Abstract: A semiconductor device includes a semiconductor part, first and second electrodes. The semiconductor part is provided between the first and second electrodes. A method of manufacturing the device includes forming the first electrode covering a back surface of a wafer after the second electrode is formed on a front surface of the wafer; forming a first groove by selectively removing the first electrode; and dividing the wafer by forming a second groove at the front surface side. The wafer includes a region to be the semiconductor part; and the first and second grooves are provided along a periphery of the region. The first groove is in communication with the first groove. The second groove has a width in a direction along the front surface of the wafer, the width of the first groove being narrower than a width of the first groove in the same direction.

Abstract: A semiconductor device includes a semiconductor part, a first electrode and a second electrode. The semiconductor part includes a first semiconductor layer of a first conductivity type and a second semiconductor layer of a second conductivity type. The first electrode is provided on a front surface of the semiconductor part. The second semiconductor layer is provided between the first semiconductor layer and the first electrode. The second electrode is provided on a back surface of the semiconductor part at a side opposite to the front surface. The second electrode includes an extension part extending outward from an outer edge of the back surface.

Abstract: A semiconductor device includes a semiconductor part, first and second electrodes. The semiconductor part is provided between the first and second electrodes. A method of manufacturing the device includes forming the first electrode covering a back surface of a wafer after the second electrode is formed on a front surface of the wafer; forming a first groove by selectively removing the first electrode; and dividing the wafer by forming a second groove at the front surface side. The wafer includes a region to be the semiconductor part; and the first and second grooves are provided along a periphery of the region. The first groove is in communication with the first groove. The second groove has a width in a direction along the front surface of the wafer, the width of the first groove being narrower than a width of the first groove in the same direction.

Abstract: A semiconductor device includes a semiconductor part, first and second electrodes. The semiconductor part is provided between the first and second electrodes. A method of manufacturing the device includes forming the first electrode covering a back surface of a wafer after the second electrode is formed on a front surface of the wafer; forming a first groove by selectively removing the first electrode; and dividing the wafer by forming a second groove at the front surface side. The wafer includes a region to be the semiconductor part; and the first and second grooves are provided along a periphery of the region. The first groove is in communication with the first groove. The second groove has a width in a direction along the front surface of the wafer, the width of the first groove being narrower than a width of the first groove in the same direction.

Abstract: A semiconductor device includes a semiconductor part, first and second electrodes. The semiconductor part is provided between the first and second electrodes. A method of manufacturing the device includes forming the first electrode covering a back surface of a wafer after the second electrode is formed on a front surface of the wafer; forming a first groove by selectively removing the first electrode; and dividing the wafer by forming a second groove at the front surface side. The wafer includes a region to be the semiconductor part; and the first and second grooves are provided along a periphery of the region. The first groove is in communication with the first groove. The second groove has a width in a direction along the front surface of the wafer, the width of the first groove being narrower than a width of the first groove in the same direction.

Abstract: A system for sharing profits gain from an agency service, includes a storage module for storing amounts of share target money, which should be shared to a plurality of providers, of profits obtained by operating for a predetermined period an agency service for providing users with a plurality of services provided from a plurality of providers, and a calculation module for calculating an amount of shared money allocated to each service from within the amount of share target money stored in the storage module on the basis of a frequency of providing each service during the predetermined period.

Abstract: A computer has a character input function, and is provided with a detecting section which detects a keyword specified by one or more input characters, a display section which displays a menu screen indicating registered dictionaries when the keyword is detected, and an issuing section which issues a search request for dictionary data specified by the keyword in a dictionary which is selected as a search target on the menu screen with respect to a dictionary search program.