Patents by Inventor Shinjiro Uenishi

Shinjiro Uenishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same
    Patent number: 8017670
    Abstract: The present invention relates to an epoxy resin composition for optical-semiconductor encapsulation which comprises the following ingredients (A) to (C): (A) an epoxy resin; (B) a curing agent; and (C) a naphthalocyanine colorant. The epoxy resin composition of the invention transmits visible rays and shields near infrared rays while retaining properties inherent in the epoxy resin.
    Type: Grant
    Filed: September 14, 2007
    Date of Patent: September 13, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Hisataka Ito, Shinya Ota, Kazuhiro Fuke, Shinjiro Uenishi
  • Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same
    Patent number: 7880279
    Abstract: In an optical semiconductor integrated circuit device using a lead frame, a transparent epoxy resin composition for molding an optical semiconductor contains (A) an epoxy resin; (B) a curing agent; (C) a thiol; and (D) an amine-based curing catalyst represented by following Chemical Formula 1: R1: a hydrogen atom (—H), an alkyl group, or a phenyl group R2: an alkyl group (—CH3, —C2H5, —C3H7).
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: February 1, 2011
    Assignees: Nitto Denko Corporation, Renesas Electronics Corporation
    Inventors: Kenji Uchida, Koki Hirasawa, Katsumi Shimada, Shinjiro Uenishi, Shinya Ota
  • TRANSPARENT EPOXY RESIN COMPOSITION FOR MOLDING OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE SAME
    Publication number: 20070181902
    Abstract: In an optical semiconductor integrated circuit device using a lead frame, a transparent epoxy resin composition for molding an optical semiconductor contains (A) an epoxy resin; (B) a curing agent; (C) a thiol; and (D) an amine-based curing catalyst represented by following Chemical Formula 1: R1: a hydrogen atom (—H), an alkyl group, or a phenyl group R2: an alkyl group (—CH3, —C2H5, —C3H7)
    Type: Application
    Filed: January 30, 2007
    Publication date: August 9, 2007
    Applicants: NEC ELECTRONICS CORPORATION, NITTO DENKO CORPORATION
    Inventors: Kenji UCHIDA, Koki Hirasawa, Katsumi Shimada, Shinjiro Uenishi, Shinya Ota
  • Epoxy resin composition for encapsulating photosemiconductor element and photosemiconductor device
    Patent number: 6221510
    Abstract: An epoxy resin composition for encapsulating a photosemi-conductor element excellent in releasing property from a mold in forming and in adhesion to the photosemi conductor element is provided. The epoxy resin composition comprises element comprising the following components (A) to (D): (A) an epoxy resin; (B) a hardener; (C) a silane coupling agent having an epoxy group, a mercapto group or an amino group; and (D) a releasing agent in which a molecule thereof has structure moieties represented by the following general formulas (1) and (2) and in which the weight ratio of the structure moiety represented by general formula (2) is 25% to 95% by weight based on the whole molecule, &Parenopenst;CH2CH2&Parenclosest;m  (1)  wherein m is a positive integer of 8 to 100 and &Parenopenst;CH2CH2O&Parenclosest;n  (2)  wherein n is a positive integer.
    Type: Grant
    Filed: April 21, 1999
    Date of Patent: April 24, 2001
    Assignee: Nitto Denko Corporation
    Inventors: Masato Noro, Nariya Komada, Katsumi Shimada, Satoshi Okuda, Shinjiro Uenishi, Kuniharu Hattori