Patents by Inventor Shinjiro Tsuji
Shinjiro Tsuji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11498119Abstract: An injection device of a light metal injection molding machine of the disclosure includes: a melting cylinder that heats and melts a billet pushed along a cylinder hole and stores molten metal; an injection cylinder that injects, by an inserted plunger, the molten metal supplied by free fall due to the own weight from the melting cylinder through a communication path that can be opened and closed; and a molten metal pot in which a molten metal supply/discharge port connected to the melting cylinder is opened at a location in the melting cylinder that does not face an opening of the communication path on the melting cylinder side, and molten metal in an amount in excess of a capacity that can be stored in the melting cylinder is stored.Type: GrantFiled: March 8, 2022Date of Patent: November 15, 2022Assignee: Sodick Co., Ltd.Inventors: Shinjiro Tsuji, Shuji Kai
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Publication number: 20220339696Abstract: An injection device of a light metal injection molding machine of the disclosure includes: a melting cylinder that heats and melts a billet pushed along a cylinder hole and stores molten metal; an injection cylinder that injects, by an inserted plunger, the molten metal supplied by free fall due to the own weight from the melting cylinder through a communication path that can be opened and closed; and a molten metal pot in which a molten metal supply/discharge port connected to the melting cylinder is opened at a location in the melting cylinder that does not face an opening of the communication path on the melting cylinder side, and molten metal in an amount in excess of a capacity that can be stored in the melting cylinder is stored.Type: ApplicationFiled: March 8, 2022Publication date: October 27, 2022Applicant: Sodick Co., Ltd.Inventors: Shinjiro TSUJI, Shuji KAI
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Patent number: 10479061Abstract: A component bonding device includes a bonding tool which sucks a film-like component and which bonds the film-like component to a substrate. The bonding tool includes: a plurality of suction blocks, each of which has a suction hole for sucking the film-like component; and a suction block holding portion which has a block holding-available region capable of holding the plurality of suction blocks, and which holds the plurality of suction blocks so as to be arranged in a row in the block holding-available region. The suction block holding portion allows change of a holding position of at least one of the plurality of suction blocks to any desired position in the block holding-available region.Type: GrantFiled: June 18, 2015Date of Patent: November 19, 2019Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Akira Kameda, Shinjiro Tsuji
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Patent number: 10065275Abstract: A component crimping apparatus includes a crimping tool that sucks a film-like component and presses a crimping section of the sucked film-like component against the substrate to crimp the film-like component to the substrate. The crimping tool includes a block holding portion that includes a guide member extending in one direction within a horizontal plane, first suction blocks that are provided movably along the guide member and that sucks an upper part of the crimping section of the film-like component, a second suction block that is provided movably along the guide member of the block holding portion and that sucks an upper part of a non-crimping section of the film-like component and a block fixation unit that fixes the first suction blocks and the second suction block to the guide member.Type: GrantFiled: September 25, 2015Date of Patent: September 4, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Akira Kameda, Shinjiro Tsuji
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Patent number: 9983421Abstract: A component mounting line includes a first and a second component mounting devices. The first component mounting device adheres anisotropic conductive members to a region of a part of one side and a region of the other side of the substrate, temporarily crimps electronic components onto the region of the part of the one side and the region of the other side to which the anisotropic conductive members are adhered, and mainly crimps the electronic components onto the region of the other side. The second component mounting device adheres the anisotropic conductive members to remaining regions of the one side of the substrate, temporarily crimps the electronic components onto the remaining regions of the one side to which the anisotropic conductive members are adhered, and mainly crimps the electronic components onto the region of the part of the one side and the remaining regions of the one side.Type: GrantFiled: December 3, 2015Date of Patent: May 29, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Satoshi Adachi, Shinjiro Tsuji, Nobuyuki Kakita, Shingo Yamada
