Patents by Inventor Shinji Saiki
Shinji Saiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11952509Abstract: The conductive composition of the present invention includes a conductive polymer (A) having an acidic group, and a basic compound (B) having a cyclic amide and an amino group in its molecule. The conductive film of the present invention is formed from the conductive composition. The laminate of the present invention includes a substrate; an electron beam resist layer, formed on at least one surface of the substrate; and a conductive film formed on the electron beam resist layer.Type: GrantFiled: September 21, 2020Date of Patent: April 9, 2024Assignee: Mitsubishi Chemical CorporationInventors: Masashi Uzawa, Shinji Saiki, Akira Yamazaki
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Publication number: 20230183806Abstract: Provided are a marker gene for detecting Parkinson's disease, and a method for detecting Parkinson's disease by using the marker gene. The method for detecting Parkinson's disease in a test subject comprises a step of measuring an expression level of at least one gene selected from the group of 4 genes consisting of SNORA16A, SNORA24, SNORA50 and REXO1L2P or an expression product thereof in a biological sample collected from the test subject.Type: ApplicationFiled: May 14, 2021Publication date: June 15, 2023Applicants: KAO CORPORATION, JUNTENDO EDUCATIONAL FOUNDATIONInventors: Yuya UEHARA, Takayoshi INOUE, Nobutaka HATTORI, Shinji SAIKI, Shin-Ichi UENO, Haruka TAKESHIGE
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Publication number: 20230135022Abstract: A conductive composition comprising a conductive polymer (A), a water-soluble polymer (B), and a solvent (C1), wherein: the water-soluble polymer (B) comprises a water-soluble polymer (B11) represented by formula (11), and an amount of a water-soluble polymer (B2) represented by formula (2) as the water-soluble polymer (B) is 0.15% by mass or less, based on a total mass of the conductive composition: wherein R1 denotes a linear or branched alkyl group with 6 to 20 carbon atoms, each of R4 and R5 independently denotes a methyl or ethyl group, R6 denotes a hydrophilic group, R7 denotes a hydrogen atom or a methyl group, Y1 denotes a single bond, —S—, —S(?O)—, —C(?O)—O— or —O—, Z denotes a cyano group or a hydroxy group, each of p1 and q denotes an average number of repetitions, and is a number of from 1 to 50, and m denotes a number of from 1 to 5.Type: ApplicationFiled: December 28, 2022Publication date: May 4, 2023Applicant: Mitsubishi Chemical CorporationInventors: Saki MAKIGAWA, Shinji SAIKI, Yoshiko IRIE, Masashi UZAWA, Akira YAMAZAKI
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Publication number: 20230107107Abstract: A conductive composition including a conductive polymer (A), a water-soluble polymer (B) other than the conductive polymer (A), and a solvent (C), wherein a peak area ratio is 0.44 or less, which is determined based on results of analysis performed using a high performance liquid chromatograph mass spectrometer with respect to a test solution obtained by extracting the water-soluble polymer (B) from the conductive composition with n-butanol, and calculated by formula (I): Area ratio=Y/(X+Y) wherein X is a total peak area of an extracted ion chromatogram prepared with respect to ions derived from compounds having a molecular weight (M) of 600 or more from a total ion current chromatogram, Y is a total peak area of an extracted ion chromatogram prepared with respect to ions derived from compounds having a molecular weight (M) of less than 600 from the total ion current chromatogram.Type: ApplicationFiled: December 9, 2022Publication date: April 6, 2023Applicant: Mitsubishi Chemical CorporationInventors: Akira YAMAZAKI, Shinji SAIKI, Yoshiko IRIE, Masashi UZAWA
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Patent number: 11572479Abstract: A conductive composition comprising a conductive polymer (A), a water-soluble polymer (B), and a solvent (C1), wherein: the water-soluble polymer (B) comprises a water-soluble polymer (B11) represented by formula (11), and an amount of a water-soluble polymer (B2) represented by formula (2) as the water-soluble polymer (B) is 0.15% by mass or less, based on a total mass of the conductive composition: wherein R1 denotes a linear or branched alkyl group with 6 to 20 carbon atoms, each of R4 and R5 independently denotes a methyl or ethyl group, R6 denotes a hydrophilic group, R7 denotes a hydrogen atom or a methyl group, Y1 denotes a single bond, —S—, —S(?O)—, —C(?O)—O— or —O—, Z denotes a cyano group or a hydroxy group, each of p1 and q denotes an average number of repetitions, and is a number of from 1 to 50, and m denotes a number of from 1 to 5.Type: GrantFiled: July 17, 2020Date of Patent: February 7, 2023Assignee: Mitsubishi Chemical CorporationInventors: Saki Makigawa, Shinji Saiki, Yoshiko Irie, Masashi Uzawa, Akira Yamazaki
