Patents by Inventor Shinjiro Hayashi
Shinjiro Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220171304Abstract: A toner contains toner particles that include a binding resin, a crystalline resin, an ester wax and a dispersant. The binding resin includes an amorphous polyester resin, and the dispersant includes an acrylic copolymer resin or a hybrid resin of the amorphous polyester resin and a styrene resin. When an endothermic peak temperature that is derived from the ester wax in a temperature rise is represented by T1, an exothermic peak temperature that is derived from the ester wax in cooling is represented by T2, a peak temperature of the crystalline resin is represented by Tc and the endothermic peak temperature, the exothermic peak temperature and the peak temperature are measured with a differential scanning calorimeter, T2<Tc<T1 is satisfied, and T1 is greater than 65° C. and less than 85° C.Type: ApplicationFiled: November 24, 2021Publication date: June 2, 2022Inventors: Shinjiro HAYASHI, YORITAKA TSUBAKI
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Patent number: 10543482Abstract: The present invention relates to a stable palladium ion catalyst aqueous solution for electroless metal plating that does not use boric acid and can be used stably over a wide pH range. The catalyst solution for electroless plating of the present invention contains palladium ion, palladium ion complexing agent, and a specific amine compound and is alkaline.Type: GrantFiled: October 30, 2014Date of Patent: January 28, 2020Assignee: Rohm and Haas Electronic Materials LLCInventors: Hiroki Okada, Shenghua Li, Shinjiro Hayashi
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Patent number: 9637833Abstract: A copper plating solution which contains compounds with the structure —X—S—Y— where X and Y are, independently of each other, atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and aliphatic semialdehydes. By using this copper electroplating solution it is possible to form good filled vias without worsening the appearance of the plating.Type: GrantFiled: December 24, 2012Date of Patent: May 2, 2017Inventors: Matsuko Saito, Makoto Sakai, Shinjiro Hayashi
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Publication number: 20160186348Abstract: An electrolytic copper plating solution is disclosed which can form a rectangular circuit pattern. A method for conducting electrolytic plating on a board by using the electrolytic copper plating solution and an electrolytic circuit which is formed by using the electrolytic copper plating solution is also described. The electrolytic copper plating solution contains two kinds of specific surfactants.Type: ApplicationFiled: November 13, 2015Publication date: June 30, 2016Inventors: Yoko Mizuno, Makoto Sakai, Mutsuko Saito, Toshiyuki Morinaga, Shinjiro Hayashi
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Patent number: 9175413Abstract: A copper electroplating solution which contains compounds with the structure —X—S—Y— wherein X and Y are, independently atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and ninhydrin. By using this copper electroplating solution, it is possible to form good filled vias without worsening the appearance of the plating.Type: GrantFiled: December 27, 2012Date of Patent: November 3, 2015Inventors: Mutsuko Saito, Makoto Sakai, Toshiyuki Morinaga, Shinjiro Hayashi
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Patent number: 9169576Abstract: An electrolytic copper plating solution is provided which has an excellent via filling ability without using formaldehyde, which is harmful to the environment. An electrolytic copper plating solution which contains compounds which have an —X—S—Y— structure wherein X and Y are individually atoms selected from a group comprising hydrogen, carbon, sulfur, nitrogen, and oxygen atoms and X and Y can be the same only when they are carbon atoms and specific nitrogen-containing compounds. Good filled vias can be made without causing a worsening of the exterior appearance of the plating by using this electrolytic copper plating solution.Type: GrantFiled: May 31, 2013Date of Patent: October 27, 2015Inventors: Mutsuko Saito, Makoto Sakai, Yoko Mizuno, Toshiyuki Morinaga, Shinjiro Hayashi
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Patent number: 9150976Abstract: Copper electroplating liquid which does not use formaldehyde, which is harmful to the environment, and which exhibits excellent via filling ability is offered. The copper electroplating liquid of this invention includes the compound that has the structure of —X—S—Y— where X and Y are each an atom selected from the group of hydrogen atoms, carbon atoms, sulfur atoms, nitrogen atoms and oxygen atoms, and X and Y can be the same only when they are carbon atoms, and a specific urea derivative. When the copper electroplating liquid is used, deterioration of the appearance will not occur and a good filled via can be formed.Type: GrantFiled: October 1, 2013Date of Patent: October 6, 2015Inventors: Mutsuko Saito, Makoto Sakai, Yoko Mizuno, Toshiyuki Morinaga, Shinjiro Hayashi
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Publication number: 20150118406Abstract: The present invention relates to a stable palladium ion catalyst aqueous solution for electroless metal plating that does not use boric acid and can be used stably over a wide pH range. The catalyst solution for electroless plating of the present invention contains palladium ion, palladium ion complexing agent, and a specific amine compound and is alkaline.Type: ApplicationFiled: October 30, 2014Publication date: April 30, 2015Inventors: Hiroki OKADA, Li SHENGHUA, Shinjiro HAYASHI
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Publication number: 20140183052Abstract: A copper electroplating solution which contains compounds with the structure —X—S—Y— wherein X and Y are, independently atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and ninhydrin. By using this copper electroplating solution, it is possible to form good filled vias without worsening the appearance of the plating.Type: ApplicationFiled: December 27, 2012Publication date: July 3, 2014Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLCInventors: Mutsuko SAITO, Makoto SAKAI, Toshiyuki MORINAGA, Shinjiro HAYASHI
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Publication number: 20140174937Abstract: A copper plating solution which contains compounds with the structure —X—S—Y— where X and Y are, independently of each other, atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and aliphatic semialdehydes. By using this copper electroplating solution it is possible to form good filled vias without worsening the appearance of the plating.Type: ApplicationFiled: December 24, 2012Publication date: June 26, 2014Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLCInventors: Matsuko Saito, Makoto Sakai, Shinjiro Hayashi
