Abstract: A laser cutting device includes a control unit which sets a steady oxygen concentration, a moving speed of a laser nozzle and laser beam steady control conditions based on a material and a plate thickness of the workpiece, decreases the moving speed of the laser nozzle to a first setting speed when the laser nozzle arrives a first setting position in front of an end point of a cutting trajectory, and decreases a relative moving speed of the laser nozzle to a second setting speed by varying the oxygen concentration of the cutting gas and the control condition of the laser beam when the laser nozzle arrives at a second setting position.

Abstract: A laser cutting nozzle configured such that a laser beam is irradiated through a nozzle hole formed in a nozzle main body from an opening of the nozzle hole, and an assist gas surrounding the laser beam is emitted. The nozzle hole includes a first control flow path, a second control flow path, and a third control flow path formed in a coaxial cylindrical shape, in sequence from upstream toward downstream in a flow direction of the assist gas. If a diameter of the first control flow path is ?A, a diameter of the second control flow path is ?B, and a diameter of the third control flow path is ?C, an equation ?A<?C<?B is satisfied.

Abstract: A laser cutting device includes a control unit which sets a steady oxygen concentration, a moving speed of a laser nozzle and laser beam steady control conditions based on a material and a plate thickness of the workpiece, decreases the moving speed of the laser nozzle to a first setting speed when the laser nozzle arrives a first setting position in front of an end point of a cutting trajectory, and decreases a relative moving speed of the laser nozzle to a second setting speed by varying the oxygen concentration of the cutting gas and the control condition of the laser beam when the laser nozzle arrives at a second setting position.

Abstract: A laser cutting nozzle configured such that a laser beam is irradiated through a nozzle hole formed in a nozzle main body from an opening of the nozzle hole, and an assist gas surrounding the laser beam is emitted. The nozzle hole includes a first control flow path, a second control flow path, and a third control flow path formed in a coaxial cylindrical shape, in sequence from upstream toward downstream in a flow direction of the assist gas. If a diameter of the first control flow path is ?A, a diameter of the second control flow path is ?B, and a diameter of the third control flow path is ?C, an equation ?A<?C<?B is satisfied.

Abstract: A processing apparatus is provided in which a laser beam L2 is irradiated onto a processing portion of a workpiece W, and at the same time as the laser irradiation, an assist gas G is injected toward the processing portion from a nozzle 3 arranged concentric to the laser beam L2 so that the processing portion is covered with the assist gas G, thereby processing a piercing hole H on the processing portion. The apparatus includes control means 10 for processing a piercing hole H while moving the nozzle 3 within the range of 5 mm from a processing start point after the irradiation of the laser beam L2 is started.

Abstract: A processing apparatus is provided in which a laser beam L2 is irradiated onto a processing portion of a workpiece W, and at the same time as the laser irradiation, an assist gas G is injected toward the processing portion from a nozzle 3 arranged concentric to the laser beam L2 so that the processing portion is covered with the assist gas G, thereby processing a piercing hole H on the processing portion. The apparatus includes control means 10 for processing a piercing hole H while moving the nozzle 3 within the range of 5 mm from a processing start point after the irradiation of the laser beam L2 is started.

Abstract: A laser processing apparatus has a first laser beam reversal apparatus which reverses the laser beam from the laser oscillator, and a second laser beam reversal apparatus which reverses the laser beam reversed by the first laser beam reversal apparatus, and guides the laser beam to the inside of the processing head, in which a first laser optical path which runs from the laser oscillator to the first laser beam reversal apparatus, a second laser optical path which runs form the first laser beam reversal apparatus to the second laser beam reversal apparatus, and a third laser optical path which runs from the second laser beam reversal apparatus to the processing head are parallel.

Abstract: A laser processing apparatus has a first laser beam reversal apparatus which reverses the laser beam from the laser oscillator, and a second laser beam reversal apparatus which reverses the laser beam reversed by the first laser beam reversal apparatus, and guides the laser beam to the inside of the processing head, in which a first laser optical path which runs from the laser oscillator to the first laser beam reversal apparatus, a second laser optical path which runs form the first laser beam reversal apparatus to the second laser beam reversal apparatus, and a third laser optical path which runs from the second laser beam reversal apparatus to the processing head are parallel.

Abstract: The present invention stably supplies a side blow gas to a piercing site and prevents the adherence of spatter to a cutting nozzle. A hood, which is attached to a side blow gas nozzle, guides side blow gas jetted from a side blow gas nozzle to the piercing site and prevents spatter from adhering to the cutting nozzle as laser beam and assist gas are respectively radiated or jetted onto a cutting material through a communicating hole.

Abstract: In a piercing operation prior to the laser cutting of steel, etc., the development of a technology in which a piercing hole of the intended shape is obtained in a short time, even for a thick cut work. An oxygen gas coaxial to the laser beam applied towards the cut work and a low concentration gas with a low oxygen concentration and major components comprising nitrogen gas, air, or a mixture thereof discharged from an outer gas nozzle disposed so as to surround the outer side of the flow of this oxygen gas is supplied and disposed towards said cut work, and can realize shortening of the time, etc., of the piercing operation time by applying a laser beam to the cut work. In addition, a laser processing nozzle provided with an inner gas nozzle which discharges oxygen gas and an outer gas nozzle which discharges low concentration gas, and a laser cutting apparatus provided with this nozzle is provided.

Abstract: The present invention stably supplies a side blow gas to a piercing site and prevents the adherence of spatter to a cutting nozzle. A hood, which is attached to a side blow gas nozzle, guides side blow gas jetted from a side blow gas nozzle to the piercing site and prevents spatter from adhering to the cutting nozzle as laser beam and assist gas are respectively radiated or jetted onto a cutting material through a communicating hole.