Patents by Inventor Shinji Tachibana
Shinji Tachibana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11421135Abstract: A curable composition includes a blocked isocyanate in which an NCO group of an isocyanate compound having a H6XDI skeleton is blocked by a blocking agent having an O?C—CH—C?O skeleton, a curable functional group-containing fluorine polymer, and an alkoxysilane having a functional group including at least one element of a group 15 element to a group 16 element of the periodic table (excluding oxygen). In the curable composition allowing a titanium oxide to be contained, the molar ratio of the curable functional group to the NCO group is 0.5 to 10; the content ratio of the alkoxysilane with respect to 100 pans by mass of the total amount of the blocked isocyanate and the fluorine polymer is 0.2 to 8 parts by mass; and the content ratio of the titanium oxide with respect to 100 parts by mass of the fluorine polymer is 0 to 200 parts by mass.Type: GrantFiled: May 18, 2017Date of Patent: August 23, 2022Assignee: MITSUI CHEMICALS, INC.Inventors: Kazuyuki Fukuda, Jun Kamada, Takashi Uchida, Hideaki Otsuka, Shinji Tachibana
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Patent number: 11389818Abstract: A surface treatment apparatus for subjecting a workpiece immersed at least partly in a solution to a surface treatment has: a spray nozzle facing the workpiece for spraying a treatment solution towards a working surface of the workpiece. The surface treatment apparatus has at least one of: a spray nozzle rotator to rotate the spray nozzle in a plane parallel to the working surface of the workpiece; or a workpiece rotator to rotate the workpiece in a plane perpendicular to a spraying direction of the treatment solution sprayed from the spray nozzle.Type: GrantFiled: August 23, 2018Date of Patent: July 19, 2022Assignee: C. UYEMURA & CO., LTD.Inventors: Tomoji Okuda, Daisuke Matsuyama, Shinji Tachibana, Masayuki Utsumi
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Patent number: 11072678Abstract: The blocked isocyanate is a blocked isocyanate containing a latent isocyanate group, which is an isocyanate group blocked with a blocking agent, wherein the blocked isocyanate includes a first latent isocyanate group that is an isocyanate group blocked with a first blocking agent and a second latent isocyanate group that is an isocyanate group blocked with a second blocking agent; and the first blocking agent is represented by general formula (1) below, and has a higher catalysis activity that activates the isocyanate group than that of the second blocking agent. (where R1 to R3 represent a hydrocarbon group having 1 to 12 carbon atoms or a hydrogen atom, and at least one of R1 to R3 represents a hydrogen atom, and R1 and R3 may be bonded to each other to form a heterocycle.Type: GrantFiled: June 28, 2019Date of Patent: July 27, 2021Assignee: Mitsui Chemicals, Inc.Inventors: Kazuyuki Fukuda, Jun Kamada, Takashi Uchida, Masakazu Masui, Shinji Tachibana, Hirokazu Mizuma, Kenichi Fujii
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Publication number: 20200276608Abstract: A surface treatment apparatus for subjecting a workpiece immersed at least partly in a solution to a surface treatment has: a spray nozzle facing the workpiece for spraying a treatment solution towards a working surface of the workpiece. The surface treatment apparatus has at least one of: a spray nozzle rotator to rotate the spray nozzle in a plane parallel to the working surface of the workpiece; or a workpiece rotator to rotate the workpiece in a plane perpendicular to a spraying direction of the treatment solution sprayed from the spray nozzle.Type: ApplicationFiled: August 23, 2018Publication date: September 3, 2020Inventors: Tomoji OKUDA, Daisuke MATSUYAMA, Shinji TACHIBANA, Masayuki UTSUMI
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Publication number: 20200149180Abstract: A workpiece holding jig includes a back panel and a frame body, the frame body includes a main body having an annular shape, a conductive member provided all over the main body, a contact member provided along the conductive member, the contact member being electrically connected to the conductive member to come into electrical contact with a peripheral portion of the workpiece, and a seal member provided all over the main body and located on an inner side of the main body relative to the contact member, the frame body is adapted to form a sealed space that accommodates the peripheral portion of the workpiece, the conductive member, and the contact member in a state where the seal member and the contact member are in contact with the peripheral portion, and the frame body includes a liquid inlet through which a liquid is injected into the sealed space.Type: ApplicationFiled: May 23, 2018Publication date: May 14, 2020Inventors: Kazuyoshi NISHIMOTO, Shinji TACHIBANA, Masahiro MURAKOSHI, Tomoji OKUDA