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Patent number: 9872395Abstract: A component crimping apparatus includes: a substrate holding part that holds a substrate of a transparent material, a component previously attached to each electrode of electrodes juxtaposed in an edge of the substrate through a photo-curable adhesive member; a supporting part that supports, by a transparent member, a region under the electrodes in the substrate; crimping tools that are juxtaposed over the transparent member and press the components to the substrate; and a light irradiating part that irradiates the adhesive member with light through the transparent member when the crimping tools press the components to the substrate. The crimping tools are configured movably in an arrangement direction of the crimping tools, the transparent member has a dimension capable of covering a whole region of a movable range of the crimping tools, and the light irradiating part irradiates a whole region of the transparent member with the light.Type: GrantFiled: July 21, 2015Date of Patent: January 16, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Akira Yamada, Shinjiro Tsuji, Satoshi Adachi, Yasutaka Tsuboi, Toshihiko Tsujikawa
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Patent number: 9739300Abstract: A component crimping apparatus includes: a substrate holding part that holds a substrate of a transparent material, a component previously attached to each electrode of electrodes juxtaposed in an edge of the substrate through a photo-curable adhesive member; a supporting part having a base part with an optical path and a transparent member on the base part and connected to the optical path, and supports, by the transparent member, a region under a targeted electrode in the substrate; a crimping tool arranged over the transparent member and presses the component to the substrate; a light irradiating part that irradiates the adhesive member attached to the targeted electrode with light through the optical path; and a light shielding member that covers a portion in which the transparent member is not installed in an opening part of the optical path in the base part.Type: GrantFiled: July 21, 2015Date of Patent: August 22, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Akira Yamada, Shinjiro Tsuji, Satoshi Adachi, Yasutaka Tsuboi, Toshihiko Tsujikawa
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Publication number: 20160286664Abstract: A component mounting line includes a first and a second component mounting devices. The first component mounting device adheres anisotropic conductive members to a region of a part of one side and a region of the other side of the substrate, temporarily crimps electronic components onto the region of the part of the one side and the region of the other side to which the anisotropic conductive members are adhered, and mainly crimps the electronic components onto the region of the other side. The second component mounting device adheres the anisotropic conductive members to remaining regions of the one side of the substrate, temporarily crimps the electronic components onto the remaining regions of the one side to which the anisotropic conductive members are adhered, and mainly crimps the electronic components onto the region of the part of the one side and the remaining regions of the one side.Type: ApplicationFiled: December 3, 2015Publication date: September 29, 2016Inventors: Satoshi ADACHI, Shinjiro TSUJI, Nobuyuki KAKITA, Shingo YAMADA
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Publication number: 20160113164Abstract: A component crimping apparatus includes a crimping tool that sucks a film-like component and presses a crimping section of the sucked film-like component against the substrate to crimp the film-like component to the substrate. The crimping tool includes a block holding portion that includes a guide member extending in one direction within a horizontal plane, first suction blocks that are provided movably along the guide member and that sucks an upper part of the crimping section of the film-like component, a second suction block that is provided movably along the guide member of the block holding portion and that sucks an upper part of a non-crimping section of the film-like component and a block fixation unit that fixes the first suction blocks and the second suction block to the guide member.Type: ApplicationFiled: September 25, 2015Publication date: April 21, 2016Inventors: Akira KAMEDA, Shinjiro TSUJI
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Publication number: 20160052197Abstract: A component crimping apparatus includes: a substrate holding part that holds a substrate of a transparent material, a component previously attached to each electrode of electrodes juxtaposed in an edge of the substrate through a photo-curable adhesive member; a supporting part that supports, by a transparent member, a region under the electrodes in the substrate; crimping tools that are juxtaposed over the transparent member and press the components to the substrate; and a light irradiating part that irradiates the adhesive member with light through the transparent member when the crimping tools press the components to the substrate. The crimping tools are configured movably in an arrangement direction of the crimping tools, the transparent member has a dimension capable of covering a whole region of a movable range of the crimping tools, and the light irradiating part irradiates a whole region of the transparent member with the light.Type: ApplicationFiled: July 21, 2015Publication date: February 25, 2016Inventors: Akira YAMADA, Shinjiro TSUJI, Satoshi ADACHI, Yasutaka TSUBOI, Toshihiko TSUJIKAWA
