Abstract: A surface light-emitting unit of the present invention is an LED module (30) for emitting light from an LED chip (6) of a light-emitting element part (1) via a light flux control section (22) of a light flux control part (2), the light flux control section (22) being fixed by a plurality of columnar sections (21) above a fixing surface of a substrate (4) on which fixing surface the light-emitting element part (1) is fixed. This provides an appropriate gap between the light-emitting element part (1) and the light flux control section (22) for heat release.

Abstract: A surface light-emitting unit of the present invention is an LED module (30) for emitting light from an LED chip (6) of a light-emitting element part (1) via a light flux control section (22) of a light flux control part (2), the light flux control section (22) being fixed by a plurality of columnar sections (21) above a fixing surface of a substrate (4) on which fixing surface the light-emitting element part (1)is fixed. This provides an appropriate gap between the light-emitting element part (1) and the light flux control section (22) for heat release.

Abstract: A backlight unit comprising: a light guide plate for causing light to exit in a planar manner from an upper surface of the light guide plate, the light having entered the light guide plate from an LED; a substrate provided along an end surface of the light guide plate and having an LED mounted on a counter surface of the substrate, the counter surface facing the end surface of the light guide plate; a frame provided along the substrate and attached to the substrate on a rear surface of the substrate, the rear surface being opposite to the counter surface; and one or a plurality of insulating members arranged in such a manner that the one or the plurality of insulating members and the frame sandwich the substrate, the one or the plurality of insulating members each fixing a screw point of a screw inserted from the frame into a through-hole provided through the frame and the substrate.

Abstract: A surface-emission unit to prevent irregularity in brightness from being generated is provided. The surface-emission unit is composed of light-emission element parts each having a light-emission element, aligned and arranged on a substrate two-dimensionally, and optical lenses each arranged on the substrate with respect to each light-emission element part, to diffuse light from the light-emission element, and a support part to fix the optical lens onto the substrate is arranged so as not overlap a line connecting the light-emission element part corresponding to the optical lens fixed by the support part, to another light-emission element part adjacent to the light-emission element part.

Abstract: A surface light-emitting unit of the present invention is an LED module (30) for emitting light from an LED chip (6) of a light-emitting element part (1) via a light flux control section (22) of a light flux control part (2), the light flux control section (22) being fixed by a plurality of columnar sections (21) above a fixing surface of a substrate (4) on which fixing surface the light-emitting element part (1)is fixed. This provides an appropriate gap between the light-emitting element part (1) and the light flux control section (22) for heat release.

Abstract: A sensor circuit or a display apparatus from which a highly accurate sensor output can be obtained includes a photodiode, a capacitor that is connected to the photodiode via an accumulation node and accumulates charges according to an electric current in the photodiode; a sensor switching element transistor that causes the accumulation node and an output line to be conductive with respect to each other in response to a readout signal and outputs an output signal according to the potential of the accumulation node to the output line; a variable capacitor that is provided between the accumulation node and an input electrode, and whose capacitance varies when a pressure is applied by a touching operation; and a control switching element transistor to which a control signal for switching conduction and non-conduction between the variable capacitor and the accumulation node is input.

Abstract: An illumination device includes an LED package, an LED driver including an FET, and a thermistor disposed on a substrate. A plurality of such LED packages are disposed on the substrate such that a first area and a second area, each determined by vertices corresponding to LED packages, are defined on the substrate. The thermistor is disposed in the first area, and the FET is disposed in the second area, which is outside of the first area. The thermistor detects a temperature in the first area. Such a configuration allows the thermistor to detect, in accordance with the temperature in the area, the temperature of heat transferred from the LED packages, without being affected by heat generated by the FET. This makes it possible to efficiently make temperature corrections to stabilize color temperature and luminance.

Abstract: An illumination device 10 includes a diffusion plate 13 for diffusing light emitted from light sources 17, which diffusion plate 13 is fixed on first partition walls 11 and provided on upper sides of light source blocks 18. The arrangement makes it possible to provide a high-quality illumination device and a high-quality liquid crystal display device in each of which unevenness in luminance and color is restrained so that a luminance distribution becomes constant.

Abstract: A backlight unit comprising: a light guide plate for causing light to exit in a planar manner from an upper surface of the light guide plate, the light having entered the light guide plate from an LED; a substrate provided along an end surface of the light guide plate and having an LED mounted on a counter surface of the substrate, the counter surface facing the end surface of the light guide plate; a frame provided along the substrate and attached to the substrate on a rear surface of the substrate, the rear surface being opposite to the counter surface; and one or a plurality of insulating members arranged in such a manner that the one or the plurality of insulating members and the frame sandwich the substrate, the one or the plurality of insulating members each fixing a screw point of a screw inserted from the frame into a through-hole provided through the frame and the substrate.

Abstract: An LED controller (11) judges whether a temperature sensor (21) is normal in accordance with measured temperature data and controls luminance of an LED (32) measured by an abnormal temperature sensor (21) in accordance with alternative temperature data instead of the temperature data measured by the abnormal temperature sensor (21).

