Patents by Inventor Shinji Tachibana

Shinji Tachibana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11421135
    Abstract: A curable composition includes a blocked isocyanate in which an NCO group of an isocyanate compound having a H6XDI skeleton is blocked by a blocking agent having an O?C—CH—C?O skeleton, a curable functional group-containing fluorine polymer, and an alkoxysilane having a functional group including at least one element of a group 15 element to a group 16 element of the periodic table (excluding oxygen). In the curable composition allowing a titanium oxide to be contained, the molar ratio of the curable functional group to the NCO group is 0.5 to 10; the content ratio of the alkoxysilane with respect to 100 pans by mass of the total amount of the blocked isocyanate and the fluorine polymer is 0.2 to 8 parts by mass; and the content ratio of the titanium oxide with respect to 100 parts by mass of the fluorine polymer is 0 to 200 parts by mass.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: August 23, 2022
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kazuyuki Fukuda, Jun Kamada, Takashi Uchida, Hideaki Otsuka, Shinji Tachibana
  • Patent number: 11389818
    Abstract: A surface treatment apparatus for subjecting a workpiece immersed at least partly in a solution to a surface treatment has: a spray nozzle facing the workpiece for spraying a treatment solution towards a working surface of the workpiece. The surface treatment apparatus has at least one of: a spray nozzle rotator to rotate the spray nozzle in a plane parallel to the working surface of the workpiece; or a workpiece rotator to rotate the workpiece in a plane perpendicular to a spraying direction of the treatment solution sprayed from the spray nozzle.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: July 19, 2022
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Tomoji Okuda, Daisuke Matsuyama, Shinji Tachibana, Masayuki Utsumi
  • Patent number: 11072678
    Abstract: The blocked isocyanate is a blocked isocyanate containing a latent isocyanate group, which is an isocyanate group blocked with a blocking agent, wherein the blocked isocyanate includes a first latent isocyanate group that is an isocyanate group blocked with a first blocking agent and a second latent isocyanate group that is an isocyanate group blocked with a second blocking agent; and the first blocking agent is represented by general formula (1) below, and has a higher catalysis activity that activates the isocyanate group than that of the second blocking agent. (where R1 to R3 represent a hydrocarbon group having 1 to 12 carbon atoms or a hydrogen atom, and at least one of R1 to R3 represents a hydrogen atom, and R1 and R3 may be bonded to each other to form a heterocycle.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: July 27, 2021
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Kazuyuki Fukuda, Jun Kamada, Takashi Uchida, Masakazu Masui, Shinji Tachibana, Hirokazu Mizuma, Kenichi Fujii
  • Publication number: 20200276608
    Abstract: A surface treatment apparatus for subjecting a workpiece immersed at least partly in a solution to a surface treatment has: a spray nozzle facing the workpiece for spraying a treatment solution towards a working surface of the workpiece. The surface treatment apparatus has at least one of: a spray nozzle rotator to rotate the spray nozzle in a plane parallel to the working surface of the workpiece; or a workpiece rotator to rotate the workpiece in a plane perpendicular to a spraying direction of the treatment solution sprayed from the spray nozzle.
    Type: Application
    Filed: August 23, 2018
    Publication date: September 3, 2020
    Inventors: Tomoji OKUDA, Daisuke MATSUYAMA, Shinji TACHIBANA, Masayuki UTSUMI
  • Publication number: 20200149180
    Abstract: A workpiece holding jig includes a back panel and a frame body, the frame body includes a main body having an annular shape, a conductive member provided all over the main body, a contact member provided along the conductive member, the contact member being electrically connected to the conductive member to come into electrical contact with a peripheral portion of the workpiece, and a seal member provided all over the main body and located on an inner side of the main body relative to the contact member, the frame body is adapted to form a sealed space that accommodates the peripheral portion of the workpiece, the conductive member, and the contact member in a state where the seal member and the contact member are in contact with the peripheral portion, and the frame body includes a liquid inlet through which a liquid is injected into the sealed space.
