Patents by Inventor Shinji Wakabayashi
Shinji Wakabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11688619Abstract: In a vacuum processing apparatus, a load lock module includes a housing and substrate holding sections, the housing having first substrate transfer ports formed on one of right and left sides thereof and a second substrate transfer port formed on a rear side thereof, and each substrate holding section being configured to hold a substrate on a right or left side in the housing. Further, a normal pressure transfer chamber extends over or under the housing from one of the right and left sides of the housing to the other one thereof so that each first substrate transfer port is opened. The normal pressure transfer chamber includes a stacked transfer region that is a region overlapping the housing. Further, a normal pressure transfer mechanism transfers the substrate between each substrate holding section and a transfer container carried into each of loading/unloading ports via the stacked transfer region.Type: GrantFiled: September 10, 2019Date of Patent: June 27, 2023Assignee: TOKYO ELECTRON LIMITEDInventor: Shinji Wakabayashi
-
Publication number: 20220365187Abstract: A substrate processing system includes: a substrate processing apparatus including a stage on which a substrate and an annular member are placed; a substrate transport mechanism including a substrate holder; a distance sensor provided in the substrate holder; and a control device, wherein the substrate transport mechanism is configured to place a jig substrate having a reference surface as a reference for a height of the annular member on the stage, wherein the distance sensor is configured to measure a distance from the substrate holder positioned above the stage to the reference surface of the jig substrate and a distance from the substrate holder to the annular member, and wherein the control device is configured to estimate the height of the annular member based on a measurement result of the distance to the reference surface and a measurement result of the distance to the annular member.Type: ApplicationFiled: April 29, 2022Publication date: November 17, 2022Inventors: Toshiaki KODAMA, Shinji WAKABAYASHI, Takehiro SHINDO, Tatsuru OKAMURA
-
Patent number: 11404299Abstract: In a substrate transfer mechanism, a moving body moves horizontally, and a support body is provided at the moving body to rotate about a vertical shaft. A first rotary shaft and a second rotary shaft are disposed vertically. A first arm forms a first substrate support region for supporting a first substrate, the first arm having a base portion connected to the first rotary shaft and a tip portion rotating at an outer side of the support body. A second arm forms a second substrate support region for supporting a second substrate, the second arm having a base portion connected to the second rotary shaft and a tip portion rotating the outer side of the support body. Further, an elevating mechanism is configured to raise and lower the second rotary shaft depending on a direction of the second arm with respect to the support body.Type: GrantFiled: August 28, 2019Date of Patent: August 2, 2022Assignee: TOKYO ELECTRON LIMITEDInventor: Shinji Wakabayashi
-
Patent number: 11335586Abstract: A transfer device is disposed in a vacuum transfer chamber. The transfer device includes a structure body having an inner space isolated from the vacuum transfer chamber, an arm that rotates with respect to the structure body, and a vacuum seal structure configured to airtightly seal a sliding portion between the structure body and the arm. Further, the vacuum seal structure includes one or more seal members disposed at the sliding portion; a sealing portion formed by the structure body, the arm, and the seal members, lubricant being sealed in the sealing portion; and a pressure adjusting unit configured to adjust a pressure in the sealing portion.Type: GrantFiled: March 24, 2021Date of Patent: May 17, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Takehiro Shindo, Shinji Wakabayashi
-
Publication number: 20220044952Abstract: In a vacuum processing apparatus, a load lock module includes a housing and substrate holding sections, the housing having first substrate transfer ports formed on one of right and left sides thereof and a second substrate transfer port formed on a rear side thereof, and each substrate holding section being configured to hold a substrate on a right or left side in the housing. Further, a normal pressure transfer chamber extends over or under the housing from one of the right and left sides of the housing to the other one thereof so that each first substrate transfer port is opened. The normal pressure transfer chamber includes a stacked transfer region that is a region overlapping the housing. Further, a normal pressure transfer mechanism transfers the substrate between each substrate holding section and a transfer container carried into each of loading/unloading ports via the stacked transfer region.Type: ApplicationFiled: September 10, 2019Publication date: February 10, 2022Inventor: Shinji WAKABAYASHI
-
Publication number: 20210305081Abstract: A transfer device is disposed in a vacuum transfer chamber. The transfer device includes a structure body having an inner space isolated from the vacuum transfer chamber, an arm that rotates with respect to the structure body, and a vacuum seal structure configured to airtightly seal a sliding portion between the structure body and the arm. Further, the vacuum seal structure includes one or more seal members disposed at the sliding portion; a sealing portion formed by the structure body, the arm, and the seal members, lubricant being sealed in the sealing portion; and a pressure adjusting unit configured to adjust a pressure in the sealing portion.Type: ApplicationFiled: March 24, 2021Publication date: September 30, 2021Inventors: Takehiro SHINDO, Shinji WAKABAYASHI
-