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Publication number: 20190315910Abstract: The blocked isocyanate is a blocked isocyanate containing a latent isocyanate group, which is an isocyanate group blocked with a blocking agent, wherein the blocked isocyanate includes a first latent isocyanate group that is an isocyanate group blocked with a first blocking agent and a second latent isocyanate group that is an isocyanate group blocked with a second blocking agent; and the first blocking agent is represented by general formula (1) below, and has a higher catalysis activity that activates the isocyanate group than that of the second blocking agent. (where R1 to R3 represent a hydrocarbon group having 1 to 12 carbon atoms or a hydrogen atom, and at least one of R1 to R3 represents a hydrogen atom, and R1 and R3 may be bonded to each other to form a heterocycle.Type: ApplicationFiled: June 28, 2019Publication date: October 17, 2019Inventors: Kazuyuki FUKUDA, Jun KAMADA, Takashi UCHIDA, Masakazu MASUI, Shinji TACHIBANA, Hirokazu MIZUMA, Kenichi FUJII
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Patent number: 10385157Abstract: The blocked isocyanate is a blocked isocyanate containing a latent isocyanate group, which is an isocyanate group blocked with a blocking agent, wherein the blocked isocyanate includes a first latent isocyanate group that is an isocyanate group blocked with a first blocking agent and a second latent isocyanate group that is an isocyanate group blocked with a second blocking agent; and the first blocking agent is represented by general formula (1) below, and has a higher catalysis activity that activates the isocyanate group than that of the second blocking agent. (where R1 to R3 represent a hydrocarbon group having 1 to 12 carbon atoms or a hydrogen atom, and at least one of R1 to R3 represents a hydrogen atom, and R1 and R3 may be bonded to each other to form a heterocycle.Type: GrantFiled: August 12, 2014Date of Patent: August 20, 2019Assignee: MITSUI CHEMICALS, INC.Inventors: Kazuyuki Fukuda, Jun Kamada, Takashi Uchida, Masakazu Masui, Shinji Tachibana, Hirokazu Mizuma, Kenichi Fujii
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Publication number: 20190211241Abstract: A curable composition includes a blocked isocyanate in which an NCO group of an isocyanate compound having a H6XDI skeleton is blocked by a blocking agent having an O?C—CH—C?O skeleton, a curable functional group-containing fluorine polymer, and an alkoxysilane having a functional group including at least one element of a group 15 element to a group 16 element of the periodic table (excluding oxygen). In the curable composition allowing a titanium oxide to be contained, the molar ratio of the curable functional group to the NCO group is 0.5 to 10; the content ratio of the alkoxysilane with respect to 100 pans by mass of the total amount of the blocked isocyanate and the fluorine polymer is 0.2 to 8 parts by mass; and the content ratio of the titanium oxide with respect to 100 parts by mass of the fluorine polymer is 0 to 200 parts by mass.Type: ApplicationFiled: May 18, 2017Publication date: July 11, 2019Inventors: Kazuyuki FUKUDA, Jun KAMADA, Takashi UCHIDA, Hideaki OTSUKA, Shinji TACHIBANA
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Patent number: 10163223Abstract: A two-dimensional code is attached to a location of a reagent storage unit which is visually recognizable from the outside, and a coordinate position of the two-dimensional code in a coordinate system of the two-dimensional code and coordinate information of an installation position of a reagent bottle are held. After that, an image of the two-dimensional code is captured by a portable terminal so that a coordinate system of an image capture unit of the portable terminal is converted into the coordinate system of the two-dimensional code using AR technology. The coordinate information of the installation position of the reagent bottle in the coordinate system of the two-dimensional code is regarded as positional coordinates in the captured image on the basis of the conversion, thereby ascertaining the position of the reagent bottle on the captured image and displaying the ascertained position on a display unit.Type: GrantFiled: February 5, 2016Date of Patent: December 25, 2018Assignee: Hitachi High-Technologies CorporationInventor: Shinji Tachibana
