Patents by Inventor Shinji Murahata

Shinji Murahata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die for molding honeycomb structure and manufacturing method thereof
    Patent number: 7132124
    Abstract: In a die for molding a honeycomb structure, in which a coating layer is formed on a die base so that slits with a particular width are provided, the slits are provided so as to have a width of 30 to 200 ?m by forming the coating layer by a substrate layer with a thickness of 10 to 100 ?m and a surface layer with a thickness of 1 to 30 ?m. Further, the substrate layer is formed by a metal layer containing no oxide. A thin-wall honeycomb structure with a wall thickness of 30 to 200 ?m can be formed, and moreover a die for molding a honeycomb structure, in which the coating layer is not damaged and thus the durability is high, and a manufacturing method thereof can be provided.
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: November 7, 2006
    Assignee: NGK Insulators, Ltd.
    Inventors: Keiji Matsumoto, Haremi Ito, Shinji Murahata
  • Honeycomb structural body forming ferrule, and method of manufacturing the ferrule
    Publication number: 20040076707
    Abstract: In a die for molding a honeycomb structure, in which a coating layer is formed on a die base so that slits with a particular width are provided, the slits are provided so as to have a width of 30 to 200 &mgr;m by forming the coating layer by a substrate layer with a thickness of 10 to 100 &mgr;m and a surface layer with a thickness of 1 to 30 &mgr;m. Further, the substrate layer is formed by a metal layer containing no oxide.
    Type: Application
    Filed: July 3, 2003
    Publication date: April 22, 2004
    Inventors: Keiji Matsumoto, Haremi Ito, Shinji Murahata