Patents by Inventor Shinji Watanabe

Shinji Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160299330
    Abstract: An image processing device and image processing method are provided. A device for controlling display of a sequence of images of living objects obtained through microscopy may comprise a processor and a storage unit. The storage unit may store a program which, when executed by the processor, causes the processor to perform acts. The acts may include acquiring a first sequence of first images of living objects obtained through microscopy. The acts may further include extracting a second sequence of second images from the first sequence of first images, wherein a number of second images in the second sequence is less than a number of first images in the first sequence. The acts may further include controlling a display device to display the second sequence of second images.
    Type: Application
    Filed: November 14, 2014
    Publication date: October 13, 2016
    Applicant: Sony Corporation
    Inventors: KAZUKI AISAKA, SHINJI WATANABE
  • Publication number: 20160300779
    Abstract: Thermal resistance is reduced from an element surface of a semiconductor chip to the rear surface of a semiconductor package. Split patterning of a metal is easily carried out, stress produced by a thermal expansion coefficient between silicon and metal is significantly reduced and environment reliability is improved. Low cost is realized by manufacturing a semiconductor package without using a TIM material. A semiconductor package is provided including a semiconductor chip including a first surface and a second surface opposed to the first surface and covered with a resin, an electrode being arranged over the first surface, a first wiring connected to the first surface directly or via a first opening arranged in the resin, and a second wiring connected to the second surface via a second opening arranged in the resin.
    Type: Application
    Filed: April 4, 2016
    Publication date: October 13, 2016
    Inventors: Shinji WATANABE, Toshihiro Iwasaki, Michiaki Tamakawa
  • Publication number: 20160246045
    Abstract: An imaging system, comprising a controller configured to control the imaging system to: capture a first image of a sample, the first image being one of a bright field image, a phase difference image, and a differential interference image; and capture, based at least in part on information obtained from the first image, a second, image of the sample, the second image being a different type of image than the first image.
    Type: Application
    Filed: October 29, 2014
    Publication date: August 25, 2016
    Inventors: SHINJI WATANABE, KAZUKI AISAKA
  • Publication number: 20160208636
    Abstract: With a simple structure in which the component count is reduced, the occurrence of noise and vibrations can be prevented in a range from a minute opening degree to the vicinity of an intermediate opening degree, and a pressure loss can be decreased when an opening degree is a fully-open opening degree or the vicinity thereof and thus the efficiency of a steam turbine can be improved.
    Type: Application
    Filed: September 24, 2014
    Publication date: July 21, 2016
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Tsutomu OOISHI, Shinji WATANABE
  • Publication number: 20160178524
    Abstract: A method of setting a laser-light intensity value includes: emitting laser light, the laser light being excitation light, a fluorescent-dyed biological sample being irradiated with the excitation light and emitting light; detecting fluorescence emitted by the biological sample, and outputting a signal corresponding to a brightness value; prestoring relation information, the relation information including the plurality of laser-light intensity values, and information on at least one possible correlation between a phototoxicity degree and the brightness value in relation to each of the laser-light intensity values, the phototoxicity to the biological sample resulting from the laser light; generating a fluorescence image having the brightness value based on the output signal; calculating a brightness value representative of a ROI area based on the generated fluorescence image; and referring to the relation information, and determining a laser-light intensity value satisfying tolerance of the phototoxicity based
    Type: Application
    Filed: March 2, 2016
    Publication date: June 23, 2016
    Applicant: Sony Corporation
    Inventors: Shinji Watanabe, Kazuki Aisaka
  • Publication number: 20160172580
    Abstract: A magnetic shielding package of a non-volatile magnetic memory element, including: a soft magnetic material support plate 12; a first insulating material layer 13 formed on the support plate; a non-volatile magnetic memory element 11 fixed on the first insulating material layer; a second insulating material layer 14 that encapsulates the memory element and the periphery thereof; in the second insulating material layer, a wiring layer 15, a soft magnetic layer 15b or 25 and a conductive portion 16 connecting an electrode of the circuit surface of the memory element and the wiring layer; and a magnetic shield part 17 containing a soft magnetic material arranged like a wall with a distance from a side surface of the memory element so as to surround the memory element side surface partially or entirely, the magnetic shield part being magnetically connected to the soft magnetic layer.
