Patents by Inventor Shinji Tsuchikawa

Shinji Tsuchikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200239653
    Abstract: The present invention relates to a prepreg including a fiber base material layer containing a fiber base material, a first resin layer formed on one surface of the fiber base material layer, and a second resin layer formed on the other surface of the fiber base material layer, wherein the first resin layer is a layer obtained through layer formation of a resin composition (I) containing, as a main component of resin components, an epoxy resin (A), and the second resin layer is a layer obtained through layer formation of a resin composition (II) containing, as a main component of resin components, an amine compound (B) having at least two primary amino groups in one molecule thereof and a maleimide compound (C) having at least two N-substituted maleimide groups in one molecule thereof; a laminated sheet obtained by using the prepreg; a printed wiring board; a coreless board; a semiconductor package; and a method of producing a coreless board.
    Type: Application
    Filed: February 19, 2018
    Publication date: July 30, 2020
    Inventors: Yuma YOSHIDA, Yuichi SHIMAYAMA, Yukio NAKAMURA, Shinji TSUCHIKAWA, Katsuhiko NAWATE, Shintaro HASHIMOTO
  • Patent number: 10681807
    Abstract: The present invention provides a prepreg for a coreless substrate including a thermosetting resin composition containing (a) (meth)acrylic elastomer, (b) an amine compound having at least two primary amino groups, and (c) a maleimide compound having at least two N-substituted maleimide groups, and a coreless substrate using the same, a method of manufacturing the coreless substrate, and a semiconductor package.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: June 9, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Norihiko Sakamoto, Hiroshi Yokota, Shintaro Hashimoto, Katsuhiko Nawate, Shinji Tsuchikawa, Shin Takanezawa
  • Publication number: 20200107437
    Abstract: The present invention provides a prepreg for a coreless substrate including a thermosetting resin composition containing (a) (meth)acrylic elastomer, (b) an amine compound having at least two primary amino groups, and (c) a maleimide compound having at least two N-substituted maleimide groups, and a coreless substrate using the same, a method of manufacturing the coreless substrate, and a semiconductor package.
    Type: Application
    Filed: March 28, 2018
    Publication date: April 2, 2020
    Inventors: Norihiko SAKAMOTO, Hiroshi YOKOTA, Shintaro HASHIMOTO, Katsuhiko NAWATE, Shinji TSUCHIKAWA, Shin TAKANEZAWA
  • Patent number: 10604641
    Abstract: The present invention provides a thermosetting resin composition comprising (A) a metal salt of disubstituted phosphinic acid, (B) a maleimide compound having a N-substituted maleimide group in a molecule, (C) a 6-substituted guanamine compound or dicyandiamide and (D) an epoxy resin having at least two epoxy groups in a molecule and a prepreg and a laminated plate which are prepared by using the same. The prepregs obtained by impregnating or coating a base material with the thermosetting resin compositions of the present invention and the laminated plates produced by laminating and molding the above prepregs are balanced in all of a copper foil adhesive property, a glass transition temperature, a solder heat resistance, a moisture absorption, a flame resistance, a relative dielectric constant and a dielectric loss tangent, and they are useful as a printed wiring board for electronic instruments.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: March 31, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Shinji Tsuchikawa, Masanori Akiyama, Tomohiko Kotake
  • Publication number: 20200056006
    Abstract: The present invention provides a prepreg for a coreless substrate and a coreless substrate and a semiconductor package using the prepreg, which can satisfy heat resistance, low thermal expansion, and bonding strength with a metal circuit at a level required for the coreless substrate. Specifically, the prepreg for a coreless substrate contains a thermosetting resin composition containing (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two primary amino groups having at least two N-substituted maleimide groups. Instead of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound, having at least two N-substituted maleimide groups, (X) an amino-modified polyimide resin obtained by reacting them may be used.
    Type: Application
    Filed: March 28, 2018
    Publication date: February 20, 2020
    Inventors: Hiroshi YOKOTA, Shintaro HASHIMOTO, Norihiko SAKAMOTO, Shinji TSUCHIKAWA, Katsuhiko NAWATE, Shin TAKANEZAWA
  • Patent number: 10414943
    Abstract: Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: September 17, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yoshihiro Takahashi, Yasuo Kamigata, Hikari Murai, Masahiro Aoshima, Shinji Tsuchikawa, Masato Miyatake, Tomohiko Kotake, Hiroyuki Izumi
  • Patent number: 10119047
    Abstract: A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: November 6, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomohiko Kotake, Shinji Tsuchikawa, Hiroyuki Izumi, Masato Miyatake, Shin Takanezawa, Hikari Murai, Tetsurou Irino
  • Publication number: 20180094162
    Abstract: Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.
