Patents by Inventor Shinji OMATA

Shinji OMATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MANUFACTURING SUBSTRATE AND THE SAME SUBSTRATE
    Publication number: 20200335394
    Abstract: To prevent a tin alloy from coming into contact with a copper wiring layer when a tin alloy bump layer is reflowed. According to an aspect of the present invention, a method of manufacturing a substrate having a bump at a resist opening is provided. The method of manufacturing a substrate includes a step of forming a copper wiring layer on the substrate by plating at a first temperature, a step of forming a barrier layer on the copper wiring layer by plating at a second temperature that is approximately equal to the first temperature, and a step of forming a tin alloy bump layer on the barrier layer by plating.
    Type: Application
    Filed: March 29, 2017
    Publication date: October 22, 2020
    Inventors: Keiichi KURASHINA, Taiki ISHITSUKA, Shinji OMATA, Mitsuhiro SHAMOTO, Makoto KUBOTA