    Type: Application
    Filed: December 9, 2015
    Publication date: June 16, 2016
    Inventors: Hiroaki MATSUBARA, Toshihiro IWASAKI, Tomoshige CHIKAI, Kiminori ISHIDO, Shinji WATANABE, Michiaki TAMAKAWA
  • Patent number: 9368474
    Abstract: A manufacturing method for a semiconductor device of the present invention includes: preparing a semiconductor wafer including an electrode formed therein; electrically connecting a first semiconductor element formed in a semiconductor chip and the electrode formed in the semiconductor wafer; filling a gap between the semiconductor wafer and the semiconductor chip with a first insulating resin layer; forming a second insulating resin layer on the semiconductor wafer; grinding the second insulating resin layer and the semiconductor chip until a thickness of the semiconductor chip reaches a predetermined thickness; forming a first insulating layer on the second insulating resin layer and the semiconductor chip; forming a line on the first insulating layer connected with a conductive material filled an opening in the first insulating layer and the second insulating resin layer to expose the electrode; and grinding the semiconductor wafer until a thickness of the semiconductor wafer reaches a predetermined thickn
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: June 14, 2016
    Assignee: J-DEVICES CORPORATION
    Inventors: Hiroaki Matsubara, Tomoshige Chikai, Kiminori Ishido, Takashi Nakamura, Hirokazu Honda, Hiroshi Demachi, Yoshikazu Kumagaya, Shotaro Sakumoto, Shinji Watanabe, Sumikazu Hosoyamada, Shingo Nakamura, Takeshi Miyakoshi, Toshihiro Iwasaki, Michiaki Tamakawa
  • Patent number: 9368110
    Abstract: A method distinguishes components of an acoustic signal by processing the signal to estimate a set of analysis features, wherein each analysis feature defines an element of the signal and has feature values that represent parts of the signal, processing the signal to estimate input features of the signal, and processing the input features using a deep neural network to assign an associative descriptor to each element of the signal, wherein a degree of similarity between the associative descriptors of different elements is related to a degree to which the parts of the signal represented by the elements belong to a single component of the signal. The the similarities between associative descriptors are processed to estimate correspondences between the elements of the signal and the components in the signal. Then, the signal is processed using the correspondences to distinguish component parts of the signal.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: June 14, 2016
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: John Hershey, Jonathan Le Roux, Shinji Watanabe, Zhuo Chen
  • Patent number: 9362200
    Abstract: A semiconductor package includes a support substrate arranged with a first aperture reaching a semiconductor device on a rear side, the semiconductor device is bonded via an adhesive to a surface of the support substrate, an insulating layer covering the semiconductor device, and wiring for connecting the semiconductor device and an external terminal through the insulating layer. The adhesive may form a part of the first aperture. In addition, a heat dissipation part may be arranged in the first aperture and a metal material may be filled in the first aperture.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: June 7, 2016
    Assignee: J-DEVICES CORPORATION
    Inventors: Hirokazu Honda, Shinji Watanabe, Toshihiro Iwasaki, Kiminori Ishido, Koichiro Niwa, Takeshi Miyakoshi, Sumikazu Hosoyamada, Yoshikazu Kumagaya, Tomoshige Chikai, Shingo Nakamura, Shotaro Sakumoto, Hiroaki Matsubara
  • Patent number: 9345156
    Abstract: A power supply device includes a main body, a cover member, a rechargeable battery, and an inverter device. The main body is configured of box-shape formed with an opening. The cover member is configured to open and close the opening. The rechargeable battery is accommodated in the main body. The inverter device is configured to be accommodated in the main body. The inverter device converts a direct voltage from the battery to an alternating voltage and outputs the alternating voltage.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: May 17, 2016
    Assignee: Hitachi Koki Co., Ltd.
    Inventors: Masayuki Ogura, Shinji Watanabe, Haruhisa Fujisawa, Kazuhiko Funabashi, Takuhiro Murakami, Yasushi Nakano, Hideki Watanabe, Norihide Tao, Takafumi Itoh
  • Patent number: 9337763
    Abstract: A power tool system includes: a power tool including an AC motor; a portable battery pack; and a power supply device that converts a DC power supplied from the portable battery pack into an AC power to supply the AC power to the AC motor.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: May 10, 2016
    Assignee: Hitachi Koki Co., Ltd.
    Inventors: Kazuhiko Funabashi, Nobuhiro Takano, Yoshikazu Kawano, Yasushi Nakano, Yuki Horie, Shinji Watanabe, Miyoji Onose, Haruhisa Fujisawa
  • Patent number: 9336770
    Abstract: Provided is a pattern recognition apparatus for creating multiple systems and combining the multiple systems to improve the recognition performance, including a discriminative training unit for constructing model parameters of a second or subsequent system based on an output tendency of a previously-constructed model so as to be different from the output tendency of the previously-constructed model. Accordingly, when multiple systems are combined, the recognition performance can be improved without trials-and-errors.
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: May 10, 2016
    Assignees: MITSUBISHI ELECTRIC CORPORATION, MITSUBISHI ELECTRIC RESEARCH LABORATORIES, INC.
    Inventors: Yuki Tachioka, Shinji Watanabe
  • Publication number: 20160115518
    Abstract: The invention provides methods to identify agents useful to prevent, inhibit or treat viral infections, e.g., filovirus infections, as well as compositions having one or more agents to prevent, inhibit or treat viral infection.
    Type: Application
    Filed: October 21, 2015
    Publication date: April 28, 2016
    Inventors: Yoshihiro Kawaoka, Shinji Watanabe, Yasuko Hatta
  • Publication number: 20160111107
    Abstract: A method transforms a noisy speech signal to an enhanced speech signal, by first acquiring the noisy speech signal from an environment. The noisy speech signal is processed by an automatic speech recognition system (ASR) to produce ASR features. The the ASR features and noisy speech spectral features are processed using an enhancement network having network parameters to produce a mask. Then, the mask is applied to the noisy speech signal to obtain the enhanced speech signal.