    Type: Application
    Filed: May 23, 2018
    Publication date: May 14, 2020
    Inventors: Kazuyoshi NISHIMOTO, Shinji TACHIBANA, Masahiro MURAKOSHI, Tomoji OKUDA
  • Publication number: 20190315910
    Abstract: The blocked isocyanate is a blocked isocyanate containing a latent isocyanate group, which is an isocyanate group blocked with a blocking agent, wherein the blocked isocyanate includes a first latent isocyanate group that is an isocyanate group blocked with a first blocking agent and a second latent isocyanate group that is an isocyanate group blocked with a second blocking agent; and the first blocking agent is represented by general formula (1) below, and has a higher catalysis activity that activates the isocyanate group than that of the second blocking agent. (where R1 to R3 represent a hydrocarbon group having 1 to 12 carbon atoms or a hydrogen atom, and at least one of R1 to R3 represents a hydrogen atom, and R1 and R3 may be bonded to each other to form a heterocycle.
    Type: Application
    Filed: June 28, 2019
    Publication date: October 17, 2019
    Inventors: Kazuyuki FUKUDA, Jun KAMADA, Takashi UCHIDA, Masakazu MASUI, Shinji TACHIBANA, Hirokazu MIZUMA, Kenichi FUJII
  • Patent number: 10385157
    Abstract: The blocked isocyanate is a blocked isocyanate containing a latent isocyanate group, which is an isocyanate group blocked with a blocking agent, wherein the blocked isocyanate includes a first latent isocyanate group that is an isocyanate group blocked with a first blocking agent and a second latent isocyanate group that is an isocyanate group blocked with a second blocking agent; and the first blocking agent is represented by general formula (1) below, and has a higher catalysis activity that activates the isocyanate group than that of the second blocking agent. (where R1 to R3 represent a hydrocarbon group having 1 to 12 carbon atoms or a hydrogen atom, and at least one of R1 to R3 represents a hydrogen atom, and R1 and R3 may be bonded to each other to form a heterocycle.
    Type: Grant
    Filed: August 12, 2014
    Date of Patent: August 20, 2019
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kazuyuki Fukuda, Jun Kamada, Takashi Uchida, Masakazu Masui, Shinji Tachibana, Hirokazu Mizuma, Kenichi Fujii
  • Publication number: 20190211241
    Abstract: A curable composition includes a blocked isocyanate in which an NCO group of an isocyanate compound having a H6XDI skeleton is blocked by a blocking agent having an O?C—CH—C?O skeleton, a curable functional group-containing fluorine polymer, and an alkoxysilane having a functional group including at least one element of a group 15 element to a group 16 element of the periodic table (excluding oxygen). In the curable composition allowing a titanium oxide to be contained, the molar ratio of the curable functional group to the NCO group is 0.5 to 10; the content ratio of the alkoxysilane with respect to 100 pans by mass of the total amount of the blocked isocyanate and the fluorine polymer is 0.2 to 8 parts by mass; and the content ratio of the titanium oxide with respect to 100 parts by mass of the fluorine polymer is 0 to 200 parts by mass.
    Type: Application
    Filed: May 18, 2017
    Publication date: July 11, 2019
    Inventors: Kazuyuki FUKUDA, Jun KAMADA, Takashi UCHIDA, Hideaki OTSUKA, Shinji TACHIBANA
  • Patent number: 10163223
    Abstract: A two-dimensional code is attached to a location of a reagent storage unit which is visually recognizable from the outside, and a coordinate position of the two-dimensional code in a coordinate system of the two-dimensional code and coordinate information of an installation position of a reagent bottle are held. After that, an image of the two-dimensional code is captured by a portable terminal so that a coordinate system of an image capture unit of the portable terminal is converted into the coordinate system of the two-dimensional code using AR technology. The coordinate information of the installation position of the reagent bottle in the coordinate system of the two-dimensional code is regarded as positional coordinates in the captured image on the basis of the conversion, thereby ascertaining the position of the reagent bottle on the captured image and displaying the ascertained position on a display unit.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: December 25, 2018
    Assignee: Hitachi High-Technologies Corporation
    Inventor: Shinji Tachibana
  • Publication number: 20180012375
    Abstract: A two-dimensional code is attached to a location of a reagent storage unit which is visually recognizable from the outside, and a coordinate position of the two-dimensional code in a coordinate system of the two-dimensional code and coordinate information of an installation position of a reagent bottle are held. After that, an image of the two-dimensional code is captured by a portable terminal so that a coordinate system of an image capture unit of the portable terminal is converted into the coordinate system of the two-dimensional code using AR technology. The coordinate information of the installation position of the reagent bottle in the coordinate system of the two-dimensional code is regarded as positional coordinates in the captured image on the basis of the conversion, thereby ascertaining the position of the reagent bottle on the captured image and displaying the ascertained position on a display unit.