    Type: Application
    Filed: December 5, 2017
    Publication date: April 5, 2018
    Inventors: Yoshihiro Takahashi, Yasuo Kamigata, Hikari Murai, Masahiro Aoshima, Shinji Tsuchikawa, Masato Miyatake, Tomohiko Kotake, Hiroyuki Izumi
  • Publication number: 20170156207
    Abstract: The present invention provides a thermosetting resin composition comprising (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by a specific method, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin comprising specific monomer units and (D) an epoxy resin and a prepreg and a laminated plate which are prepared by using the same. The thermosetting resin composition of the present invention is balanced in all of a copper foil adhesive property, a heat resistance, a moisture absorption, a flame resistance, a metal-stuck heat resistance, a relative dielectric constant and a dielectric loss tangent. They have a low toxicity and are excellent in a safety and a working environment, and therefore a prepreg and a laminated plate which have excellent performances are obtained by using the above thermosetting resin composition.
    Type: Application
    Filed: February 9, 2017
    Publication date: June 1, 2017
    Inventors: Shinji Tsuchikawa, Tomohiko Kotake, Masanori Akiyama
  • Patent number: 9603244
    Abstract: The present invention provides a thermosetting resin composition comprising (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by a specific method, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin comprising specific monomer units and (D) an epoxy resin and a prepreg and a laminated plate which are prepared by using the same. The thermosetting resin composition of the present invention is balanced in all of a copper foil adhesive property, a heat resistance, a moisture absorption, a flame resistance, a metal-stuck heat resistance, a relative dielectric constant and a dielectric loss tangent. They have a low toxicity and are excellent in a safety and a working environment, and therefore a prepreg and a laminated plate which have excellent performances are obtained by using the above thermosetting resin composition.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: March 21, 2017
    Assignee: HITACHI CHEMICAL COMPANY, LTD
    Inventors: Shinji Tsuchikawa, Tomohiko Kotake, Masanori Akiyama
  • Publication number: 20170022353
    Abstract: The present invention provides a thermosetting resin composition comprising (A) a metal salt of disubstituted phosphinic acid, (B) a maleimide compound having a N-substituted maleimide group in a molecule, (C) a 6-substituted guanamine compound or dicyandiamide and (D) an epoxy resin having at least two epoxy groups in a molecule and a prepreg and a laminated plate which are prepared by using the same. The prepregs obtained by impregnating or coating a base material with the thermosetting resin compositions of the present invention and the laminated plates produced by laminating and molding the above prepregs are balanced in all of a copper foil adhesive property, a glass transition temperature, a solder heat resistance, a moisture absorption, a flame resistance, a relative dielectric constant and a dielectric loss tangent, and they are useful as a printed wiring board for electronic instruments.
    Type: Application
    Filed: October 3, 2016
    Publication date: January 26, 2017
    Inventors: Shinji TSUCHIKAWA, Masanori AKIYAMA, Tomohiko KOTAKE
  • Publication number: 20160230037
    Abstract: Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.
    Type: Application
    Filed: April 20, 2016
    Publication date: August 11, 2016
    Inventors: Yoshihiro Takahashi, Yasuo Kamigata, Hikari Murai, Masahiro Aoshima, Shinji Tsuchikawa, Masato Miyatake, Tomohiko Kotake, Hiroyuki Izumi
  • Publication number: 20160234942
    Abstract: Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling proccessability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.
    Type: Application
    Filed: April 20, 2016
    Publication date: August 11, 2016
    Inventors: Yoshihiro Takahashi, Yasuo Kamigata, Hikari Murai, Masahiro Aoshima, Shinji Tsuchikawa, Masato Miyatake, Tomohiko Kotake, Hiroyuki Izumi
  • Publication number: 20150203715
    Abstract: A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.
    Type: Application
    Filed: March 31, 2015
    Publication date: July 23, 2015
    Inventors: Tomohiko KOTAKE, Shinji TSUCHIKAWA, Hiroyuki IZUMI, Masato MIYATAKE, Shin TAKANEZAWA, Hikari MURAI, Tetsurou IRINO
  • Patent number: 9079376
    Abstract: Disclosed is a prepreg including a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of a thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure. A prepreg having excellent low thermal expansion properties and warpage characteristics which are difficult to be realized by using only a conventional resin which is effective for highly filling an inorganic filler or has a low coefficient of thermal expansion, and a laminate using the same, and a printed wiring board can be provided.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: July 14, 2015
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Tomohiko Kotake, Masato Miyatake, Shunsuke Nagai, Hiroyuki Izumi, Shinji Tsuchikawa, Shin Takanezawa, Hikari Murai
  • Patent number: 8796473
    Abstract: The invention provides a method for producing a curing agent having an acidic substituent and an unsaturated maleimido group, including reacting, in an organic solvent, a maleimide compound (a) having at least two N-substituted maleimido groups in a molecule thereof with an amine compound (b) having an acidic substituent (represented by formula (I)); a thermosetting resin composition containing the curing agent (A) produced through the method and a compound (B) which is cured with the curing agent, wherein a cured product of the composition has a glass transition temperature of 200° C. or higher; and a prepreg and a laminated sheet produced therefrom.
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: August 5, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shinji Tsuchikawa, Masanori Akiyama, Hikari Murai
  • Publication number: 20130172459
    Abstract: Provided are a process for producing a compatibilized resin including reacting a cyanate compound, a siloxane resin having a hydroxyl group at an end thereof, and an epoxy resin at a specified rate of reaction; a thermosetting resin composition containing (A1) a compatibilized resin produced by the foregoing process or (A2) a thermosetting resin obtained by reacting a cyanate compound and a siloxane resin having a hydroxyl group at an end thereof at a specified rate of reaction, and (B) fused silica having been subjected to a surface treatment with a trimethoxysilane compound; and a prepreg, a laminate, and a wiring board each using the same.
    Type: Application
    Filed: August 5, 2011
    Publication date: July 4, 2013
    Inventors: Shinji Tsuchikawa, Hiroyuki Izumi, Kumiko Ishikura, Hikari Murai
  • Patent number: 8461332
    Abstract: A method for producing a curing agent having an acidic substituent and an unsaturated maleimido group, including reacting, in an organic solvent, a maleimide compound (a) having at least two N-substituted maleimido groups in a molecule thereof with an amine compound (b) having an acidic substituent (represented by formula (I) below); a thermosetting resin composition containing the curing agent (A) produced through the method and a compound (B) which is cured with the curing agent, wherein a cured product of the composition has a glass transition temperature of 200° C. or higher; and a prepreg and a laminated sheet produced therefrom. The thermosetting resin composition can produce a prepreg or laminated sheet exhibiting excellent performance suitable for a printed wiring board for electronic devices and similar devices.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: June 11, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shinji Tsuchikawa, Masanori Akiyama, Hikari Murai
  • Publication number: 20120316263
    Abstract: A method for producing a curing agent having an acidic substituent and an unsaturated maleimido group, including reacting, in an organic solvent, a maleimide compound (a) having at least two N-substituted maleimido groups in a molecule thereof with an amine compound (b) having an acidic substituent (represented by formula (I) below); a thermosetting resin composition containing the curing agent (A) produced through the method and a compound (B) which is cured with the curing agent, wherein a cured product of the composition has a glass transition temperature of 200° C. or higher; and a prepreg and a laminated sheet produced therefrom. The thermosetting resin composition can produce a prepreg or laminated sheet exhibiting excellent performance suitable for a printed wiring board for electronic devices and similar devices.
    Type: Application
    Filed: June 20, 2012
    Publication date: December 13, 2012
    Inventors: Shinji Tsuchikawa, Masanori Akiyama, Hikari Murai
  • Publication number: 20120276392
    Abstract: Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.
    Type: Application
    Filed: December 24, 2010
    Publication date: November 1, 2012
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Yoshihiro Takahashi, Yasuo Kamigata, Hikari Murai, Masahiro Aoshima, Shinji Tsuchikawa, Masato Miyatake, Tomohiko Kotake, Hiroyuki Izumi