Abstract: A capacitor disposed inside a multilayer substrate that includes a conductive pattern on a surface thereof and an anode portion having a first conductive metal member and a porous portion disposed on a surface of the first conductive metal member, a cathode portion, and a dielectric layer disposed between the anode portion and the cathode portion. Moreover, the anode portion is led out to a surface side of the multilayer substrate by a connection electrode including an alloy layer containing a metal forming the first conductive metal member and a conductive layer disposed on the alloy layer, and in which the connection electrode is connected to the conductive pattern formed on the surface of the multilayer substrate.

Abstract: An inductor component comprising a main body part including a magnetic layer containing a resin and a metal magnetic powder contained in the resin; an inductor wiring disposed in the main body part; an external terminal exposed from the main body part; and a lead-out wiring electrically connecting the inductor wiring and the external terminal. Also, an outer surface of the external terminal includes a concave part.

Abstract: An inductor component including a magnetic layer in which a magnetic metal powder is dispersedly present in a base material made of an insulation material and an inductor wiring line laminated on a surface of the magnetic layer. The inductor wiring line includes an anchor portion extending from a main face of the inductor wiring line on a side of the magnetic layer and covering a surface of the magnetic metal powder in the magnetic layer.

Abstract: An inductor component includes a base, an inductor device disposed in the base, and an external terminal serving as a line that is disposed on the base and that is electrically coupled to the inductor device. The external terminal includes a first metal film that is in contact with the base and that is electrically conductive, a second metal film disposed on a side of the first metal film opposite to the base, the second metal film having resistance to solder leaching, and a catalytic layer disposed between the first metal film and the second metal film. The first metal film includes a pore portion adjacent to the catalytic layer.

Abstract: An electronic component includes a composite body composed of a composite material of a resin and a magnetic metal powder and a metal film disposed on an outer surface of the composite body. The magnetic metal powder contains Fe. The metal film mainly contains Cu, further contains Fe, and is in contact with the resin and the magnetic metal powder.

Abstract: A multilayer metal film disposed on a base having insulating properties includes a first metal film that is in contact with the base and that is electrically conductive, a second metal film covering the first metal film from a side of the first metal film opposite to the base, the second metal film having resistance to solder leaching, and a catalytic layer disposed between the first metal film and the second metal film, the catalytic layer having a protruding portion protruding toward the second metal film, the protruding portion extending into the second metal film.

Abstract: An electronic component including a component body, and an external electrode on a surface of the component body. The external electrode includes a layer having an alloy of at least one first metal and at least one second metal, the at least one first metal is selected from the group consisting of metals of Group 9 to Group 11 of the Periodic Table, the at least one second metal has a melting point higher than that of the at least one first metal. In the layer having the alloy, a concentration of the at least one second metal continuously changes in a thickness direction of the external electrode, at least one first portion has the concentration of the at least one second metal increasing in the thickness direction, and at least one second portion has the concentration of the at least one second metal decreasing in the thickness direction.

Abstract: An electronic component includes a composite body composed of a composite material of a resin and a magnetic metal powder and a metal film disposed on an outer surface of the composite body. The magnetic metal powder contains Fe. The metal film mainly contains Ni and is in contact with the resin and the magnetic metal powder.

Abstract: A base includes a main body and a multilayer metal film disposed on the main body. The multilayer metal film includes a first metal film disposed on the main body, the first metal film having conductivity, second metal film on the first metal film and above the main body, the second metal film having resistance to solder leaching, and a third metal film on the second metal film, the third metal film having wettability. The third metal film includes an inwardly extended portion extending between the second metal film and the main body.

Abstract: A method for manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming a plurality of internal electrode patterns on a main surface of the ceramic green sheet, applying a ceramic paste above the main surface of the ceramic green sheet, stacking a plurality of the ceramic green sheets, pressing the plurality of stacked ceramic green sheets, and cutting the plurality of pressed ceramic green sheets. The ceramic paste at least partially overlaps end portions of the internal electrode patterns, and a stepped region is provided on the ceramic green sheet. When cutting the ceramic green sheets in a first direction, the cutting is performed at a position of the stepped region between two of the internal electrode patterns adjacent to each other in a second direction.

