Abstract: An exposure apparatus includes a droplet supplier to supply a target droplet inside a vacuum chamber, an irradiator irradiating a pulsed laser onto the target droplet, a condensing mirror installed inside the vacuum chamber and configured to condense a light emitted from the target droplet by irradiation of the pulsed laser onto the target droplet, a gas supplier to flow a hydrogen gas along a surface of the condensing mirror, a controller to change a supply condition of the target droplet and an irradiation condition of the pulsed laser to conditions different from conditions during an exposure operation to increase an amount of production of hydrogen radicals in the vacuum chamber, and an exhaust pump to exhaust a gas from an inside of the vacuum chamber.

Abstract: The inventive concepts provide a magnetic property measurement apparatus capable of quickly measuring a magnetic property of a subject without a decrease in a measurement speed that might occur due to an electromagnet. In addition, the inventive concepts provide a magnetic property measurement apparatus capable of monitoring a magnetization distribution of a memory device as an image and integrating images by using a TDI camera, thereby being capable of performing highly sensitive measurement and not having to capture images for a long time. The magnetic property measurement apparatus includes: a magnetic field generation unit configured to generate a magnetic field which is constant with time and varies with relative position; a mobile unit configured to move a subject to be measured in the magnetic field; and a measurement unit configured to measure a magnetic property of the subject moving in the magnetic field.

Abstract: The polarized microscope includes a light source configured to generate illumination light, a polarizer configured to interact with the generated illumination light to transmit rectilinear polarized light having a first orientation, an analyzer configured to transmit a component of rectilinear polarized light reflected by a sample, the reflected rectilinear polarized light having a second orientation, an image obtainer configured to obtain an image of the reflected rectilinear polarized light, and an image processor configured to process the obtained image, wherein the image processor is configured to calculate a device integer, obtain a plurality of hysteresis loops for each of regions of interest (ROIs), and calculate a rotation angle of a Kerr rotation of each ROI by using the device integer and the plurality of hysteresis loops.

Abstract: A mounting device includes: a bonding head configured to hold a first object, a bonding stage configured to hold a second object, and a dual-field-of-view (FOV) optical system including an image sensor configured to simultaneously capture an image of a first alignment mark on the first object and an image of a second alignment mark on the second object to obtain a first image. At least one of the bonding head and the bonding stage is configured to adjust a relative position between the first object and the second object based on the first image, and bond the first object to the second object.

Abstract: To reduce a measurement time, an inspection device includes a stage configured to fix a magnetoresistive random access memory (MRAM) to a stage surface and moving the MRAM, a plurality of magnets configured to generate a gradient magnetic, a plurality of line sensors comprising a first line sensor for detecting a magneto-optical effect at a first location of the MRAM and a second line sensor for detecting the magneto-optical effect at a second location that is different from the first location by moving a location of the MRAM within the gradient magnetic field, and an information processor configured to process the magneto-optical effect detected by the plurality of line sensors. Thus, throughput may be improved.

Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.

Abstract: The inventive concepts provide a magnetic property measurement apparatus capable of quickly measuring a magnetic property of a subject without a decrease in a measurement speed that might occur due to an electromagnet. In addition, the inventive concepts provide a magnetic property measurement apparatus capable of monitoring a magnetization distribution of a memory device as an image and integrating images by using a TDI camera, thereby being capable of performing highly sensitive measurement and not having to capture images for a long time. The magnetic property measurement apparatus includes: a magnetic field generation unit configured to generate a magnetic field which is constant with time and varies with relative position; a mobile unit configured to move a subject to be measured in the magnetic field; and a measurement unit configured to measure a magnetic property of the subject moving in the magnetic field.

Abstract: A method for adjusting inclination between wafers may include providing a first infrared light onto a first grid pattern in a first region in a first wafer and a second grid pattern in a second wafer, the first and second grid patterns overlapping, calculating a first distance in the first region between the first and second wafers based on a first Moiré pattern from the overlapping first and second grid patterns, providing a second infrared light onto a third grid pattern in a second region in the first wafer and a fourth grid pattern in the second wafer, the third and fourth grid patterns overlapping, calculating a second distance in the second region between the first and second wafers based on a second Moiré pattern from the overlapping third and fourth grid patterns, and adjusting relative inclination between the first and second wafers based on the first and second distances.

Abstract: A method for adjusting inclination between wafers may include providing a first infrared light onto a first grid pattern in a first region in a first wafer and a second grid pattern in a second wafer, the first and second grid patterns overlapping, calculating a first distance in the first region between the first and second wafers based on a first Moiré pattern from the overlapping first and second grid patterns, providing a second infrared light onto a third grid pattern in a second region in the first wafer and a fourth grid pattern in the second wafer, the third and fourth grid patterns overlapping, calculating a second distance in the second region between the first and second wafers based on a second Moiré pattern from the overlapping third and fourth grid patterns, and adjusting relative inclination between the first and second wafers based on the first and second distances.

