Patents by Inventor Shinji Okamoto

Shinji Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100289172
    Abstract: An ethylene-vinyl alcohol copolymer alcohol solution comprising an ethylene-vinyl alcohol copolymer and an alcohol having a carbon number of not greater than 4 is brought into contact with an aqueous solution of at least one additive selected from a carboxylic compound, a boron compound and a phosphoric compound to replace a part or all of the alcohol with water, whereby an ethylene-vinyl alcohol copolymer composition containing the additive is prepared. This preparation process makes it possible to efficiently replace the alcohol in the ethylene-vinyl alcohol copolymer alcohol solution with water, and homogeneously incorporate the thermal stabilizer in the composition.
    Type: Application
    Filed: December 22, 2008
    Publication date: November 18, 2010
    Inventors: Keisuke Fujimura, Yasufumi Beniya, Akio Harao, Yoshiharu Nagao, Shinji Okamoto
  • Publication number: 20100266753
    Abstract: The present invention provides a connector chip capable of preventing electrical shorting between adjoining electrodes and also capable of readily connecting a plurality of electrodes on a first circuit substrate and a plurality of electrodes on a second circuit substrate without using a dedicated mounting device or the like. A plurality of conductive paths 5 are formed on an outer periphery surface constituted by continuous four surfaces 9A to 9D of an insulating substrate 3 including six surfaces of the surfaces 9A to 9D and surfaces 9E and 9F. Each of the conductive paths 5 goes round on the outer periphery surface. The conductive paths 5 are formed on the outer periphery surface at a predetermined interval in an opposing direction in which the remaining two surfaces 9E and 9F are opposing to each other. Each of insulating layers 7 having a property of repelling molten solder is formed between portions of each two adjoining conductive paths located on a pair of the surfaces 9A and 9B.
    Type: Application
    Filed: June 30, 2010
    Publication date: October 21, 2010
    Applicant: HOKURIKU ELECTRIC INDUSTRY CO., LTD.
    Inventors: Shinji Okamoto, Katsumi Takeuchi, Yutaka Nomura
  • Patent number: 7434828
    Abstract: Disclosed is a molded member with a foamed body, which is foamed on the top surface sides of a first member and a second member and is prevented from leaking from between abutment surfaces of those members toward the back side. A seal piece of a required width extending in an eaves form outward over the perimeter of the outer contour edge of an airbag door is provided at the outer contour edge. When the airbag door is laid out at a door mount portion, so formed as to surround an opening formed in a base material, the seal piece is set in close contact with the outer surface of the door mount portion in such a way as to surround the opening. This prevents the foamed body, foamed on the top surface side of the base material facing the airbag door, from leaking from a clearance, produced between abutment surface of the base material and the airbag door, toward the back side.
    Type: Grant
    Filed: March 22, 2005
    Date of Patent: October 14, 2008
    Assignee: Inoac Corporation
    Inventors: Shinji Okamoto, Hiroshi Suzuki, Tomohiro Chiba
  • Publication number: 20070072454
    Abstract: The present invention provides a connector chip capable of preventing electrical shorting between adjoining electrodes and also capable of readily connecting a plurality of electrodes on a first circuit substrate and a plurality of electrodes on a second circuit substrate without using a dedicated mounting device or the like. A plurality of conductive paths 5 are formed on an outer periphery surface constituted by continuous four surfaces 9A to 9D of an insulating substrate 3 including six surfaces of the surfaces 9A to 9D and surfaces 9E and 9F. Each of the conductive paths 5 goes round on the outer periphery surface. The conductive paths 5 are formed on the outer periphery surface at a predetermined interval in an opposing direction in which the remaining two surfaces 9E and 9F are opposing to each other. Each of insulating layers 7 having a property of repelling molten solder is formed between portions of each two adjoining conductive paths located on a pair of the surfaces 9A and 9B.
    Type: Application
    Filed: November 12, 2004
    Publication date: March 29, 2007
    Applicant: HOKURIKU ELECTRIC INDUSTRY CO., LTD.
    Inventors: Shinji Okamoto, Katsumi Takeuchi, Yutaka Nomura
  • Publication number: 20060214399
    Abstract: Disclosed is a molded member with a foamed body, which is foamed on the top surface sides of a first member and a second member and is prevented from leaking from between abutment surfaces of those members toward the back side. A seal piece of a required width extending in an eaves form outward over the perimeter of the outer contour edge of an airbag door is provided at the outer contour edge. When the airbag door is laid out at a door mount portion, so formed as to surround an opening formed in a base material, the seal piece is set in close contact with the outer surface of the door mount portion in such a way as to surround the opening. This prevents the foamed body, foamed on the top surface side of the base material facing the airbag door, from leaking from a clearance, produced between abutment surface of the base material and the airbag door, toward the back side.