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Publication number: 20160052196Abstract: A component crimping apparatus includes: a substrate holding part that holds a substrate of a transparent material, a component previously attached to each electrode of electrodes juxtaposed in an edge of the substrate through a photo-curable adhesive member; a supporting part having a base part with an optical path and a transparent member on the base part and connected to the optical path, and supports, by the transparent member, a region under a targeted electrode in the substrate; a crimping tool arranged over the transparent member and presses the component to the substrate; a light irradiating part that irradiates the adhesive member attached to the targeted electrode with light through the optical path; and a light shielding member that covers a portion in which the transparent member is not installed in an opening part of the optical path in the base part.Type: ApplicationFiled: July 21, 2015Publication date: February 25, 2016Inventors: Akira YAMADA, Shinjiro TSUJI, Satoshi ADACHI, Yasutaka TSUBOI, Toshihiko TSUJIKAWA
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Publication number: 20150367618Abstract: A component bonding device includes a bonding tool which sucks a film-like component and which bonds the film-like component to a substrate. The bonding tool includes: a plurality of suction blocks, each of which has a suction hole for sucking the film-like component; and a suction block holding portion which has a block holding-available region capable of holding the plurality of suction blocks, and which holds the plurality of suction blocks so as to be arranged in a row in the block holding-available region. The suction block holding portion allows change of a holding position of at least one of the plurality of suction blocks to any desired position in the block holding-available region.Type: ApplicationFiled: June 18, 2015Publication date: December 24, 2015Inventors: Akira KAMEDA, Shinjiro TSUJI
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Patent number: 8062450Abstract: Provided is an apparatus capable of easily splicing ACF tapes that are thin and are hard to handle. The tape splicing apparatus splices two ACF tapes (210) each having an ACF (212), and includes: a first holding unit that holds one of the ACF tapes (210); a second holding unit that holds the other one of the ACF tapes (210); a positioning unit (115) that positions the ACF tapes (210) to be overlapped in a thickness direction; and a pressing unit (116) that presses the overlapped ACF tapes (210) in the thickness direction.Type: GrantFiled: November 15, 2006Date of Patent: November 22, 2011Assignee: Panasonic CorporationInventors: Kozo Odawara, Shinjiro Tsuji, Yuichi Takakura, Masayuki Ida, Ryouichirou Katano
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Patent number: 7803231Abstract: A substrate edge part cleaning apparatus judging a cleaning degree of glass substrates when cleaning edge parts of the glass substrates used for liquid crystal display. The substrate edge part cleaning apparatus 100 having a cleaning head wiping an edge part of a substrate for display A while moving rectilinearly, and having a camera 117 capturing images of the proximity of an edge of a color filter which is placed on the substrate, by moving together with the cleaning head. The camera 117 obtains surface status information of the substrate part which has been cleaned, and the substrate edge part cleaning apparatus 100 further includes a cleaning degree judgment unit 306 judging a cleaning degree based on the surface status information.Type: GrantFiled: August 1, 2005Date of Patent: September 28, 2010Assignee: Panasonic CorporationInventors: Ryouichirou Katano, Shinjiro Tsuji
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Patent number: 7799142Abstract: A board terminal cleaning apparatus for cleaning a terminal portion by bringing a cleaning member in contact with the terminal portion of a board comprises a first support member that supports the cleaning member in a first position, a second support member that supports the cleaning member in a second position, a cleaning head that pressurizes part of the cleaning member supported between the first position and the second position by bringing the part in contact with the terminal portion of the board, a support member moving unit that moves the first support member and the second support member in the direction along the terminal portion, and a cleaning head moving unit that moves the cleaning head in the direction along the terminal portion at a second movement velocity different from the first movement velocity of the first support member and the second support member by the support member moving unit.Type: GrantFiled: March 30, 2006Date of Patent: September 21, 2010Assignee: Panasonic CorporationInventors: Masaya Watanabe, Shinjiro Tsuji, Keiji Fujiwara, Ryouichirou Katano