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Publication number: 20210319927Abstract: The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010?/? or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.Type: ApplicationFiled: June 23, 2021Publication date: October 14, 2021Applicant: Mitsubishi Chemical CorporationInventors: Hiroya FUKUDA, Osamu Numata, Hironobu Ikeda, Toshio Nagasaka, Shinji Saiki, Hiroaki Iriyama, Masashi Uzawa, Asako Kaneko
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Patent number: 11145432Abstract: The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010?/? or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.Type: GrantFiled: February 20, 2018Date of Patent: October 12, 2021Assignee: Mitsubishi Chemical CorporationInventors: Hiroya Fukuda, Osamu Numata, Hironobu Ikeda, Toshio Nagasaka, Shinji Saiki, Hiroaki Iriyama, Masashi Uzawa, Asako Kaneko
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Publication number: 20210009818Abstract: The conductive composition of the present invention includes a conductive polymer (A) having an acidic group, and a basic compound (B) having a cyclic amide and an amino group in its molecule. The conductive film of the present invention is formed from the conductive composition. The laminate of the present invention includes a substrate; an electron beam resist layer, formed on at least one surface of the substrate; and a conductive film formed on the electron beam resist layer.Type: ApplicationFiled: September 21, 2020Publication date: January 14, 2021Applicant: Mitsubishi Chemical CorporationInventors: Masashi UZAWA, Shinji SAIKI, Akira YAMAZAKI
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CONDUCTIVE FILM, METHOD FOR PRODUCING SAME, CONDUCTOR, RESIST PATTERN FORMATION METHOD, AND LAMINATE
Publication number: 20210005343Abstract: The conductive film of the present invention includes a conductive polymer (A) and has a film thickness of 35 nm or less, wherein: a surface resistance of the conductive film is 1×1011 ?/sq. or less, and a standard deviation of current that flows through the conductive film upon application of voltage to the conductive film is 5 or less. The conductor of the present invention has a substrate, and the conductive film provided on at least a part of the surface of the substrate. The resist pattern forming method of the present invention includes a lamination step of forming the conductive film on a surface of a resist layer including a chemically amplified resist, said resist layer formed on one surface of a substrate, and an exposure step of irradiating the substrate with an electron beam according to a pattern on its side on which the conductive film is formed.Type: ApplicationFiled: September 2, 2020Publication date: January 7, 2021Applicant: Mitsubishi Chemical CorporationInventors: Saki MAKIGAWA, Akira YAMAZAKI, Naoko YAMADA, Yoshiko IRIE, Shinji SAIKI, Masashi UZAWA -
Publication number: 20200347244Abstract: A conductive composition comprising a conductive polymer (A), a water-soluble polymer (B), and a solvent (C1), wherein: the water-soluble polymer (B) comprises a water-soluble polymer (B11) represented by formula (11), and an amount of a water-soluble polymer (B2) represented by formula (2) as the water-soluble polymer (B) is 0.15% by mass or less, based on a total mass of the conductive composition: wherein R1 denotes a linear or branched alkyl group with 6 to 20 carbon atoms, each of R4 and R5 independently denotes a methyl or ethyl group, R6 denotes a hydrophilic group, R7 denotes a hydrogen atom or a methyl group, Y1 denotes a single bond, —S—, —S(?O)—, —C(?O)—O— or —O—, Z denotes a cyano group or a hydroxy group, each of p1 and q denotes an average number of repetitions, and is a number of from 1 to 50, and m denotes a number of from 1 to 5.Type: ApplicationFiled: July 17, 2020Publication date: November 5, 2020Applicant: Mitsubishi Chemical CorporationInventors: Saki MAKIGAWA, Shinji SAIKI, Yoshiko IRIE, Masashi UZAWA, Akira YAMAZAKI