    Type: Application
    Filed: February 5, 2016
    Publication date: January 11, 2018
    Inventor: Shinji TACHIBANA
  • Patent number: 9822212
    Abstract: A polyisocyanate composition is produced by reaction of bis(isocyanatomethyl) cyclohexane with trimethylolpropane, and contains a trimethylolpropane-monomolecular-body obtained by reaction of three molecules of bis(isocyanatomethyl) cyclohexane with one molecule of trimethylolpropane, and a trimethylolpropane-bimolecular-body obtained by reaction of five molecules of bis(isocyanatomethyl) cyclohexane with two molecules of trimethylolpropane; and the molar ratio of trimethylolpropane-monomolecular-body relative to trimethylolpropane-bimolecular-body (trimethylolpropane-monomolecular-body/trimethylolpropane-bimolecular-body) contained in the polyisocyanate composition is 1.5 or more and 4.5 or less.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: November 21, 2017
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Toshihiko Nakagawa, Takashi Kanno, Satoshi Yamasaki, Yoshihiro Matsumoto, Takashi Uchida, Hideaki Ootsuka, Shinji Tachibana, Tatsuya Shibata
  • Patent number: 9730337
    Abstract: The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: August 8, 2017
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Toshihisa Isono, Shinji Tachibana, Naoyuki Omura, Kanako Matsuda
  • Publication number: 20160200858
    Abstract: The blocked isocyanate is a blocked isocyanate containing a latent isocyanate group, which is an isocyanate group blocked with a blocking agent, wherein the blocked isocyanate includes a first latent isocyanate group that is an isocyanate group blocked with a first blocking agent and a second latent isocyanate group that is an isocyanate group blocked with a second blocking agent; and the first blocking agent is represented by general formula (1) below, and has a higher catalysis activity that activates the isocyanate group than that of the second blocking agent. (where R1 to R3 represent a hydrocarbon group having 1 to 12 carbon atoms or a hydrogen atom, and at least one of R1 to R3 represents a hydrogen atom, and R1 and R3 may be bonded to each other to form a heterocycle.
    Type: Application
    Filed: August 12, 2014
    Publication date: July 14, 2016
    Inventors: Kazuyuki FUKUDA, Jun KAMADA, Takashi UCHIDA, Masakazu MASUI, Shinji TACHIBANA, Hirokazu MIZUMA, Kenichi FUJII
  • Publication number: 20150183922
    Abstract: A polyisocyanate composition is produced by reaction of bis(isocyanatomethyl)cyclohexane with trimethylolpropane, and contains a trimethylolpropane-monomolecular-body obtained by reaction of three molecules of bis(isocyanatomethyl)cyclohexane with one molecule of trimethylolpropane, and a trimethylolpropane-bimolecular-body obtained by reaction of five molecules of bis(isocyanatomethyl)cyclohexane with two molecules of trimethylolpropane; and the molar ratio of trimethylolpropane-monomolecular-body relative to trimethylolpropane-bimolecular-body (trimethylolpropane-monomolecular-body/trimethylolpropane-bimolecular-body) contained in the polyisocyanate composition is 1.5 or more and 4.5 or less.