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Patent number: 7716818Abstract: A method for transferring a substrate includes moving first and second substrate holding sections opposite each other, moving a first substrate stage holding the substrate so as to be disposed between the first and second substrate holding sections, delivering the substrate from the first substrate stage to the first and second substrate holding sections by releasing the holding of the substrate by the first substrate stage and holding the substrate by the first and second substrate holding sections, moving the first and second substrate holding sections from a first substrate taking-over position to a second substrate taking-over position, moving a second substrate stage so as to be disposed in the interval between the first and second substrate holding sections at the second substrate taking-over position, and delivering the substrate to the second substrate stage by releasing the substrate and holding the substrate by the second substrate stage.Type: GrantFiled: February 1, 2006Date of Patent: May 18, 2010Assignee: Panasonic CorporationInventors: Shinjiro Tsuji, Takahiko Murata, Keiji Fujiwara, Kozo Odawara
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Patent number: 7653989Abstract: The final-bonder is equipped with a warping correction unit that is equipped in parallel with a backup stage with a distance of about 20 mm from such backup stage, and that includes accordion pads for sucking a liquid crystal panel; the backup stage that supports, from the back, the liquid crystal panel when pressure is applied to its outer edge portion at the bonding of semiconductor components; and a pressure head that carries out final bonding of the semiconductor components onto the outer edge portion of the liquid crystal panel by applying pressure and heat to them.Type: GrantFiled: July 1, 2005Date of Patent: February 2, 2010Assignee: Panasonic CorporationInventors: Takahiko Murata, Shinjiro Tsuji, Kozo Odawara, Ryouichirou Katano
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Publication number: 20090288777Abstract: Provided is an apparatus capable of easily splicing ACF tapes that are thin and are hard to handle. The tape splicing apparatus splices two ACF tapes (210) each having an ACF (212), and includes: a first holding unit that holds one of the ACF tapes (210); a second holding unit that holds the other one of the ACF tapes (210); a positioning unit (115) that positions the ACF tapes (210) to be overlapped in a thickness direction; and a pressing unit (116) that presses the overlapped ACF tapes (210) in the thickness direction.Type: ApplicationFiled: November 15, 2006Publication date: November 26, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Kozo Odawara, Shinjiro Tsuji, Yuichi Takakura, Masayuki Ida, Ryouichirou Katano
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Publication number: 20090065029Abstract: A board terminal cleaning apparatus for cleaning a terminal portion by bringing a cleaning member in contact with the terminal portion of a board comprises a first support member that supports the cleaning member in a first position, a second support member that supports the cleaning member in a second position, a cleaning head that pressurizes part of the cleaning member supported between the first position and the second position by bringing the part in contact with the terminal portion of the board, a support member moving unit that moves the first support member and the second support member in the direction along the terminal portion, and a cleaning head moving unit that moves the cleaning head in the direction along the terminal portion at a second movement velocity different from the first movement velocity of the first support member and the second support member by the support member moving unit.Type: ApplicationFiled: March 30, 2006Publication date: March 12, 2009Inventors: Masaya Watanabe, Shinjiro Tsuji, Keiji Fujiwara, Ryouichirou Katano
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Publication number: 20080301932Abstract: The final-bonder (103) is equipped with: a warping correction unit (201) that is equipped in parallel with a backup stage (203) with a distance of about 20 mm from such backup stage (203), and that includes accordion pads (202) for sucking a liquid crystal panel; the backup stage (203) that supports, from the back, the liquid crystal panel when pressure is applied to its outer edge portion at the boding of semiconductor components; and a pressure head (204) that carries out final bonding of the semiconductor components onto the outer edge portion of the liquid crystal panel by applying pressure and heat to them.Type: ApplicationFiled: July 1, 2005Publication date: December 11, 2008Inventors: Takahiko Murata, Shinjiro Tsuji, Kozo Odawara, Ryouichirou Katano