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Publication number: 20190359833Abstract: A conductive composition including a conductive polymer (A), a water-soluble polymer (B) other than the conductive polymer (A), and a solvent (C), wherein a peak area ratio is 0.44 or less, which is determined based on results of analysis performed using a high performance liquid chromatograph mass spectrometer with respect to a test solution obtained by extracting the water-soluble polymer (B) from the conductive composition with n-butanol, and calculated by formula (I): Area ratio=Y/(X+Y) wherein X is a total peak area of an extracted ion chromatogram prepared with respect to ions derived from compounds having a molecular weight (M) of 600 or more from a total ion current chromatogram, Y is a total peak area of an extracted ion chromatogram prepared with respect to ions derived from compounds having a molecular weight (M) of less than 600 from the total ion current chromatogram.Type: ApplicationFiled: August 8, 2019Publication date: November 28, 2019Applicant: Mitsubishi Chemical CorporationInventors: Akira YAMAZAKI, Shinji SAIKI, Yoshiko IRIE, Masashi UZAWA
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Patent number: 10096395Abstract: The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010?/? or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.Type: GrantFiled: July 24, 2013Date of Patent: October 9, 2018Assignee: Mitsubishi Chemical CorporationInventors: Hiroya Fukuda, Osamu Numata, Hironobu Ikeda, Toshio Nagasaka, Shinji Saiki, Hiroaki Iriyama, Masashi Uzawa, Asako Kaneko
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Publication number: 20180174698Abstract: The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010?/? or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.Type: ApplicationFiled: February 20, 2018Publication date: June 21, 2018Applicant: Mitsubishi Chemical CorporationInventors: Hiroya FUKUDA, Osamu NUMATA, Hironobu IKEDA, Toshio NAGASAKA, Shinji SAIKI, Hiroaki IRIYAMA, Masashi UZAWA, Asako KANEKO
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Patent number: 9507077Abstract: A resin composition for a light guide article-preform is described, which enables the formation of a foamed layer having a large light scattering effect on the surface of a shaped article by laser irradiation processing at low cost. More specifically, the present invention relates to: a resin composition for a light guide article-preform, which contains a resin having a mass average molecular weight of 60,000 to 150,000, and has a 30% thermal mass reduction temperature of 310° C. or lower and a difference between a 40% thermal mass reduction temperature and a 20% thermal mass reduction temperature of 7° C. or less when a thermal mass measurement is performed with starting from the state at 100° C. under air at a temperature rising rate of 5° C./min.Type: GrantFiled: June 5, 2013Date of Patent: November 29, 2016Assignee: MITSUBISHI RAYON CO., LTD.Inventors: Fumiko Onuma, Minoru Shimizu, Kenji Yagi, Tomoyoshi Yamashita, Youhei Sechi, Yoshiya Kurachi, Shinji Saiki
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Publication number: 20150338568Abstract: A resin composition for a light guide article-preform is described, which enables the formation of a foamed layer having a large light scattering effect on the surface of a shaped article by laser irradiation processing at low cost. More specifically, the present invention relates to: a resin composition for a light guide article-preform, which contains a resin having a mass average molecular weight of 60,000 to 150,000, and has a 30% thermal mass reduction temperature of 310° C. or lower and a difference between a 40% thermal mass reduction temperature and a 20% thermal mass reduction temperature of 7° C. or less when a thermal mass measurement is performed with starting from the state at 100° C. under air at a temperature rising rate of 5° C./min.Type: ApplicationFiled: June 5, 2013Publication date: November 26, 2015Inventors: FUMIKO ONUMA, MINORU SHIMIZU, KENJI YAGI, TOMOYOSHI YAMASHITA, YOUHEI SECHI, YOSHIYA KURACHI, SHINJI SAIKI
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Publication number: 20150132537Abstract: The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010?/? or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.Type: ApplicationFiled: July 24, 2013Publication date: May 14, 2015Applicant: Mitsubishi Rayon Co., Ltd.Inventors: Hiroya Fukuda, Osamu Numata, Hironobu Ikeda, Toshio Nagasaka, Shinji Saiki, Hiroaki Iriyama, Masashi Uzawa, Asako Kaneko
