 2011Publication date: May 3, 2012Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Shinji MORIYAMA, Tomio YAMADA
-
Patent number: 8084852Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: GrantFiled: February 3, 2011Date of Patent: December 27, 2011Assignee: Renesas Electronics CorporationInventors: Shinji Moriyama, Tomio Yamada
-
Patent number: 7962105Abstract: A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.Type: GrantFiled: March 24, 2010Date of Patent: June 14, 2011Assignee: Renesas Electronics CorporationInventors: Yusuke Sato, Nobuyoshi Maejima, Tomoaki Kudaishi, Shinji Moriyama, Naoki Kuroda, Ryota Sato, Masashi Okano
-
Publication number: 20110121365Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: ApplicationFiled: February 3, 2011Publication date: May 26, 2011Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Shinji MORIYAMA, Tomio YAMADA
-
Patent number: 7902656Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: GrantFiled: April 28, 2010Date of Patent: March 8, 2011Assignee: Renesas Electronics CorporationInventors: Shinji Moriyama, Tomio Yamada
-
Patent number: 7871750Abstract: A process for preparing a mixed color toner obtained by mixing two or more kinds of color toners of which each color is different, including the following steps (1) and (2): (1) determining zeta potential distributions of each of the color toners, and (2) mixing the color toners in combination so that an overlapping ratio of the zeta potential distributions is 70.0% or more; a mixed color toner obtainable by the process; a two-component developer containing the toner; and a method of forming fixed images using the toner. The mixed color toner obtainable by the present invention is used for, for example, developing a latent image formed in electrophotography, electrostatic recording method, electrostatic printing method, or the like.Type: GrantFiled: December 12, 2007Date of Patent: January 18, 2011Assignee: Kao CorporationInventor: Shinji Moriyama
-
Patent number: 7842448Abstract: A method of forming fixed images, including the step of applying a two-component developer containing a carrier and a toner containing a wax and a resin binder containing a crystalline polyester to a two-component development device with a linear speed of from 500 to 5,000 mm/sec, to develop the toner, wherein the crystalline polyester is contained in an amount of from 3 to 40% by weight and the wax in an amount of from 2.5 to 10% by weight, of the toner, and wherein the two-component development device comprises at least three magnet rollers which are arranged closely to each other along the perimeter of a photoconductor, wherein one magnet roller arranged on the uppermost side in the rotational direction of the photoconductor rotates in a direction opposite to the rotational direction of the photoconductor at the point therebetween, and the other magnet rollers rotate in the same direction as the photoconductor at the point therebetween.Type: GrantFiled: January 20, 2006Date of Patent: November 30, 2010Assignee: Kao CorporationInventors: Shinji Moriyama, Yoshihiro Fukushima, Takashi Kubo, Yutaka Kanamaru, Eiji Shirai
-
Patent number: 7803509Abstract: The present invention relates to a crystalline polyester for toner, obtained by a process comprising the step of polymerizing raw material monomers in the presence of a wax, wherein the crystalline polyester has a number-average molecular weight of from 3000 to 10000 and a weight-average molecular weight of from 150000 to 8000000. The toner containing the crystalline polyester of the present invention can be used, for example, for developing electrostatic latent images formed in electrophotography, electrostatic recording method, electrostatic printing method, and the like.Type: GrantFiled: July 18, 2005Date of Patent: September 28, 2010Assignee: Kao CorporationInventors: Shinji Moriyama, Takashi Kubo, Yoshihiro Fukushima
-
Publication number: 20100207275Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: ApplicationFiled: April 28, 2010Publication date: August 19, 2010Applicant: RENESAS TECHNOLOGY CORP.Inventors: Shinji MORIYAMA, Tomio YAMADA
-
Publication number: 20100178879Abstract: A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.Type: ApplicationFiled: March 24, 2010Publication date: July 15, 2010Applicant: RENESAS TECHNOLOGY CORP.Inventors: Yusuke Sato, Nobuyoshi Maejima, Tomoaki Kudaishi, Shinji Moriyama, Naoki Kuroda, Ryota Sato, Masashi Okano
-
Patent number: 7755182Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: GrantFiled: March 10, 2009Date of Patent: July 13, 2010Assignee: Renesas Technology Corp.Inventors: Shinji Moriyama, Tomio Yamada
-
Patent number: 7706756Abstract: A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.Type: GrantFiled: January 24, 2007Date of Patent: April 27, 2010Assignee: Renesas Technology Corp.Inventors: Yusuke Sato, Nobuyoshi Maejima, Tomoaki Kudaishi, Shinji Moriyama, Naoki Kuroda, Ryota Sato, Masashi Okano
-
Publication number: 20090174060Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: ApplicationFiled: March 10, 2009Publication date: July 9, 2009Applicant: RENESAS TECHNOLOGY CORP.Inventors: Shinji MORIYAMA, Tomio YAMADA
-
Patent number: 7518228Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: GrantFiled: June 27, 2007Date of Patent: April 14, 2009Assignee: Renesas Technology Corp.Inventors: Shinji Moriyama, Tomio Yamada
-
Publication number: 20080292984Abstract: A process for preparing a mixed color toner obtained by mixing two or more kinds of color toners of which each color is different, including the following steps (1) and (2): (1) determining zeta potential distributions of each of the color toners, and (2) mixing the color toners in combination so that an overlapping ratio of the zeta potential distributions is 70.0% or more; a mixed color toner obtainable by the process; a two-component developer containing the toner; and a method of forming fixed images using the toner. The mixed color toner obtainable by the present invention is used for, for example, developing a latent image formed in electrophotography, electrostatic recording method, electrostatic printing method, or the like.Type: ApplicationFiled: December 12, 2007Publication date: November 27, 2008Applicant: KAO CORPORATIONInventor: Shinji MORIYAMA
-
Patent number: 7323770Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: GrantFiled: December 14, 2005Date of Patent: January 29, 2008Assignee: Renesas Technology Corp.Inventors: Shinji Moriyama, Tomio Yamada
-
Publication number: 20070252264Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: ApplicationFiled: June 27, 2007Publication date: November 1, 2007Inventors: Shinji Moriyama, Tomio Yamada