Abstract: Provided is a surface processing apparatus and a surface processing method for a SiC substrate using anodization. The surface processing apparatus for the SiC substrate includes a surface processing pad and a power supply device. The surface processing pad includes a grinding wheel layer. The grinding wheel layer is disposed facing a workpiece surface of the SiC substrate. The power supply device passes a pulsed current having a period greater than 0.01 seconds and less than or equal to 20 seconds for anodizing the workpiece surface to be processed by the grinding wheel layer through the SiC substrate as an anode in the presence of an electrolyte.

Abstract: A method for machining a work in a work machining apparatus provided with a movable main spindle moving between a work supply position and a work take-out position, includes arranging a tool rest on the movable main spindle to move integrally with the movable main spindle, supplying the work at the work supply position to the movable main spindle, moving the movable main spindle from the work supply position toward the work take-out position, machining the work held on the movable spindle with a tool of the tool rest while moving the movable main spindle from the work supply position toward the work take-out position, and taking out the work at the work take-out position from the movable main spindle.

Abstract: A work machining apparatus capable of reducing the stand-by time in each main spindle as much as possible and can improve the operation ratio is provided. In a work machining apparatus having at least one movable spindle 22 which moves forward and backward between the work supply position and the work take-out position, in which a work is supplied to movable main spindle 22 at the supply position, the movable main spindle 22 is moved from the supply position to the take-out position and the work is taken out from the movable main spindle 22 at the supply position, whereby the work is conveyed from the supply position to the take-out position, wherein a tool rest 6 corresponding to the movable main spindle 22 is provided integrally with the movable main spindle 22 and movably on the movable spindle 22, thereby enabling the tool on the tool rest 6 to process the work held on the movable main spindle 22 during the conveyance movement of the work by the movable main spindle 22.

Abstract: The present invention provides a cutting method for hard, brittle materials that is capable of completely cutting through hard, brittle materials such as ceramic, glass, concrete, stone and single crystal materials without the occurrence of edge chipping and at high speed. The present invention is characterized by being a method for completely cutting through a hard, brittle material 1 using a disk-shaped rotary grindstone 2, wherein the cross-sectional shape of the outer peripheral edge 20 of rotary grindstone 2 has a V-shaped pointed shape.

Abstract: The present invention provides a cutting method for hard, brittle materials that is capable of completely cutting through hard, brittle materials such as ceramic, glass, concrete, stone and single crystal materials without the occurrence of edge chipping and at high speed.