Patents by Inventor Shinji Nishijima
Shinji Nishijima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240117969Abstract: A heating cooking apparatus includes a heating cooking unit, a microwave supply unit, an air blowing mechanism, and a fixing member. The heating cooking unit includes a heating cooking chamber. The microwave supply unit is fixed to the heating cooking unit and supplies microwaves to the heating cooking chamber. The air blowing mechanism blows air onto the microwave supply unit. The fixing member is fixed to the heating cooking unit. The air blowing mechanism includes a fan, a motor that drives the fan, and a first attachment member disposed on a side, in a predetermined direction, of the fan. The fixing member includes a support portion that supports the first attachment member, and an attachment portion to which the first attachment member is attached.Type: ApplicationFiled: February 21, 2022Publication date: April 11, 2024Inventors: SHINJI ASAMI, MASAHIRO NISHIJIMA
-
Publication number: 20240068671Abstract: A heating cooking apparatus includes a housing, a lid portion, a rail member, and a slide member. The housing includes an opening opened toward a first direction, and an outer peripheral portion disposed on an outer periphery of the opening. The lid portion includes a plate-like member that opens and closes the opening. The rail member is disposed in the housing and extends in the first direction. The slide member is disposed on the lid portion and extends from the lid portion in a direction opposite to the first direction. The slide member includes a main body portion that moves relative to the rail member and a protruding portion protruding upward from an end portion of the main body portion in the first direction side. The protruding portion is in contact with a first face of the plate-like member.Type: ApplicationFiled: January 7, 2022Publication date: February 29, 2024Inventors: YU SHINOHARA, SHINJI ASAMI, MASAHIRO NISHIJIMA
-
Publication number: 20220158061Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: ApplicationFiled: January 31, 2022Publication date: May 19, 2022Applicant: NICHIA CORPORATIONInventors: Masato FUJITOMO, Hiroto TAMAKI, Shinji NISHIJIMA, Yuichiro TANDA, Tomohide MIKI
-
Patent number: 11271144Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: GrantFiled: December 17, 2018Date of Patent: March 8, 2022Assignee: Nichia CorporationInventors: Masato Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki
-
Publication number: 20190123253Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: ApplicationFiled: December 17, 2018Publication date: April 25, 2019Applicant: NICHIA CORPORATIONInventors: Masato FUJITOMO, Hiroto TAMAKI, Shinji NISHIJIMA, Yuichiro TANDA, Tomohide MIKI
-
Patent number: 10164163Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: GrantFiled: August 31, 2017Date of Patent: December 25, 2018Assignee: Nichia CorporationInventors: Masato Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki
-
Publication number: 20180006205Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: ApplicationFiled: August 31, 2017Publication date: January 4, 2018Applicant: NICHIA CORPORATIONInventors: Masato FUJITOMO, Hiroto TAMAKI, Shinji NISHIJIMA, Yuichiro TANDA, Tomohide MIKI
-
Patent number: 9773959Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: GrantFiled: January 22, 2015Date of Patent: September 26, 2017Assignee: NICHIA CORPORATIONInventors: Masato Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki
-
Publication number: 20150129923Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: ApplicationFiled: January 22, 2015Publication date: May 14, 2015Applicant: NICHIA CORPORATIONInventors: Masato FUJITOMO, Hiroto TAMAKI, Shinji NISHIJIMA, Yuichiro TANDA, Tomohide MIKI
-
Patent number: 8987853Abstract: A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.Type: GrantFiled: January 10, 2014Date of Patent: March 24, 2015Assignee: Nichia CorporationInventors: Shinji Nishijima, Tomohide Miki, Hiroto Tamaki
-
Patent number: 8975100Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: GrantFiled: October 21, 2013Date of Patent: March 10, 2015Assignee: Nichia CorporationInventors: Masato Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki
-
Publication number: 20140191278Abstract: A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.Type: ApplicationFiled: January 10, 2014Publication date: July 10, 2014Applicant: NICHIA CORPORATIONInventors: Shinji NISHIJIMA, Tomohide MIKI, Hiroto TAMAKI
-
Patent number: 8659106Abstract: A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.Type: GrantFiled: October 28, 2010Date of Patent: February 25, 2014Assignee: Nichia CorporationInventors: Shinji Nishijima, Tomohide Miki, Hiroto Tamaki
-
Publication number: 20140042488Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: ApplicationFiled: October 21, 2013Publication date: February 13, 2014Applicant: NICHIA CORPORATIONInventors: Masato FUJITOMO, Hiroto TAMAKI, Shinji NISHIJIMA, Yuichiro TANDA, Tomohide MIKI
-
Patent number: 8604507Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: GrantFiled: September 22, 2011Date of Patent: December 10, 2013Assignee: Nichia CorporationInventors: Masato Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki
-
Patent number: 8377725Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: GrantFiled: September 8, 2009Date of Patent: February 19, 2013Assignee: Nichia CorporationInventors: Masato Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki
-
Publication number: 20120018772Abstract: A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.Type: ApplicationFiled: October 28, 2010Publication date: January 26, 2012Applicant: NICHIA CORPORATIONInventors: Shinji Nishijima, Tomohide Miki, Hiroto Tamaki
-
Publication number: 20120007127Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: ApplicationFiled: September 22, 2011Publication date: January 12, 2012Inventors: Masahito Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki
-
Patent number: 7687823Abstract: A light-emitting apparatus includes a package including a support having a central section and a peripheral section around the central section. The central section is raised upwardly from the peripheral section, providing a pedestal for supporting a light-emitting device. A light-emitting device secured on an upper surface of the pedestal and has electrodes. Electrically conductive members are provided on a peripheral region of the package and electrically connected to the electrodes of the light-emitting device. A color conversion layer covers the light-emitting device. A light-transmitting member is formed in the package, sealing at least the light-emitting device together with the color conversion layer. The pedestal has its side surface at least partially exposed from the color conversion layer.Type: GrantFiled: December 21, 2007Date of Patent: March 30, 2010Assignee: Nichia CorporationInventors: Takahiro Amo, Shinji Nishijima, Satoshi Okada, Yoshifumi Hodono
-
Publication number: 20100059782Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.Type: ApplicationFiled: September 8, 2009Publication date: March 11, 2010Applicant: NICHIA CORPORATIONInventors: Masahito Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki