Patents by Inventor Shinji Ueyama

Shinji Ueyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250237622
    Abstract: A device for measuring magnetic characteristics, includes a first magnetic field generator generating a gradient magnetic field having a different magnetic field depending on a position; a second magnetic field generator generating a high-frequency magnetic field that is time-based variable; a first actuator moving the second magnetic field generator; a mount mounting a test object; a second actuator moving the mount; and a measuring unit measuring the magnetic characteristics of the test object moving in the gradient magnetic field.
    Type: Application
    Filed: January 7, 2025
    Publication date: July 24, 2025
    Inventors: Ingi Kim, Shinji Ueyama
  • Patent number: 12327579
    Abstract: To reduce a measurement time, an inspection device includes a stage configured to fix a magnetoresistive random access memory (MRAM) to a stage surface and moving the MRAM, a plurality of magnets configured to generate a gradient magnetic, a plurality of line sensors comprising a first line sensor for detecting a magneto-optical effect at a first location of the MRAM and a second line sensor for detecting the magneto-optical effect at a second location that is different from the first location by moving a location of the MRAM within the gradient magnetic field, and an information processor configured to process the magneto-optical effect detected by the plurality of line sensors. Thus, throughput may be improved.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: June 10, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Shinji Ueyama, Ingi Kim, Harutaka Sekiya, Tomoki Onishi
  • Publication number: 20240272245
    Abstract: A semiconductor manufacturing device includes a detection unit that detects an extinction response of a perpendicular magnetic anisotropy PMA film in a sample from a polar Kerr effect signal, and a derivation unit that derives an anisotropic magnetic field (Hk) of the PMA film by extrapolating and fitting the detected extinction response, in magneto-optical Kerr effect measurement that uses a plurality of electromagnets that electrically apply magnetic fields to the sample on the stage by convert a perpendicular magnetic field that includes a vertical component normal to an upper surface of a stage, and a horizontal magnetic field parallel to the upper surface of the stage.
    Type: Application
    Filed: January 30, 2024
    Publication date: August 15, 2024
    Inventors: KEN OZAWA, Kenji Suzuki, Shinji Ueyama
  • Patent number: 12051604
    Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.
    Type: Grant
    Filed: December 7, 2021
    Date of Patent: July 30, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Daisuke Nagatomo, Fumitaka Moroishi, Masanori Izumita, Shinji Ueyama, Takahiro Tokumiya, Takamasa Sugiura, Tatsuya Ishimoto, Masato Kajinami
  • Publication number: 20240201104
    Abstract: An inspection device improves accuracy characteristics of an (MRAM), the inspection device including a stage on which a MRAM element is fixed, and electromagnets generating a first magnetic field. A magnetic field having a component in a direction perpendicular to the stage is changeable from a first direction to a second direction according to a position on the stage. A second magnetic field in which a direction of a magnetic field component is parallel to the stage changes from a third direction to a fourth direction according to the position on the stage, an optical system illuminating the MRAM element with light including polarized light, and condensing reflected light from reflected illumination light from the MRAM element, and a detector detecting reflected light when the position of the MRAM element is changed, and when the position of the MRAM element in the second magnetic field is changed.
    Type: Application
    Filed: December 8, 2023
    Publication date: June 20, 2024
    Inventors: KENJI SUZUKI, Ingi Kim, Mitsunori Numata, Shinji Ueyama, Tomoki Onishi
  • Publication number: 20240183657
    Abstract: An optical device includes a monochromatic light source, a light distribution switching portion configured to transmit monochromatic light emitted from the monochromatic light source in one fan-shaped region among a plurality of fan-shaped regions centered on a central optical axis and block the monochromatic light in other fan-shaped regions, an objective lens, an aperture stop configured to collect reflected light from the object, an imaging lens, which has passed through the aperture stop, a light receiver on an imaging plane formed by the imaging lens and configured to receive the reflected light from the object and photoelectrically convert the received reflected light, and a controller configured to instruct the light distribution switching portion to change a region transmitting light over time, and calculate a normal direction of the object based on an electrical signal photoelectrically converted by the light receiver.
    Type: Application
    Filed: December 4, 2023
    Publication date: June 6, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Daisuke NAGATOMO, Shinji UEYAMA, Takamasa SUGIURA, Euisun CHOI, Fumitaka MOROISHI, Masanori IZUMITA, Takahiro TOKUMIYA, Tatsuya ISHIMOTO, Masato KAJINAMI
  • Publication number: 20240094646
    Abstract: An exposure apparatus includes a droplet supplier to supply a target droplet inside a vacuum chamber, an irradiator irradiating a pulsed laser onto the target droplet, a condensing mirror installed inside the vacuum chamber and configured to condense a light emitted from the target droplet by irradiation of the pulsed laser onto the target droplet, a gas supplier to flow a hydrogen gas along a surface of the condensing mirror, a controller to change a supply condition of the target droplet and an irradiation condition of the pulsed laser to conditions different from conditions during an exposure operation to increase an amount of production of hydrogen radicals in the vacuum chamber, and an exhaust pump to exhaust a gas from an inside of the vacuum chamber.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Katsunobu NISHIHARA, Nozomi TANAKA, Tomoyuki JOHZAKI, Ken OZAWA, Atsushi SUNAHARA, Shinji UEYAMA, Shinsuke FUJIOKA, Yubo WANG
  • Patent number: 11796608
    Abstract: The inventive concepts provide a magnetic property measurement apparatus capable of quickly measuring a magnetic property of a subject without a decrease in a measurement speed that might occur due to an electromagnet. In addition, the inventive concepts provide a magnetic property measurement apparatus capable of monitoring a magnetization distribution of a memory device as an image and integrating images by using a TDI camera, thereby being capable of performing highly sensitive measurement and not having to capture images for a long time. The magnetic property measurement apparatus includes: a magnetic field generation unit configured to generate a magnetic field which is constant with time and varies with relative position; a mobile unit configured to move a subject to be measured in the magnetic field; and a measurement unit configured to measure a magnetic property of the subject moving in the magnetic field.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: October 24, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Harutaka Sekiya, Shinji Ueyama, Tomoki Onishi
  • Publication number: 20230305282
    Abstract: The polarized microscope includes a light source configured to generate illumination light, a polarizer configured to interact with the generated illumination light to transmit rectilinear polarized light having a first orientation, an analyzer configured to transmit a component of rectilinear polarized light reflected by a sample, the reflected rectilinear polarized light having a second orientation, an image obtainer configured to obtain an image of the reflected rectilinear polarized light, and an image processor configured to process the obtained image, wherein the image processor is configured to calculate a device integer, obtain a plurality of hysteresis loops for each of regions of interest (ROIs), and calculate a rotation angle of a Kerr rotation of each ROI by using the device integer and the plurality of hysteresis loops.
    Type: Application
    Filed: February 27, 2023
    Publication date: September 28, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ken OZAWA, Shinji UEYAMA, Tomoki ONISHI
  • Publication number: 20230187249
    Abstract: A mounting device includes: a bonding head configured to hold a first object, a bonding stage configured to hold a second object, and a dual-field-of-view (FOV) optical system including an image sensor configured to simultaneously capture an image of a first alignment mark on the first object and an image of a second alignment mark on the second object to obtain a first image. At least one of the bonding head and the bonding stage is configured to adjust a relative position between the first object and the second object based on the first image, and bond the first object to the second object.
    Type: Application
    Filed: December 9, 2022
    Publication date: June 15, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Daisuke NAGATOMO, Fumitaka Moroishi, Masanori Izumita, Shinji Ueyama, Takahiro Tokumiya, Takamasa Sugiura, Tatsuya Ishimoto, Masato Kajinami
  • Publication number: 20230125628
    Abstract: To reduce a measurement time, an inspection device includes a stage configured to fix a magnetoresistive random access memory (MRAM) to a stage surface and moving the MRAM, a plurality of magnets configured to generate a gradient magnetic, a plurality of line sensors comprising a first line sensor for detecting a magneto-optical effect at a first location of the MRAM and a second line sensor for detecting the magneto-optical effect at a second location that is different from the first location by moving a location of the MRAM within the gradient magnetic field, and an information processor configured to process the magneto-optical effect detected by the plurality of line sensors. Thus, throughput may be improved.
    Type: Application
    Filed: October 19, 2022
    Publication date: April 27, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Shinji UEYAMA, Ingi KIM, Harutaka SEKIYA, Tomoki ONISHI
  • Publication number: 20220216077
    Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.
    Type: Application
    Filed: December 7, 2021
    Publication date: July 7, 2022
    Inventors: Daisuke Nagatomo, Fumitaka Moroishi, Masanori Izumita, Shinji Ueyama, Takahiro Tokumiya, Takamasa Sugiura, Tatsuya Ishimoto, Masato Kajinami
  • Publication number: 20220137160
    Abstract: The inventive concepts provide a magnetic property measurement apparatus capable of quickly measuring a magnetic property of a subject without a decrease in a measurement speed that might occur due to an electromagnet. In addition, the inventive concepts provide a magnetic property measurement apparatus capable of monitoring a magnetization distribution of a memory device as an image and integrating images by using a TDI camera, thereby being capable of performing highly sensitive measurement and not having to capture images for a long time. The magnetic property measurement apparatus includes: a magnetic field generation unit configured to generate a magnetic field which is constant with time and varies with relative position; a mobile unit configured to move a subject to be measured in the magnetic field; and a measurement unit configured to measure a magnetic property of the subject moving in the magnetic field.
