Abstract: Method for measuring the surface shape of a thin element such as a silicon wafer measures the surface shapes of one surface and the other surface of the thin element by independently measuring the distance each to one surface and to the other surface of the thin element by rotating or moving the thin element within a single plane and independently moving the first and second measuring means along the first and second guide shafts. Apparatus for measuring the surface shape of the thin element measures the surface shapes of one surface and the other surface of the thin element by rotating or moving the thin element supported within the same plane by a supporting means, and independently measuring the distance each to one surface and to the other surface of the thin element by the first and second measuring means while independently moving the first and second sliders along the first and second guide shafts.

Abstract: A terminal device for reading and/or writing electronic information from and/or into an IC card (100) inserted therein, comprises: electric connection terminals (12) through which the electronic information including electronic money is read out from said IC card and/or is written into said IC card; and a card insertion opening (50) provided on a top surface of a main body(10) of the terminal device, into which said IC card (100) is inserted, wherein the card insertion opening (50) is formed penetrating from the top surface of the terminal device up to a bottom surface thereof so as to discharge dust and/or dirt coming inside from the card insertion opening (50) automatically.