Abstract: Accommodating spots (13) for accommodating circuit elements (25) are formed for the respective circuit elements (25) in an opposing surface (11U), which is one surface of a backlight frame (11) opposed to a circuit element mounting surface (23B) on which the circuit elements (25) are mounted.

Abstract: Disclosed is a reinforcement frame (38) fixed to an outer package (37) of a heated component unit in a display (69), wherein a first heat dissipation fin is included in the reinforcement frame (38). With such an arrangement, even when heat generated when a component unit (such as a backlight unit in a liquid crystal display) is driven, e.g. driving heat of various elements included in the component unit, is transmitted to the outer package (37) of the component unit, the driving heat is further transmitted to the reinforcement frame (38) which is in contact with the outer package (37) and dissipated by means of the first heat dissipation fin. Consequently, the various elements in the component unit are not impaired by driving heat.

Abstract: Provided is a backlight unit capable of increasing luminance and of reducing unevenness in luminance. The backlight unit includes: a light diffusing member provided to cover a light emitting element mounted on a surface of a substrate; and a first light reflective member having a hole portion opened larger in size than an outer shape of the light diffusing member, the first light reflective member being provided on the surface of the substrate while having the light diffusing member protrude from the hole portion. In addition, a second light reflective member is further provided on the surface of the substrate, and the second light reflective member covers at least a part of a region corresponding to a gap left between the light diffusing member and the hole portion of the first light reflective member.

Abstract: A surface-emission unit to prevent irregularity in brightness from being generated is provided. The surface-emission unit is composed of light-emission element parts each having a light-emission element, aligned and arranged on a substrate two-dimensionally, and optical lenses each arranged on the substrate with respect to each light-emission element part, to diffuse light from the light-emission element, and a support part to fix the optical lens onto the substrate is arranged so as not overlap a line connecting the light-emission element part corresponding to the optical lens fixed by the support part, to another light-emission element part adjacent to the light-emission element part.

Abstract: An illumination device includes an LED package, an LED driver including an FET, and a thermistor disposed on a substrate. A plurality of such LED packages are disposed on the substrate such that a first area and a second area, each determined by vertices corresponding to LED packages, are defined on the substrate. The thermistor is disposed in the first area, and the FET is disposed in the second area, which is outside of the first area. The thermistor detects a temperature in the first area. Such a configuration allows the thermistor to detect, in accordance with the temperature in the area, the temperature of heat transferred from the LED packages, without being affected by heat generated by the FET. This makes it possible to efficiently make temperature corrections to stabilize color temperature and luminance.

Abstract: A backlight (illumination device; 2) of the present invention includes: multiple light sources (5); and multiple light guides (7, 17, . . . ) for causing surface emission of light from the light sources (5). Each of the light guides (7, 17, . . . ) includes: a light-emitting section (7b, 17b, . . . ) having a light-emitting surface (7a); and a light guide section (7c) for guiding, to the light-emitting section (7b, 17b, . . . ), light from the light sources (5), a light-emitting section (7b) of a first light guide (7) being provided above a light guide section (17c) of a second light guide (17) adjacent to the first light guide (7). A light amount adjusting section (11) for reducing the amount of light incident on it is provided between the light-emitting section (7b) of the first light guide (7) and the light-emitting section (17b) of the second light guide. This allows for production of an illumination device having further improved luminance uniformity.

Abstract: A semiconductor device (10) includes: a substrate (1), including an electrode pad (1a); an IC chip (4), mounted on the substrate (1); and an externally connecting terminal (7), formed on the electrode pad (1a) and electrically connected with the IC chip (4), the externally connecting terminal (7) including a resin core (7a) made of an elastic material and including a metal layer (7b) formed outside the resin core (7a), thereby providing a semiconductor device having high packaging reliability.

Abstract: A manufacturing method of a semiconductor device, comprising the steps of forming an insulation layer, which has an opening section in an area including an area on an electrode pad, on a top surface of the semiconductor substrate on which the electrode pad is formed; at least forming a first barrier metal layer, which becomes a part of a leading wiring layer, in an inner peripheral surface of the opening section including the top surface of the electrode pad; at least forming a main conductor layer, which becomes a part of the leading wiring layer, in an area surrounded by the first barrier metal layer in the opening section; eliminating an upper portion of the main conductor layer at least to a position at which the first barrier metal layer is exposed, and forming a second barrier metal layer, which becomes a part of the leading wiring layer, so as to cover the whole top surface of the main conductor layer.

Abstract: A semiconductor device (10) includes: a substrate (1), including an electrode pad (1a); an IC chip (4), mounted on the substrate (1); and an externally connecting terminal (7), formed on the electrode pad (1a) and electrically connected with the IC chip (4), the externally connecting terminal (7) including a resin core (7a) made of an elastic material and including a metal layer (7b) formed outside the resin core (7a), thereby providing a semiconductor device having high packaging reliability.

Abstract: On a substrate (2), a first package (4) is mounted through bumps (3), and a second package (6) is stacked on the first package (4). Each of the bumps (3) includes: a resin core (3a) having elasticity; and metal layers formed on an outer surface of the resin core. The bumps (3) are arranged so as to provide an electrical connection between the substrate (2) and the first package (4). With the above structure, a stacked semiconductor device is realized in which an IC chip breaks less likely during a mounting process.