    Type: Application
    Filed: September 7, 2021
    Publication date: May 5, 2022
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Harutaka SEKIYA, Shinji UEYAMA, Tomoki ONISHI
  • Patent number: 10847369
    Abstract: A method for adjusting inclination between wafers may include providing a first infrared light onto a first grid pattern in a first region in a first wafer and a second grid pattern in a second wafer, the first and second grid patterns overlapping, calculating a first distance in the first region between the first and second wafers based on a first Moiré pattern from the overlapping first and second grid patterns, providing a second infrared light onto a third grid pattern in a second region in the first wafer and a fourth grid pattern in the second wafer, the third and fourth grid patterns overlapping, calculating a second distance in the second region between the first and second wafers based on a second Moiré pattern from the overlapping third and fourth grid patterns, and adjusting relative inclination between the first and second wafers based on the first and second distances.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: November 24, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shinji Ueyama, Fumitaka Moroishi, Masato Kajinami
  • Publication number: 20200209164
    Abstract: A method for adjusting inclination between wafers may include providing a first infrared light onto a first grid pattern in a first region in a first wafer and a second grid pattern in a second wafer, the first and second grid patterns overlapping, calculating a first distance in the first region between the first and second wafers based on a first Moiré pattern from the overlapping first and second grid patterns, providing a second infrared light onto a third grid pattern in a second region in the first wafer and a fourth grid pattern in the second wafer, the third and fourth grid patterns overlapping, calculating a second distance in the second region between the first and second wafers based on a second Moiré pattern from the overlapping third and fourth grid patterns, and adjusting relative inclination between the first and second wafers based on the first and second distances.
    Type: Application
    Filed: November 8, 2019
    Publication date: July 2, 2020
    Inventors: Shinji UEYAMA, Fumitaka MOROISHI, Masato KAJINAMI
  • Patent number: 10444162
    Abstract: An apparatus for testing an object includes a moving unit configured to hold and move the object. A transmissive illuminating unit includes a light source generating light and a transmissive mask pattern. The transmissive mask pattern includes a first region configured to convert the light generated from the light source into a slit light, and a second region arranged in a movement direction of the object with respect to the first region to partially transmit the light generated from the light source. The transmissive illuminating unit is configured to project a measuring light, which is provided by transmitting the light generated from the light source through the transmissive mask pattern, to the object. A detecting unit is configured to receive a reflected light of the measuring light from the object and to detect a height and surface state of the object based on the reflected light.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: October 15, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shinji Ueyama, Masato Kajinami, Tatsuya Ishimoto
  • Publication number: 20180284032
    Abstract: An apparatus for testing an object includes a moving unit configured to hold and move the object. A transmissive illuminating unit includes a light source generating light and a transmissive mask pattern. The transmissive mask pattern includes a first region configured to convert the light generated from the light source into a slit light, and a second region arranged in a movement direction of the object with respect to the first region to partially transmit the light generated from the light source. The transmissive illuminating unit is configured to project a measuring light, which is provided by transmitting the light generated from the light source through the transmissive mask pattern, to the object. A detecting unit is configured to receive a reflected light of the measuring light from the object and to detect a height and surface state of the object based on the reflected light.
    Type: Application
    Filed: March 28, 2018
    Publication date: October 4, 2018
    Inventors: SHINJI UEYAMA, MASATO KAJINAMI, TATSUYA ISHIMOTO
  • Patent number: 9726204
    Abstract: A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: August 8, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Masato Kajinami, Fumitaka Moroishi, Keiji Murata, Shinji Ueyama, Tatsuya Ishimoto, Yoshiaki Yukimori
  • Patent number: 9082885
    Abstract: A method of manufacturing a semiconductor device includes: providing a first substrate that includes internal wiring, the first substrate including an array of chip mounting regions that includes a first chip mounting region; placing the first substrate on a first carrier line; providing a first semiconductor chip; placing the first semiconductor chip on a first moveable tray; vertically aligning the first chip mounting region of the first substrate with the first semiconductor chip, and performing initial bonding of the first semiconductor chip to the first chip mounting region of the first substrate; and performing subsequent bonding on the initially-bonded first semiconductor chip and first mounting region of the first substrate, thereby more strongly bonding the first semiconductor chip to the first substrate at the first mounting region. The initial bonding occurs after performing a subsequent bonding of at least one other semiconductor chip on the first substrate.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: July 14, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yoshiaki Yukimori, Shinji Ueyama, Masato Kajinami
  • Publication number: 20150159681
    Abstract: A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.
    Type: Application
    Filed: December 5, 2014
    Publication date: June 11, 2015
    Inventors: Masato KAJINAMI, Fumitaka MOROISHI, Keiji MURATA, Shinji UEYAMA, Tatsuya ISHIMOTO, Yoshiaki YUKIMORI