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Publication number: 20140097087Abstract: Copper electroplating liquid which does not use formaldehyde, which is harmful to the environment, and which exhibits excellent via filling ability is offered. The copper electroplating liquid of this invention includes the compound that has the structure of —X—S—Y— where X and Y are each an atom selected from the group of hydrogen atoms, carbon atoms, sulfur atoms, nitrogen atoms and oxygen atoms, and X and Y can be the same only when they are carbon atoms, and a specific urea derivative. When the said copper electroplating liquid is used, deterioration of the appearance will not occur and a good filled via can be formed.Type: ApplicationFiled: October 1, 2013Publication date: April 10, 2014Inventors: Mutsuko SAITO, Makoto SAKAI, Yoko MIZUNO, Toshiyuki MORINAGA, Shinjiro HAYASHI
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Publication number: 20130319867Abstract: An electrolytic copper plating solution is provided which has an excellent via filling ability without using formaldehyde, which is harmful to the environment. An electrolytic copper plating solution which contains compounds which have an —X—S—Y— structure wherein X and Y are individually atoms selected from a group comprising hydrogen, carbon, sulfur, nitrogen, and oxygen atoms and X and Y can be the same only when they are carbon atoms and specific nitrogen-containing compounds. Good filled vias can be made without causing a worsening of the exterior appearance of the plating by using this electrolytic copper plating solution.Type: ApplicationFiled: May 31, 2013Publication date: December 5, 2013Inventors: Mutsuko SAITO, Makoto SAKAI, Yoko MIZUNO, Toshiyuki MORINAGA, Shinjiro HAYASHI
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Publication number: 20120132530Abstract: To provide a tin plating solution having uniformity of through-hole plating, uniformity of film thickness distribution and no burn deposits even. The tin plating solution include a tin ion source, at least one non-ionic surfactant, imidazoline dicarboxylate and 1,10-phenanthroline.Type: ApplicationFiled: October 22, 2011Publication date: May 31, 2012Applicant: Rohm and Haas Electronic Materials LLCInventors: Shinjiro HAYASHI, Makoto SAKAI, Mutsuko SAITO
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Patent number: 7857961Abstract: To provide a copper plating solution composition that precipitates copper plated membranes that are both uniform and smooth and which has good external appearance even if the copper plated membranes that are formed are relatively thin. The copper plating solution composition contains chlorine ions and bromide ions in specific volumes.Type: GrantFiled: August 11, 2008Date of Patent: December 28, 2010Assignee: Rohm and Haas Electronic Materials LLCInventors: Shinjiro Hayashi, Hisanori Takiguchi
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Patent number: 7857960Abstract: Providing a copper plating method with which to precipitate copper-plated membranes that are uniform and flat, and that have good mirror gloss even when relatively thin copper plated membranes are formed. A copper plating method wherein the object to be plated and a pre-treatment solution in which bromide compound ions are contained are brought into contact and copper is precipitated by means of electrical plating using a copper plating solution.Type: GrantFiled: August 11, 2008Date of Patent: December 28, 2010Assignee: Rohm and Haas Electronic Materials LLCInventors: Shinjiro Hayashi, Hisanori Takiguchi
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Publication number: 20090038949Abstract: Providing a copper plating method with which to precipitate copper-plated membranes that are uniform and flat, and that have good mirror gloss even when relatively thin copper plated membranes are formed. A copper plating method wherein the object to be plated and a pre-treatment solution in which bromide compound ions are contained are brought into contact and copper is precipitated by means of electrical plating using a copper plating solution.Type: ApplicationFiled: August 11, 2008Publication date: February 12, 2009Applicant: Rohm and Haas Electronic Materials LLCInventors: Shinjiro Hayashi, Hisanori Takiguchi
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Publication number: 20090038951Abstract: To provide a copper plating solution composition that precipitates copper plated membranes that are both uniform and smooth and which has good external appearance even if the copper plated membranes that are formed are relatively thin. The copper plating solution composition contains chlorine ions and bromide ions in specific volumes.Type: ApplicationFiled: August 11, 2008Publication date: February 12, 2009Applicant: Rohm and Haas Electronic Materials LLCInventors: Shinjiro Hayashi, Hisanori Takiguchi
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Patent number: 7374652Abstract: Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage that deposit copper on the surface of an electronic device and in apertures on such substrate are provided. Such plating baths deposit a copper layer on the substrate surface that is substantially planar across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.Type: GrantFiled: July 7, 2006Date of Patent: May 20, 2008Assignee: Rohm and Haas Electronic Materials LLCInventors: Shinjiro Hayashi, Hideki Tsuchida, Masaru Kusaka, Koichi Yomogida
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Publication number: 20070007143Abstract: Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage that deposit copper on the surface of an electronic device and in apertures on such substrate are provided. Such plating baths deposit a copper layer on the substrate surface that is substantially planar across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.Type: ApplicationFiled: July 7, 2006Publication date: January 11, 2007Applicant: Rohm and Haas Electronic Materials LLCInventors: Shinjiro Hayashi, Hideki Tsuchida, Masaru Kusaka, Koichi Yomogida
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Patent number: 6977035Abstract: A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen atom, and X and Y may be the same only when they are a carbon atom, and by contacting the electrolytic copper plating solution with ozone is disclosed.Type: GrantFiled: November 26, 2003Date of Patent: December 20, 2005Assignee: Shipley Company, L.L.C.Inventors: Hideki Tsuchida, Masaru Kusaka, Shinjiro Hayashi