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Publication number: 20090260752Abstract: A two-pack type plastisol composition comprising two liquid compositions (LA) and (LB), characterized in that the composition obtained by mixing the compositions (LA) and (LB) has a gelation time (as measured at 30.degree. C.) of 1 hour or shorter. It is a novel material which gels at ordinary temperature in 1 hour, preferably in several minutes, to come to have practically sufficient performances. The composition (LA) preferably comprises fine acrylic polymer particles (A) and a dispersion medium (B) in which the particles (A) are substantially insoluble at ordinary temperature (provided that the particles (A) may be soluble in the medium (B) at elevated temperatures). The composition (LB) preferably comprises an organic solvent (C) in which the particles (A) have sufficiently high solubility at ordinary temperature.Type: ApplicationFiled: June 23, 2009Publication date: October 22, 2009Applicant: Mitsubishi Rayon Co., Ltd.Inventors: Toshihiro KASAI, Shinji SAIKI
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Patent number: 7452931Abstract: A viscosity modifier for plastisol compositions which contains at least one selected from the group consisting of: (A) a compound having at least one of a carboxy group or a salt thereof, an alkoxy group, and a glycidyl group; (B) amine compounds; and (C) metal chelate compounds. A plastisol composition containing the viscosity modifier and a polymer. A product having a coating layer obtained from the composition. A molded product obtained by using the composition. This viscosity modifier has an excellent effect of decreasing viscosity of a plastisol composition, thus enabling acquisition of a plastisol composition which allows an excellent cured product to be obtained at a low cost.Type: GrantFiled: July 11, 2003Date of Patent: November 18, 2008Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Satoshi Mae, Katsumi Yonekura, Toshihiro Kasai, Shinji Saiki
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Publication number: 20070191535Abstract: A two-pack type plastisol composition comprising two liquid compositions (LA) and (LB), characterized in that the composition obtained by mixing the compositions (LA) and (LB) has a gelation time (as measured at 30° C.) of 1 hour or shorter. It is a novel material which gels at ordinary temperature in 1 hour, preferably in several minutes, to come to have practically sufficient performances. The composition (LA) preferably comprises fine acrylic polymer particles (A) and a dispersion medium (B) in which the particles (A) are substantially insoluble at ordinary temperature (provided that the particles (A) may be soluble in the medium (B) at elevated temperatures). The composition (LB) preferably comprises an organic solvent (C) in which the particles (A) have sufficiently high solubility at ordinary temperature.Type: ApplicationFiled: July 27, 2004Publication date: August 16, 2007Applicant: Mitsubishi Rayon Co., Ltd.Inventors: Toshihiro Kasai, Shinji Saiki
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Patent number: 7189773Abstract: A plastisol composition of the present invention comprises a polyalkylene glycol and/or a polyalkylene glycol derivative (X) and polymer particles (Y). This composition uses non-halogen based polymer particles with no halogen atoms, which do not emit materials such as hydrogen chloride gas or dioxin on incineration, and does not require a phthalic acid based plasticizer as a dispersion medium, and consequently provides an extremely large reduction in environmental impact. Furthermore, by using the plastisol composition, a gelled film having no bleed out of the dispersion medium, superior dispersion medium retention characteristics, workability, and processability is obtained. In addition, by using the plastisol composition of the present invention, a gelled film or an article with excellent mechanical characteristics are provided. The composition of the present invention is suitably used as materials such as wallpaper, floorings, vehicle undercoats, and vehicle body sealers.Type: GrantFiled: July 4, 2002Date of Patent: March 13, 2007Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Shinji Saiki, Toshihiro Kasai, Yoriko Arai