Patents by Inventor Shinji Onzuka

Shinji Onzuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220246734
    Abstract: A semiconductor device includes a semiconductor part, first and second electrodes. The semiconductor part is provided between the first and second electrodes. A method of manufacturing the device includes forming the first electrode covering a back surface of a wafer after the second electrode is formed on a front surface of the wafer; forming a first groove by selectively removing the first electrode; and dividing the wafer by forming a second groove at the front surface side. The wafer includes a region to be the semiconductor part; and the first and second grooves are provided along a periphery of the region. The first groove is in communication with the first groove. The second groove has a width in a direction along the front surface of the wafer, the width of the first groove being narrower than a width of the first groove in the same direction.
    Type: Application
    Filed: April 20, 2022
    Publication date: August 4, 2022
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Shinji NUNOTANI, Shinji ONZUKA
  • Patent number: 11342426
    Abstract: A semiconductor device includes a semiconductor part, first and second electrodes. The semiconductor part is provided between the first and second electrodes. A method of manufacturing the device includes forming the first electrode covering a back surface of a wafer after the second electrode is formed on a front surface of the wafer; forming a first groove by selectively removing the first electrode; and dividing the wafer by forming a second groove at the front surface side. The wafer includes a region to be the semiconductor part; and the first and second grooves are provided along a periphery of the region. The first groove is in communication with the first groove. The second groove has a width in a direction along the front surface of the wafer, the width of the first groove being narrower than a width of the first groove in the same direction.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: May 24, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Shinji Nunotani, Shinji Onzuka
  • Publication number: 20210066130
    Abstract: A semiconductor device includes a semiconductor part, first and second electrodes. The semiconductor part is provided between the first and second electrodes. A method of manufacturing the device includes forming the first electrode covering a back surface of a wafer after the second electrode is formed on a front surface of the wafer; forming a first groove by selectively removing the first electrode; and dividing the wafer by forming a second groove at the front surface side. The wafer includes a region to be the semiconductor part; and the first and second grooves are provided along a periphery of the region. The first groove is in communication with the first groove. The second groove has a width in a direction along the front surface of the wafer, the width of the first groove being narrower than a width of the first groove in the same direction.
    Type: Application
    Filed: February 27, 2020
    Publication date: March 4, 2021
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Shinji NUNOTANI, Shinji ONZUKA
  • Publication number: 20020082854
    Abstract: A system for sharing profits gain from an agency service, includes a storage module for storing amounts of share target money, which should be shared to a plurality of providers, of profits obtained by operating for a predetermined period an agency service for providing users with a plurality of services provided from a plurality of providers, and a calculation module for calculating an amount of shared money allocated to each service from within the amount of share target money stored in the storage module on the basis of a frequency of providing each service during the predetermined period.
    Type: Application
    Filed: July 10, 2001
    Publication date: June 27, 2002
    Applicant: Fujitsu Limited
    Inventors: Takashi Furuta, Masahiro Kataoka, Shinji Onzuka, Akio Okuhata
  • Publication number: 20020007382
    Abstract: A computer has a character input function, and is provided with a detecting section which detects a keyword specified by one or more input characters, a display section which displays a menu screen indicating registered dictionaries when the keyword is detected, and an issuing section which issues a search request for dictionary data specified by the keyword in a dictionary which is selected as a search target on the menu screen with respect to a dictionary search program.
    Type: Application
    Filed: January 26, 2001
    Publication date: January 17, 2002
    Inventors: Shinichi Nojima, Manabu Nanba, Toshio Oshima, Shinji Onzuka