Abstract: Proposed are a composite material having a high adhesiveness, wherein non-penetrating pores that are formed in a silicone surface layer are filled up with a metal or the like without leaving any voids by using the plating technique and the silicone surface layer is coated with the metal or the like, and a method of producing the composite material. A composite material, which has a high adhesiveness between a second metal or an alloy of the second metal (106a, 106b) and a silicone surface, can be obtained by filling up non-penetrating pores that are formed in the surface of a silicone substrate (100) substantially with a second metal or an alloy of the second metal (106a) with the use of the autocatalytic electroless plating technique wherein a first metal located at the bottom of the non-penetrating pores as described above serves as the starting point, and coating the surface of the silicone substrate (100) with the second metal (106b).

Abstract: Disclosed is a composite material wherein adhesion between a silicon surface and a plating material is enhanced. A method and an apparatus for producing the composite material are also disclosed.

Abstract: Proposed are a composite material, wherein non-penetrating pores that are formed in a silicon surface layer are filled up with a metal or the like without leaving any voids by using the plating technique, and a method of producing the composite material. A composite material, which has been packed at a high accuracy, or in other words, in which little voids are left, can be obtained by filling up non-penetrating pores that are formed from a silicon surface (100) substantially with a second metal or an alloy of the second metal (106) with the use of the autocatalytic electroless plating technique wherein a first metal located at the bottom of the non-penetrating pores as described above serves as the starting point.

Abstract: Proposed are a composite material having a high adhesiveness, wherein non-penetrating pores that are formed in a silicone surface layer are filled up with a metal or the like without leaving any voids by using the plating technique and the silicone surface layer is coated with the metal or the like, and a method of producing the composite material. A composite material, which has a high adhesiveness between a second metal or an alloy of the second metal (106a, 106b) and a silicone surface, can be obtained by filling up non-penetrating pores that are formed in the surface of a silicone substrate (100) substantially with a second metal or an alloy of the second metal (106a) with the use of the autocatalytic electroless plating technique wherein a first metal located at the bottom of the non-penetrating pores as described above serves as the starting point, and coating the surface of the silicone substrate (100) with the second metal (106b).

Abstract: Disclosed is a composite material wherein adhesion between a silicon surface and a plating material is enhanced. A method and an apparatus for producing the composite material are also disclosed.

Abstract: Proposed are a composite material having a high adhesiveness, wherein non-penetrating pores that are formed in a silicone surface layer are filled up with a metal or the like without leaving any voids by using the plating technique and the silicone surface layer is coated with the metal or the like, and a method of producing the composite material. A composite material, which has a high adhesiveness between a second metal or an alloy of the second metal (106a, 106b) and a silicone surface, can be obtained by filling up non-penetrating pores that are formed in the surface of a silicone substrate (100) substantially with a second metal or an alloy of the second metal (106a) with the use of the autocatalytic electroless plating technique wherein a first metal located at the bottom of the non-penetrating pores as described above serves as the starting point, and coating the surface of the silicone substrate (100) with the second metal (106b).

Abstract: Proposed are a composite material, wherein non-penetrating pores that are formed in a silicon surface layer are filled up with a metal or the like without leaving any voids by using the plating technique, and a method of producing the composite material. A composite material, which has been packed at a high accuracy, or in other words, in which little voids are left, can be obtained by filling up non-penetrating pores that are formed from a silicon surface (100) substantially with a second metal or an alloy of the second metal (106) with the use of the autocatalytic electroless plating technique wherein a first metal located at the bottom of the non-penetrating pores as described above serves as the starting point.

Abstract: Proposed are a composite material, wherein non-penetrating pores that are formed in a silicon surface layer are filled up with a metal or the like without leaving any voids by using the plating technique, and a method of producing the composite material. A composite material, which has been packed at a high accuracy, or in other words, in which little voids are left, can be obtained by filling up non-penetrating pores that are formed from a silicon surface (100) substantially with a second metal or an alloy of the second metal (106) with the use of the autocatalytic electroless plating technique wherein a first metal located at the bottom of the non-penetrating pores as described above serves as the starting point.

Abstract: Disclosed is a composite material wherein adhesion between a silicon surface and a plating material is enhanced. A method and an apparatus for producing the composite material are also disclosed.

Abstract: Proposed are a composite material having a high adhesiveness, wherein non-penetrating pores that are formed in a silicone surface layer are filled up with a metal or the like without leaving any voids by using the plating technique and the silicone surface layer is coated with the metal or the like, and a method of producing the composite material. A composite material, which has a high adhesiveness between a second metal or an alloy of the second metal (106a, 106b) and a silicone surface, can be obtained by filling up non-penetrating pores that are formed in the surface of a silicone substrate (100) substantially with a second metal or an alloy of the second metal (106a) with the use of the autocatalytic electroless plating technique wherein a first metal located at the bottom of the non-penetrating pores as described above serves as the starting point, and coating the surface of the silicone substrate (100) with the second metal (106b).