    Type: Application
    Filed: March 22, 2005
    Publication date: September 28, 2006
    Inventors: Shinji Okamoto, Hiroshi Suzuki, Tomohiro Chiba
  • Patent number: 6222935
    Abstract: A pattern inspection method capable of providing an improved inspection reliability includes the following steps. A pattern classification is set every pixel-value range of a reference-image data obtained from a reference pattern. Each of the pattern classifications has reference-data preparing parameters. With respect to each pixel of the reference-image data, pixel values of a pixel window which is composed of the pixel as a center pixel and neighbor pixels around the center pixel are checked to prepare a reference data. When all of the pixels in the pixel window are within a single pixel-value range, the center pixel is decided as a pattern uniform portion, and the reference data is prepared according to the parameters of a corresponding pattern classification.
    Type: Grant
    Filed: February 22, 1999
    Date of Patent: April 24, 2001
    Assignee: Matsushita Electric Works, Ltd.
    Inventor: Shinji Okamoto
  • Patent number: 5884296
    Abstract: A device for discriminating an attribute of an image in a block area contained in a document image includes a device for performing a Fourier transformation based on image data in the block area and for determining a spatial frequency spectrum relating to the image in the block area; and a neural network for outputting a discrimination result as to whether or not the attribute of the image in the block area is a halftone dot image based on the spatial frequency spectrum output from the Fourier transform device.
    Type: Grant
    Filed: March 11, 1996
    Date of Patent: March 16, 1999
    Assignee: Minolta Co., Ltd.
    Inventors: Kazuaki Nakamura, Shinji Yamamoto, Makoto Niioka, Tetsuya Itoh, Shinji Okamoto
  • Patent number: 5773085
    Abstract: One kind of element belonging to I group or II group and one kind of binary compound including one kind of element belonging to III group and one kind of element selected from the group consisting of S, Se, Te and O are evaporated respectively by means of a vacuum vapor deposition method or molecular beam epitaxial method to produce a ternary compound semiconductor material having a low vapor pressure, and the thus produced ternary compound semiconductor material is deposited on a substrate to form a ternary compound semiconductor thin film. Particularly, when a phosphor thin film for electroluminescence emitting blue light is to be grown, an element Sr and a binary compound Ga.sub.2 S.sub.3 are respectively evaporated by the vacuum evaporation method or molecular beam epitaxial method to deposit a ternary compound semiconductor material SrGa.sub.2 S.sub.
    Type: Grant
    Filed: June 12, 1996
    Date of Patent: June 30, 1998
    Assignee: Nippon Hoso Kyokai
    Inventors: Yoji Inoue, Katsu Tanaka, Shinji Okamoto, Kikuo Kobayashi
  • Patent number: 5280221
    Abstract: A cold cathode device includes a first electrode formed on a substrate, an insulating film formed on the first electrode, a thin film formed on the insulating film and for generating hot electrons, a second electrode formed on the thin film. Electrons are injected from the second electrode at a first half cycle of each cycle of an a.c. voltage. The injected electrons form a space charge layer between the insulating film and the thin film. At a second half cycle of each cycle, the hot electrons are generated from the electrons stored in the space charge layer inside of the thin film, and emitted from the second electrode.
    Type: Grant
    Filed: November 20, 1991
    Date of Patent: January 18, 1994
    Assignee: Nippon Hoso Kyokai
    Inventors: Shinji Okamoto, Eiichiro Nakazawa
  • Patent number: 5102226
    Abstract: An optical object profile measurement system utilizes a light beam to scan an object surface and a position detector which receives a light beam reflected from the object surface to obtain position data of individual scanned points on the object surface. The position data is processed to determine a profile of the object profile along the scanned points. The position detector comprises a number of light receiving elements arranged in at least two linear arrays each extending in the direction of following the light beam moving across the object surface and is divided into subdivisions having one or more of the light receiving elements. The arrays are disposed side-by-side to receive the light beam. In a first one of the arrays, the light receiving elements are designated by first values which have differing subdivisions such that the elements designated by the same first value are coupled to provide a single first output when any one of such elements detects the light beam.
    Type: Grant
    Filed: January 11, 1990
    Date of Patent: April 7, 1992
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Kazunari Yoshimura, Shinji Okamoto
  • Patent number: 5021892
    Abstract: An image processing device for controlling data transfer includes an image scanner, an image printer, a facsimile control unit, bus lines for data transfer, a bidirectional parallel interface unit, and a main CPU in a housing. The device is connected to an external data processing device through the parallel interface unit. In addition to the functions which are obtained independent from the external data processing device, the image processing device realizes various kinds of functions by controlling the image scanner, the image printer facsimile control unit and the interface unit by the main CPU in response to commands from the data processing device. As a result, various kinds of image processing functions are carried out.