Abstract: An apparatus for testing an object includes a moving unit configured to hold and move the object. A transmissive illuminating unit includes a light source generating light and a transmissive mask pattern. The transmissive mask pattern includes a first region configured to convert the light generated from the light source into a slit light, and a second region arranged in a movement direction of the object with respect to the first region to partially transmit the light generated from the light source. The transmissive illuminating unit is configured to project a measuring light, which is provided by transmitting the light generated from the light source through the transmissive mask pattern, to the object. A detecting unit is configured to receive a reflected light of the measuring light from the object and to detect a height and surface state of the object based on the reflected light.

Abstract: An apparatus for testing an object includes a moving unit configured to hold and move the object. A transmissive illuminating unit includes a light source generating light and a transmissive mask pattern. The transmissive mask pattern includes a first region configured to convert the light generated from the light source into a slit light, and a second region arranged in a movement direction of the object with respect to the first region to partially transmit the light generated from the light source. The transmissive illuminating unit is configured to project a measuring light, which is provided by transmitting the light generated from the light source through the transmissive mask pattern, to the object. A detecting unit is configured to receive a reflected light of the measuring light from the object and to detect a height and surface state of the object based on the reflected light.

Abstract: A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.

Abstract: A method of manufacturing a semiconductor device includes: providing a first substrate that includes internal wiring, the first substrate including an array of chip mounting regions that includes a first chip mounting region; placing the first substrate on a first carrier line; providing a first semiconductor chip; placing the first semiconductor chip on a first moveable tray; vertically aligning the first chip mounting region of the first substrate with the first semiconductor chip, and performing initial bonding of the first semiconductor chip to the first chip mounting region of the first substrate; and performing subsequent bonding on the initially-bonded first semiconductor chip and first mounting region of the first substrate, thereby more strongly bonding the first semiconductor chip to the first substrate at the first mounting region. The initial bonding occurs after performing a subsequent bonding of at least one other semiconductor chip on the first substrate.

Abstract: A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.

Abstract: A method of manufacturing a semiconductor device includes: providing a first substrate that includes internal wiring, the first substrate including an array of chip mounting regions that includes a first chip mounting region; placing the first substrate on a first carrier line; providing a first semiconductor chip; placing the first semiconductor chip on a first moveable tray; vertically aligning the first chip mounting region of the first substrate with the first semiconductor chip, and performing initial bonding of the first semiconductor chip to the first chip mounting region of the first substrate; and performing subsequent bonding on the initially-bonded first semiconductor chip and first mounting region of the first substrate, thereby more strongly bonding the first semiconductor chip to the first substrate at the first mounting region. The initial bonding occurs after performing a subsequent bonding of at least one other semiconductor chip on the first substrate.

Abstract: In an image defect inspection method and apparatus, which detects a gray level difference between the corresponding portions of two images, automatically sets a threshold value based on the distribution of the detected gray level difference, compares the detected gray level difference with the threshold value, and judges one or the other of the portions to be defective if the gray level difference is larger than the threshold value, provisions are made to reduce the occurrence of false defects when there is a brightness difference between the two images undergoing the comparison. In the image defect inspection method, the brightness difference between the two images is computed (S106), and the threshold value is determined in such a manner that the threshold value increases with the computed brightness difference (S107).

Abstract: In an image defect inspection method and apparatus, which detects a gray level difference between the corresponding portions of two images, automatically sets a threshold value based on the distribution of the detected gray level difference, compares the detected gray level difference with the threshold value, and judges one or the other of the portions to be defective if the gray level difference is larger than the threshold value, provisions are made to reduce the occurrence of false defects when there is a brightness difference between the two images undergoing the comparison. In the image defect inspection method, the brightness difference between the two images is computed (S106), and the threshold value is determined in such a manner that the threshold value increases with the computed brightness difference (S107).

Abstract: An image defect inspection apparatus 1 which performs a defect detection for detecting a defect on a surface of a sample 100 by comparing corresponding portions in an image captured of the surface of the sample 100 that are supposed to be identical to each other, and a reexamination for reexamining a site at which the defect was detected in the captured image, comprises: a plurality of processor elements PE1 to PE3which perform the defect detection in parallel on regions created by dividing the captured image; and a processor unit PU1, which receives defect information in parallel from the plurality of processor elements PE1 to PE3 as information concerning individual defects detected by the processor elements PE1 to PE3 , and which outputs the defect information as a set of defect information.

Abstract: In an image defect inspection method and apparatus, which detects a gray level difference between the corresponding portions of two images, automatically sets a threshold value based on the distribution of the detected gray level difference, compares the detected gray level difference with the threshold value, and judges one or the other of the portions to be defective if the gray level difference is larger than the threshold value, provisions are made to reduce the occurrence of false defects when there is a brightness difference between the two images undergoing the comparison. In the image defect inspection method, the brightness difference between the two images is computed (S106), and the threshold value is determined in such a manner that the threshold value increases with the computed brightness difference (S107).