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Publication number: 20180012375Abstract: A two-dimensional code is attached to a location of a reagent storage unit which is visually recognizable from the outside, and a coordinate position of the two-dimensional code in a coordinate system of the two-dimensional code and coordinate information of an installation position of a reagent bottle are held. After that, an image of the two-dimensional code is captured by a portable terminal so that a coordinate system of an image capture unit of the portable terminal is converted into the coordinate system of the two-dimensional code using AR technology. The coordinate information of the installation position of the reagent bottle in the coordinate system of the two-dimensional code is regarded as positional coordinates in the captured image on the basis of the conversion, thereby ascertaining the position of the reagent bottle on the captured image and displaying the ascertained position on a display unit.Type: ApplicationFiled: February 5, 2016Publication date: January 11, 2018Inventor: Shinji TACHIBANA
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Patent number: 9822212Abstract: A polyisocyanate composition is produced by reaction of bis(isocyanatomethyl) cyclohexane with trimethylolpropane, and contains a trimethylolpropane-monomolecular-body obtained by reaction of three molecules of bis(isocyanatomethyl) cyclohexane with one molecule of trimethylolpropane, and a trimethylolpropane-bimolecular-body obtained by reaction of five molecules of bis(isocyanatomethyl) cyclohexane with two molecules of trimethylolpropane; and the molar ratio of trimethylolpropane-monomolecular-body relative to trimethylolpropane-bimolecular-body (trimethylolpropane-monomolecular-body/trimethylolpropane-bimolecular-body) contained in the polyisocyanate composition is 1.5 or more and 4.5 or less.Type: GrantFiled: July 30, 2013Date of Patent: November 21, 2017Assignee: MITSUI CHEMICALS, INC.Inventors: Toshihiko Nakagawa, Takashi Kanno, Satoshi Yamasaki, Yoshihiro Matsumoto, Takashi Uchida, Hideaki Ootsuka, Shinji Tachibana, Tatsuya Shibata
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Patent number: 9730337Abstract: The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board.Type: GrantFiled: May 22, 2012Date of Patent: August 8, 2017Assignee: C. UYEMURA & CO., LTD.Inventors: Toshihisa Isono, Shinji Tachibana, Naoyuki Omura, Kanako Matsuda
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Publication number: 20160200858Abstract: The blocked isocyanate is a blocked isocyanate containing a latent isocyanate group, which is an isocyanate group blocked with a blocking agent, wherein the blocked isocyanate includes a first latent isocyanate group that is an isocyanate group blocked with a first blocking agent and a second latent isocyanate group that is an isocyanate group blocked with a second blocking agent; and the first blocking agent is represented by general formula (1) below, and has a higher catalysis activity that activates the isocyanate group than that of the second blocking agent. (where R1 to R3 represent a hydrocarbon group having 1 to 12 carbon atoms or a hydrogen atom, and at least one of R1 to R3 represents a hydrogen atom, and R1 and R3 may be bonded to each other to form a heterocycle.Type: ApplicationFiled: August 12, 2014Publication date: July 14, 2016Inventors: Kazuyuki FUKUDA, Jun KAMADA, Takashi UCHIDA, Masakazu MASUI, Shinji TACHIBANA, Hirokazu MIZUMA, Kenichi FUJII
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Publication number: 20150183922Abstract: A polyisocyanate composition is produced by reaction of bis(isocyanatomethyl)cyclohexane with trimethylolpropane, and contains a trimethylolpropane-monomolecular-body obtained by reaction of three molecules of bis(isocyanatomethyl)cyclohexane with one molecule of trimethylolpropane, and a trimethylolpropane-bimolecular-body obtained by reaction of five molecules of bis(isocyanatomethyl)cyclohexane with two molecules of trimethylolpropane; and the molar ratio of trimethylolpropane-monomolecular-body relative to trimethylolpropane-bimolecular-body (trimethylolpropane-monomolecular-body/trimethylolpropane-bimolecular-body) contained in the polyisocyanate composition is 1.5 or more and 4.5 or less.Type: ApplicationFiled: July 30, 2013Publication date: July 2, 2015Inventors: Toshihiko Nakagawa, Takashi Kanno, Satoshi Yamasaki, Yoshihiro Matsumoto, Takashi Uchida, Hideaki Ootsuka, Shinji Tachibana, Tatsuya Shibata
