Patents by Inventor Shinji Yamanashi

Shinji Yamanashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140201999
    Abstract: A method of manufacturing a composite contact in which a flange section with a large diameter at an end of a base part with a small diameter, the composite contact having: a contact section which is made from silver alloy into an upper-surface part of the flange section; and a leg section which is made from copper alloy by forming a large-diameter part so as to form a lower-surface part of the flange section is made integrally with the base part, having the steps of: a primary-forming process forging a copper-alloy wire and a silver-alloy wire having a smaller diameter than that of the copper-alloy wire in a hole of a forming die in a state of being butted to each other so as to form a primary-formed body including a silver-alloy part and a copper-alloy part so that the wires are bonded with each other.
    Type: Application
    Filed: June 21, 2012
    Publication date: July 24, 2014
    Applicant: MITSUBISHI MATERIALS C.M.I. CORPORATION
    Inventors: Koichi Kita, Hideki Umeoka, Noriaki Murahashi, Shinji Yamanashi, Akihiko Inaba, Hideo Takizawa
  • Patent number: 8187395
    Abstract: Disclosed is an electrical contact having high electrical conductivity for a compact electromagnetic relay including an internally oxidized silver-oxide material which is prepared by subjecting an Ag alloy having a composition consisting essentially of, by weight, 5.1 to 9% Sn, 1.5 to 5% In, and 0.005 to 0.06% Bi, with the balance being Ag and unavoidable impurities, to an internal oxidation treatment and then subjecting to a heat treatment for diffusion, aggregation, and growth of precipitated oxides, wherein the internally oxidized silver-oxide material has a metallographic structure such that coarse grains of composite oxides are dispersed and distributed in an Ag matrix, the coarse grains of composite oxides being formed as a result of coarsening of ultra-fine grains of Sn-based oxides and ultra-fine grains of In-based oxides, which are precipitated by the internal oxidation treatment, by the heat treatment for diffusion, aggregation, and growth of the precipitated oxides.
    Type: Grant
    Filed: August 6, 2004
    Date of Patent: May 29, 2012
    Assignee: Mitsubishi Materials C.M.I. Corporation
    Inventors: Yuzo Uemura, Koshiro Ueda, Noriaki Murahashi, Shinji Yamanashi, Michio Taki, Hiroyasu Endo
  • Publication number: 20050028896
    Abstract: Disclosed is an electrical contact having high electrical conductivity for a compact electromagnetic relay including an internally oxidized silver-oxide material which is prepared by subjecting an Ag alloy having a composition consisting essentially of, by weight, 5.1 to 9% Sn, 1.5 to 5% In, and 0.005 to 0.06% Bi, with the balance being Ag and unavoidable impurities, to an internal oxidation treatment and then subjecting to a heat treatment for diffusion, aggregation, and growth of precipitated oxides, wherein the internally oxidized silver-oxide material has a metallographic structure such that coarse grains of composite oxides are dispersed and distributed in an Ag matrix, the coarse grains of composite oxides being formed as a result of coarsening of ultra-fine grains of Sn-based oxides and ultra-fine grains of In-based oxides, which are precipitated by the internal oxidation treatment, by the heat treatment for diffusion, aggregation, and growth of the precipitated oxides.
    Type: Application
    Filed: August 6, 2004
    Publication date: February 10, 2005
    Applicant: Mitsubishi Materials C.M.I. Corporation
    Inventors: Yuzo Uemura, Koshiro Ueda, Noriaki Murahashi, Shinji Yamanashi, Michio Taki, Hiroyasu Endo