    Type: Grant
    Filed: December 26, 1989
    Date of Patent: June 4, 1991
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Toshiro Kita, Susumu Genba, Masato Takemoto, Takashi Tatsumi, Toshiyuki Itoga, Yutaka Iizuka, Satoshi Tominaga, Mikio Higashiyama, Akira Tanimoto, Shinji Okamoto, Toshihiko Yoshida
  • Patent number: 4931500
    Abstract: A hydrolyzed ethylene-vinyl acetate copolymer having an ethylene content of 20 to 60% by mole and a defree of hydrolysis in the vinyl acetate component of at least 95% by mole, having an ash content of not more than 20 ppm and an alkali metal content of not more than 5 ppm, and having a ratio of the melt viscosity at 220.degree. C. after maintaining the copolymer at 220.degree. C. for 60 minutes to the melt viscosity at 220.degree. C. after maintaining the copolymer at 220.degree. C. for 5 minutes of 1.0 to 1.5. The hydrolyzed copolymer of the invention can give the films whose gas impermeability is not lowered even at high humidity, and is applicable to long-run molding.
    Type: Grant
    Filed: August 19, 1988
    Date of Patent: June 5, 1990
    Assignee: Nippon Gohsei Kagaku Kogyo Kabushiki Kaisha
    Inventors: Shinji Okamoto, Masaaki Minakawa, Youiti Neki, Masasi Nakagire
  • Patent number: 4910607
    Abstract: An image processing device for controlling data transfer includes an image scanner, an image printer, a facsimile control unit, bus lines for data transfer, a bidirectional parallel interface unit, and a main CPU in a housing. The device is connected to an external data processing device through the parallel interface unit. In addition to the functions which are obtained independent from the external data processing device, the image processing device realizes various kinds of functions by controlling the image scanner, the image printer facsimile control unit and the interface unit by the main CPU in response to commands from the data processing device. As a result, various kinds of image processing functions are carried out.
    Type: Grant
    Filed: September 30, 1987
    Date of Patent: March 20, 1990
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Toshiro Kita, Susumu Genba, Masato Takemoto, Takashi Tatsumi, Toshiyuki Itoga, Yutaka Iizuka, Satoshi Tominaga, Mikio Higashiyama, Akira Tanimoto, Shinji Okamoto, Toshihiko Yoshida
  • Patent number: 4904723
    Abstract: A composition comprising(1) a hydrolyzed ethylene-vinyl acetate copolymer having an ethylene content of 20 to 60% by mole and a degree of hydrolysis in the vinyl acetate component of at least 95% by mole and(2) a secondary or tertiary alkali metal phosphate; the alkali metal content being from 15 to 250 ppm of the hydrolyzed copolymer (1) and the phosphorus content being from 5 to 70 ppm of the hydrolyzed copolymer (1). The composition of the invention is excellent in adhesive strength to unsaturated carboxylic acid-modified polyolefins, and therefore the laminate having the structure the polyolefin layer/the unsaturated carboxylic acid-modified polyolefin layer/the hydrolyzed ethylene-vinyl acetate copolymer composition of the invention layer has excellent adhesive strength between the unsaturated carboxylic acid-modified polyolefin layer and the layer of the composition of the present invention.
    Type: Grant
    Filed: August 26, 1988
    Date of Patent: February 27, 1990
    Assignee: Nippon Gohsei Kagaku Kogyo Kabushiki Kaisha
    Inventors: Tomoyoshi Uemura, Shinji Okamoto, Takamasa Moriyama, Kuniyoshi Asano, Hiroshi Takida
  • Patent number: 4857589
    Abstract: A hydrolyzed ethylene-vinyl acetate copolymer having an ethylene content of 20 to 60% by mole and a defree of hydrolysis in the vinyl acetate component of at least 95% by mole, and having an ash content of not more than 20 ppm and an alkali metal content of not more than 5 ppm. The hydrolyzed copolymer of the invention can form films whose gas impermeability is not lowered even at high humidity.
    Type: Grant
    Filed: July 15, 1987
    Date of Patent: August 15, 1989
    Assignee: Nippon Gohsei Kagaku Kogyo Kabushiki Kaisha
    Inventors: Shinji Okamoto, Masaaki Minakawa, Youiti Neki, Masasi Nakagiri
  • Patent number: 4708545
    Abstract: A method for drilling reference holes in a multi-layer printed wiring board assembly, in which drilling position marks provided on inner-layer circuit board in the assembly are roughly detected through each of two outer-layer boards of the assembly, a spot-facing is made with respect to the outer-layer boards at roughly detected points of the marks, and thereafter the marks are precisely detected at the faced spots. Positions for drilling the reference holes can be thereby determined at the spots precisely in close proximity to the internally provided drilling position marks, to allow the drilling performed very accurately in simpler and economical manner.
    Type: Grant
    Filed: November 14, 1985
    Date of Patent: November 24, 1987
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Toshinori Fujii, Shinji Okamoto
  • Patent number: 4677473
    Abstract: A soldering inspection system wherein light is irradiated on a soldered part at different incident angles by a light emitting means to collect information indicative of three-dimensional configuration of the soldered part and discriminate whether or not the configuration is acceptable. The three-dimensional configurational information can be obtained with light irradiated at least from two positions mutually of different angles with respect to the soldered part, the inspection is thereby made from quantitative viewpoint, and a highly precise result of the inspection is obtainable.
    Type: Grant
    Filed: November 7, 1985
    Date of Patent: June 30, 1987
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Shinji Okamoto, Kazunari Yoshimura, Tomoharu Nakahara