Patent number: 10906756Abstract: Four groups of a three-tier arrangement of processing units, each of the processing units being provided with two processing modules and a load lock module, are provided in the front and rear sides along a Y-guide extending rearward when viewed from an EFEM and in the left and right sides of the Y-guide. An exchange of a substrate between a delivery mechanism on the EFEM side and a substrate transfer mechanism on the processing unit side is performed by a substrate loading part, which is movable along the Y-guide and can move upward and downward, and on which a plurality of wafers can be placed in a shelf-like manner.Type: GrantFiled: January 21, 2019Date of Patent: February 2, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Shinji Wakabayashi, Keisuke Kondoh
-
Publication number: 20200075377Abstract: In a substrate transfer mechanism, a moving body moves horizontally, and a support body is provided at the moving body to rotate about a vertical shaft. A first rotary shaft and a second rotary shaft are disposed vertically. A first arm forms a first substrate support region for supporting a first substrate, the first arm having a base portion connected to the first rotary shaft and a tip portion rotating at an outer side of the support body. A second arm forms a second substrate support region for supporting a second substrate, the second arm having a base portion connected to the second rotary shaft and a tip portion rotating the outer side of the support body. Further, an elevating mechanism is configured to raise and lower the second rotary shaft depending on a direction of the second arm with respect to the support body.Type: ApplicationFiled: August 28, 2019Publication date: March 5, 2020Inventor: Shinji WAKABAYASHI
-
Patent number: 10431481Abstract: A load lock apparatus having a load lock chamber, which is connected to a vacuum transfer chamber configured to transfer a substrate under a vacuum pressure state via a communication hole which is opened and closed by a gate valve, and configured to be capable of switching an inner pressure into an atmospheric pressure state and the vacuum pressure state, is provided. The load lock apparatus includes a load lock chamber main body in which a substrate container having an attachable/detachable cover is carried, wherein the communication hole is formed in a side surface of the load lock chamber; and a cover attaching/detaching mechanism installed at a height position vertically arranged with the communication hole in the load lock chamber; and an elevating mechanism including a mounting table on which the substrate container is loaded and configured to lift and lower the mounting table.Type: GrantFiled: July 21, 2016Date of Patent: October 1, 2019Assignee: TOKYO ELECTRON LIMITEDInventor: Shinji Wakabayashi
-
Patent number: 10429543Abstract: There is provided a substrate detection apparatus of detecting whether or not a substrate is normally supported by a support part at a predetermined position, in a transfer device including the support part configured to support a plurality of disc-like substrates in multi-stage processing at vertical intervals. The substrate detection apparatus includes: a plurality of optical sensors, each of the plurality of optical sensors including a light transmitting part configured to irradiate a light and a light receiving part configured to receive the light from the light transmitting part, wherein at least one pair of the plurality of optical sensors are disposed such that the light from the light transmitting part is sequentially blocked at each of the plurality of disc-like substrates, during the plurality of disc-like substrates is collectively transferred while being normally supported by the support part at the predetermined positions.Type: GrantFiled: February 8, 2016Date of Patent: October 1, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Toshiaki Kodama, Shinji Wakabayashi
-
Patent number: 10403529Abstract: A carrier transport device capable of delivering a carrier to and from an external transport device which transports the carrier is provided. The carrier transport device includes a housing on which the carrier is mountable, first ports provided in the housing and configured to deliver the carrier to and from the external transport device, second ports provided in the housing and provided with a lid opening/closing mechanism, and a transfer machine provided in the housing and configured to transfer the carrier. The first ports, the transfer machine and the second ports are disposed under a transport path of the external transport device. The first ports and the second ports are disposed on both sides of the transfer machine. The second ports are configured at multiple stages.Type: GrantFiled: December 24, 2015Date of Patent: September 3, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Shinji Wakabayashi, Keisuke Kondoh
-
Publication number: 20190152722Abstract: Four groups of a three-tier arrangement of processing units, each of the processing units being provided with two processing modules and a load lock module, are provided in the front and rear sides along a Y-guide extending rearward when viewed from an EFEM and in the left and right sides of the Y-guide. An exchange of a substrate between a delivery mechanism on the EFEM side and a substrate transfer mechanism on the processing unit side is performed by a substrate loading part, which is movable along the Y-guide and can move upward and downward, and on which a plurality of wafers can be placed in a shelf-like manner.Type: ApplicationFiled: January 21, 2019Publication date: May 23, 2019Inventors: Shinji WAKABAYASHI, Keisuke KONDOH
-
Patent number: 10229847Abstract: A substrate transfer chamber for unloading the substrates from the containers includes a housing-shaped main body and a plurality of container connecting mechanisms to which the containers are connected. In the main body, some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.Type: GrantFiled: February 9, 2017Date of Patent: March 12, 2019Assignee: Tokyo Electron LimitedInventors: Shinji Wakabayashi, Keisuke Kondoh, Sensho Kobayashi
-