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Patent number: 9028668Abstract: For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ?-caprolactam, is contained in the bath as a leveler.Type: GrantFiled: July 21, 2010Date of Patent: May 12, 2015Assignee: C. Uyemura & Co., LtdInventors: Toshihisa Isono, Naoyuki Omura, Koji Shimizu, Shinji Tachibana
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Patent number: 8801912Abstract: Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel.Type: GrantFiled: March 10, 2009Date of Patent: August 12, 2014Assignee: C. Uyemura & Co., Ltd.Inventors: Naoyuki Omura, Toshihisa Isono, Koji Shimizu, Shinji Tachibana, Tomohiro Kawase, Shunsaku Hoshi
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Publication number: 20140120245Abstract: The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board.Type: ApplicationFiled: May 22, 2012Publication date: May 1, 2014Applicant: C. UYEMURA & CO., LTD.Inventors: Toshihisa Isono, Shinji Tachibana, Naoyuki Omura, Kanako Matsuda
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Patent number: 8679317Abstract: A copper electroplating bath useful in filling non-through holes formed on a substrate which contains a water-soluble copper salt, sulfuric acid, and chloride ions and further contains a brightener, a carrier, and a leveler as additives, wherein the leveler contains at least one water-soluble polymer containing quaternary nitrogen, tertiary nitrogen, or both which are cationizable in a solution. In the copper electroplating bath, the filling power for non-through holes formed on a substrate can be easily controlled so as to fit to the size of the holes only by changing the quaternary nitrogen to tertiary nitrogen ratio of the water-soluble polymer to be used as the leveler, which enables copper electroplating of non-through holes of various sizes with a good fit to the sizes.Type: GrantFiled: May 21, 2007Date of Patent: March 25, 2014Assignee: C. Uyemura & Co., Ltd.Inventors: Toshihisa Isono, Shinji Tachibana, Tomohiro Kawase, Naoyuki Omura
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Patent number: 7988842Abstract: A continuous copper electroplating method wherein copper is continuously plated on a workpiece to be placed in a plating vessel accommodating a copper sulfate plating bath containing organic additives by use of a soluble or insoluble anode and a workpiece as a cathode, the method including overflowing the plating bath from the plating vessel in an overflow vessel under which the plating bath in the overflow vessel is returned to the plating vessel, providing an oxidative decomposition vessel, and returning a plating bath from the oxidative decomposition vessel through the overflow vessel to the plating vessel to circulate the plating bath between the plating vessel and oxidative decomposition vessel, and metallic copper is immersed in the plating bath in the oxidative decomposition vessel and exposed to air bubbling, so that decomposed/degenerated organic products formed by decomposition or degeneration produced during the copper electroplating can be oxidatively decomposed.Type: GrantFiled: July 24, 2008Date of Patent: August 2, 2011Assignee: C. Uyemura & Co., Ltd.Inventors: Shinji Tachibana, Koji Shimizu, Tomohiro Kawase, Naoyuki Omura, Toshihisa Isono, Kazuyoshi Nishimoto
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Publication number: 20110089044Abstract: Disclosed herein is a copper electrolytic plating bath including copper sulfate used in an amount of 50 to 250 g/liter calculated as copper sulfate pentahydrate, 20 to 200 g/liter of sulfuric acid, and 20 to 150 mg/liter of a chloride ion, and a sulfur atom-containing organic compound and a nitrogen atom-containing organic compound serving as organic additives. The nitrogen atom-containing organic compound includes a nitrogen atom-containing polymer compound obtained by a two-stage reaction including reacting one mole of morpholine with two moles of epichlorohydrin in an acidic aqueous solution to obtain a reaction product and further reacting one to two moles, relative to one mole of the morpholine, of imidazole with the reaction product.Type: ApplicationFiled: October 13, 2010Publication date: April 21, 2011Applicant: C. UYEMURA & CO., LTD.Inventors: Toshihisa Isono, Shinji Tachibana, Naoyuki Omura, Shunsaku Hoshi