    Type: Application
    Filed: February 12, 2015
    Publication date: April 21, 2016
    Inventors: Hakan Erdogan, John Hershey, Shinji Watanabe, Jonathan Le Roux
  • Publication number: 20160111108
    Abstract: A method transforms a noisy audio signal to an enhanced audio signal, by first acquiring the noisy audio signal from an environment. The noisy audio signal is processed by an enhancement network having network parameters to jointly produce a magnitude mask and a phase estimate. Then, the magnitude mask and the phase estimate are used to obtain the enhanced audio signal.
    Type: Application
    Filed: February 12, 2015
    Publication date: April 21, 2016
    Inventors: Hakan Erdogan, John Hershey, Shinji Watanabe, Jonathan Le Roux
  • Patent number: 9311430
    Abstract: A dialog manager receives previous user actions and previous observations and current observations. Previous and current user states, previous user actions, current user actions, future system actions, and future observations are hypothesized. The user states, the user actions, and the user observations are hidden. A feature vector is extracted based on the user states, the system actions, the user actions, and the observations. An expected reward of each current action is based on a log-linear model using the feature vectors. Then, the current action that has an optimal expected reward is outputted.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: April 12, 2016
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Shinji Watanabe, Hao Tang
  • Patent number: 9304085
    Abstract: A method of setting a laser-light intensity value includes: emitting laser light, the laser light being excitation light, a fluorescent-dyed biological sample being irradiated with the excitation light and emitting light; detecting fluorescence emitted by the biological sample, and outputting a signal corresponding to a brightness value; prestoring relation information, the relation information including the plurality of laser-light intensity values, and information on at least one possible correlation between a phototoxicity degree and the brightness value in relation to each of the laser-light intensity values, the phototoxicity to the biological sample resulting from the laser light; generating a fluorescence image having the brightness value based on the output signal; calculating a brightness value representative of a ROI area based on the generated fluorescence image; and referring to the relation information, and determining a laser-light intensity value satisfying tolerance of the phototoxicity based
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: April 5, 2016
    Assignee: Sony Corporation
    Inventors: Shinji Watanabe, Kazuki Aisaka
  • Publication number: 20160079204
    Abstract: A manufacturing method for a semiconductor device of the present invention includes: preparing a semiconductor wafer including an electrode formed therein; electrically connecting a first semiconductor element formed in a semiconductor chip and the electrode formed in the semiconductor wafer; filling a gap between the semiconductor wafer and the semiconductor chip with a first insulating resin layer; forming a second insulating resin layer on the semiconductor wafer; grinding the second insulating resin layer and the semiconductor chip until a thickness of the semiconductor chip reaches a predetermined thickness; forming a first insulating layer on the second insulating resin layer and the semiconductor chip; forming a line on the first insulating layer connected with a conductive material filled an opening in the first insulating layer and the second insulating resin layer to expose the electrode; and grinding the semiconductor wafer until a thickness of the semiconductor wafer reaches a predetermined thickn
    Type: Application
    Filed: September 10, 2015
    Publication date: March 17, 2016
    Inventors: Hiroaki Matsubara, Tomoshige Chikai, Kiminori Ishido, Takashi Nakamura, Hirokazu Honda, Hiroshi Demachi, Yoshikazu Kumagaya, Shotaro Sakumoto, Shinji Watanabe, Sumikazu Hosoyamada, Shingo Nakamura, Takeshi Miyakoshi, Toshihiro Iwasaki, Michiaki Tamakawa
  • Publication number: 20160054881
    Abstract: An information terminal having a touch panel includes an acquisition unit that acquires operation information related to an input operation on the touch panel, a determination unit that determines the amount of operation in a first specified operation in the operation information, and a control unit that reduces an operating region where an operation on the touch panel can be received relative to the touch panel screen in accordance with the amount of operation in the first specified operation, and the determination unit does not make determination on an operation start position of the input operation in the operation information.
    Type: Application
    Filed: March 13, 2014
    Publication date: February 25, 2016
    Applicant: NTT DOCOMO, INC.
    Inventors: Eriko YOSHIDA, Koji OKAMOTO, Kei TOMITA, Shinji WATANABE
  • Publication number: 20160027715
    Abstract: A stacked semiconductor package includes a first semiconductor package including a first circuit board and a first semiconductor device mounted on the first circuit board; a second semiconductor package including a second circuit board and a second semiconductor device mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package; and a heat transfer member provided on the first semiconductor device and a part of the first circuit board, the part being around the first semiconductor device.
    Type: Application
    Filed: July 20, 2015
    Publication date: January 28, 2016
    Inventors: Shinji WATANABE, Sumikazu HOSOYAMADA, Shingo NAKAMURA, Hiroshi DEMACHI, Takeshi MIYAKOSHI, Tomoshige CHIKAI, Kiminori ISHIDO, Hiroaki MATSUBARA, Takashi NAKAMURA, Hirokazu HONDA, Yoshikazu KUMAGAYA, Shotaro SAKUMOTO, Toshihiro IWASAKI, Michiaki TAMAKAWA