Abstract: An insulating layer, which is composed of a material having a higher insulating property than a core, partially covers a surface of the core. A plating layer, which functions as an electrode, is stacked on a surface of the insulating layer. The surface area of the insulating layer is larger than the surface area of the plating layer and the plating layer is stacked inside a region covered by the insulating layer.

Abstract: A method for manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming a plurality of internal electrode patterns on a main surface of the ceramic green sheet, applying a ceramic paste above the main surface of the ceramic green sheet, stacking a plurality of the ceramic green sheets, pressing the plurality of stacked ceramic green sheets, and cutting the plurality of pressed ceramic green sheets. The ceramic paste at least partially overlaps end portions of the internal electrode patterns, and a stepped region is provided on the ceramic green sheet. When cutting the ceramic green sheets in a first direction, the cutting is performed at a position of the stepped region between two of the internal electrode patterns adjacent to each other in a second direction.

Abstract: A module is used in a semiconductor composite device that supplies a direct-current voltage adjusted by a voltage regulator including a semiconductor active element to a load. The module includes a capacitor layer including at least one capacitor portion forming a capacitor, a connection terminal used for electrical connection with at least one of the voltage regulator and the load, and a through-hole conductor formed to penetrate the capacitor portion in a thickness direction of the capacitor layer. The capacitor is electrically connected to at least one of the load and the voltage regulator with the through-hole conductor interposed between the load and the voltage regulator.

Abstract: A capacitor disposed inside a multilayer substrate that includes a conductive pattern on a surface thereof and an anode portion having a first conductive metal member and a porous portion disposed on a surface of the first conductive metal member, a cathode portion, and a dielectric layer disposed between the anode portion and the cathode portion. Moreover, the anode portion is led out to a surface side of the multilayer substrate by a connection electrode including an alloy layer containing a metal forming the first conductive metal member and a conductive layer disposed on the alloy layer, and in which the connection electrode is connected to the conductive pattern formed on the surface of the multilayer substrate.

Abstract: An electronic component including a component body, and an external electrode on a surface of the component body. The external electrode includes a layer having an alloy of at least one first metal and at least one second metal, the at least one first metal is selected from the group consisting of metals of Group 9 to Group 11 of the Periodic Table, the at least one second metal has a melting point higher than that of the at least one first metal. In the layer having the alloy, a concentration of the at least one second metal continuously changes in a thickness direction of the external electrode, at least one first portion has the concentration of the at least one second metal increasing in the thickness direction, and at least one second portion has the concentration of the at least one second metal decreasing in the thickness direction.

Abstract: An electronic component includes a composite body containing resin and magnetic metal particles, a first metal film provided on an outer surface of the composite body, and a second metal film provided on the first metal film. At least one of the magnetic metal particles is exposed at a contact surface of the composite body that is in contact with the first metal film. The first metal film is in contact with an exposed surface of the at least one of the magnetic metal particles exposed from the contact surface. The film thickness of the first metal film on the exposed surface is 2.9 ?m or more.

Abstract: An electronic component includes a composite body made of a composite material of resin and magnetic metal particles, an inner electrode which is provided in the composite body and which has an end surface exposed from an outer surface of the composite body, and a metal film provided on the outer surface of the composite body and on the end surface of the inner electrode. The metal film includes a first region provided on the end surface of the inner electrode and a second region which is in contact with the magnetic metal particles exposed at the outer surface of the composite body and which is provided on the outer surface of the composite body. The thickness of the first region is less than the thickness of the second region.

Abstract: An electronic component includes a main body made of an insulator, a circuit element positioned inside the main body, and outer electrodes. The outer electrodes are constituted of bottom surface electrodes and post-like electrodes. The post-like electrodes are extended from a bottom surface of the main body toward the interior of the main body. Further, the post-like electrodes are embedded in the main body, and parts of the post-like electrodes are exposed to side surfaces of the main body. Furthermore, the bottom surface electrodes are made of a resin containing metal powder.

Abstract: An inductor component including a magnetic layer in which a magnetic metal powder is dispersedly present in a base material made of an insulation material and an inductor wiring line laminated on a surface of the magnetic layer. The inductor wiring line includes an anchor portion extending from a main face of the inductor wiring line on a side of the magnetic layer and covering a surface of the magnetic metal powder in the magnetic layer.

Abstract: A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 ?m or more.