    Type: Application
    Filed: July 30, 2013
    Publication date: July 2, 2015
    Inventors: Toshihiko Nakagawa, Takashi Kanno, Satoshi Yamasaki, Yoshihiro Matsumoto, Takashi Uchida, Hideaki Ootsuka, Shinji Tachibana, Tatsuya Shibata
  • Patent number: 9028668
    Abstract: For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ?-caprolactam, is contained in the bath as a leveler.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: May 12, 2015
    Assignee: C. Uyemura & Co., Ltd
    Inventors: Toshihisa Isono, Naoyuki Omura, Koji Shimizu, Shinji Tachibana
  • Patent number: 8801912
    Abstract: Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: August 12, 2014
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Naoyuki Omura, Toshihisa Isono, Koji Shimizu, Shinji Tachibana, Tomohiro Kawase, Shunsaku Hoshi
  • Publication number: 20140120245
    Abstract: The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board.
    Type: Application
    Filed: May 22, 2012
    Publication date: May 1, 2014
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Toshihisa Isono, Shinji Tachibana, Naoyuki Omura, Kanako Matsuda
  • Patent number: 8679317
    Abstract: A copper electroplating bath useful in filling non-through holes formed on a substrate which contains a water-soluble copper salt, sulfuric acid, and chloride ions and further contains a brightener, a carrier, and a leveler as additives, wherein the leveler contains at least one water-soluble polymer containing quaternary nitrogen, tertiary nitrogen, or both which are cationizable in a solution. In the copper electroplating bath, the filling power for non-through holes formed on a substrate can be easily controlled so as to fit to the size of the holes only by changing the quaternary nitrogen to tertiary nitrogen ratio of the water-soluble polymer to be used as the leveler, which enables copper electroplating of non-through holes of various sizes with a good fit to the sizes.
    Type: Grant
    Filed: May 21, 2007
    Date of Patent: March 25, 2014
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Toshihisa Isono, Shinji Tachibana, Tomohiro Kawase, Naoyuki Omura
  • Patent number: 7988842
    Abstract: A continuous copper electroplating method wherein copper is continuously plated on a workpiece to be placed in a plating vessel accommodating a copper sulfate plating bath containing organic additives by use of a soluble or insoluble anode and a workpiece as a cathode, the method including overflowing the plating bath from the plating vessel in an overflow vessel under which the plating bath in the overflow vessel is returned to the plating vessel, providing an oxidative decomposition vessel, and returning a plating bath from the oxidative decomposition vessel through the overflow vessel to the plating vessel to circulate the plating bath between the plating vessel and oxidative decomposition vessel, and metallic copper is immersed in the plating bath in the oxidative decomposition vessel and exposed to air bubbling, so that decomposed/degenerated organic products formed by decomposition or degeneration produced during the copper electroplating can be oxidatively decomposed.
    Type: Grant
    Filed: July 24, 2008
    Date of Patent: August 2, 2011
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Shinji Tachibana, Koji Shimizu, Tomohiro Kawase, Naoyuki Omura, Toshihisa Isono, Kazuyoshi Nishimoto
  • Publication number: 20110089044
    Abstract: Disclosed herein is a copper electrolytic plating bath including copper sulfate used in an amount of 50 to 250 g/liter calculated as copper sulfate pentahydrate, 20 to 200 g/liter of sulfuric acid, and 20 to 150 mg/liter of a chloride ion, and a sulfur atom-containing organic compound and a nitrogen atom-containing organic compound serving as organic additives. The nitrogen atom-containing organic compound includes a nitrogen atom-containing polymer compound obtained by a two-stage reaction including reacting one mole of morpholine with two moles of epichlorohydrin in an acidic aqueous solution to obtain a reaction product and further reacting one to two moles, relative to one mole of the morpholine, of imidazole with the reaction product.
    Type: Application
    Filed: October 13, 2010
    Publication date: April 21, 2011
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Toshihisa Isono, Shinji Tachibana, Naoyuki Omura, Shunsaku Hoshi