Patent number: 9962840Abstract: Disclosed is a substrate conveyance apparatus that collectively conveys a plurality of substrates. The apparatus includes: a plurality of substrate placement racks disposed at intervals in a height direction and configured to simultaneously place the substrates thereon; a substrate placement rack holder configured to integrally hold the plurality of substrate placement racks; and a moving mechanism connected to the substrate placement rack holder and configured to integrally move the plurality of substrate placement racks. The moving mechanism includes: a first arm unit having a first support supported from an outside, and connected to one end of the substrate placement rack holder in a longitudinal direction; a second arm unit having a second support supported from the outside, and connected to another end of the substrate placement rack holder in the longitudinal direction; and a connecting portion which connects the first arm unit to the second arm unit.Type: GrantFiled: September 16, 2015Date of Patent: May 8, 2018Assignee: Tokyo Electron LimitedInventor: Shinji Wakabayashi
-
Patent number: 9929030Abstract: Provided is a substrate processing device capable of improving throughput without increasing the operation speed of a drive device. Vacuum processing chambers which house a wafer for plasma processing of the wafer are respectively provided with gate valves for opening and closing a wafer inlet/outlet port, and wafer detection sensors for detecting the wafer moving forward or backward through the wafer inlet/outlet port, and a scara robot for making extending/retracting motion and rotating motion transfers the wafer. At this time, the scara robot starts the rotating motion to transfer the wafer picked up from the vacuum processing chamber in response to a trigger signal transmitted from the wafer detection sensor. The trigger signal indicates that the wafer has passed through the wafer inlet/outlet port and has arrived at a point where the gate valve and the wafer inlet/outlet port no longer interfere with the wafer.Type: GrantFiled: November 12, 2013Date of Patent: March 27, 2018Assignee: TOKYO ELECTRON LIMITEDInventor: Shinji Wakabayashi
-
Patent number: 9887115Abstract: Provided is a substrate processing apparatus that can suppress the amount of inert gas and dry gas used and also can prevent reductions in throughput. A substrate processing apparatus is provided with: a loader module; an opener that removes a cover from a FOUP having a main body, an opening and the cover, to communicate the inside of the FOUP with the inside of the loader module through the opening; an N2 gas supply unit that is attached to the loader module and supplies N2 gas to the inside of the FOUP; and two slide cover plates movable respectively along an opening surface of the opening. The slide cover plates move toward each other until the gap therebetween is 1 mm to 3 mm to shield the opening of the FOUP that is attached to the loader module from the inside of the loader module.Type: GrantFiled: November 12, 2013Date of Patent: February 6, 2018Assignee: TOKYO ELECTRON LIMITEDInventor: Shinji Wakabayashi
-
Publication number: 20180033663Abstract: A carrier transport device capable of delivering a carrier to and from an external transport device which transports the carrier is provided. The carrier transport device includes a housing on which the carrier is mountable, first ports provided in the housing and configured to deliver the carrier to and from the external transport device, second ports provided in the housing and provided with a lid opening/closing mechanism, and a transfer machine provided in the housing and configured to transfer the carrier. The first ports, the transfer machine and the second ports are disposed under a transport path of the external transport device. The first ports and the second ports are disposed on both sides of the transfer machine. The second ports are configured at multiple stages.Type: ApplicationFiled: December 24, 2015Publication date: February 1, 2018Inventors: Shinji WAKABAYASHI, Keisuke KONDOH
-
Patent number: 9732881Abstract: Disclosed is a gate valve that opens/closes a plurality of vertically arranged openings by a plurality of valve bodies when conveying a plurality of vertically arranged substrates to an inside of a vacuum container. The gate valve includes: a housing including the plurality of openings formed therein; a supporting member configured to support the plurality of valve bodies; a driving mechanism configured to move the plurality of valve bodies via the supporting member such that the plurality of openings is opened/closed; and a plurality of guide mechanisms arranged to correspond to the plurality of valve bodies, respectively. Each of the plurality of guide mechanisms includes: a vertically stretchable bellows fixed to the housing; and a guide member contained in the bellows and configured to guide the supporting member inside the bellows.Type: GrantFiled: September 1, 2015Date of Patent: August 15, 2017Assignee: Tokyo Electron LimitedInventors: Shinji Wakabayashi, Keisuke Kondoh, Norihiko Tsuji
-
Publication number: 20170154799Abstract: A substrate transfer chamber for unloading the substrates from the containers includes a housing-shaped main body and a plurality of container connecting mechanisms to which the containers are connected. In the main body, some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.Type: ApplicationFiled: February 9, 2017Publication date: June 1, 2017Inventors: Shinji WAKABAYASHI, Keisuke KONDOH, Sensho KOBAYASHI
-
Publication number: 20170025290Abstract: A load lock apparatus having a load lock chamber, which is connected to a vacuum transfer chamber configured to transfer a substrate under a vacuum pressure state via a communication hole which is opened and closed by a gate valve, and configured to be capable of switching an inner pressure into an atmospheric pressure state and the vacuum pressure state, is provided. The load lock apparatus includes a load lock chamber main body in which a substrate container having an attachable/detachable cover is carried, wherein the communication hole is formed in a side surface of the load lock chamber; and a cover attaching/detaching mechanism installed at a height position vertically arranged with the communication hole in the load lock chamber; and an elevating mechanism including a mounting table on which the substrate container is loaded and configured to lift and lower the mounting table.Type: ApplicationFiled: July 21, 2016Publication date: January 26, 2017Inventor: Shinji WAKABAYASHI