Abstract: An in-situ polymerized type thermoplastic prepreg is provided, which is excellent in productivity, has tack properties and drape properties that allow easy shaping in a mold, is excellent in handling properties, and allows a molded product obtained by curing to have both mechanical properties as high as those of a thermosetting composite and the features of the thermoplastic composite. An in-situ polymerized type thermoplastic prepreg 1 includes reinforcing fibers 2 and an in-situ polymerized type thermoplastic epoxy resin 3 as a matrix resin. The in-situ polymerized type thermoplastic epoxy resin 3 is cured to B-stage, with the weight-average molecular weight being 6,000 or less, and has tack properties and drape properties at 30° C. or less, and the in-situ polymerized type thermoplastic epoxy resin after curing has a weight-average molecular weight of 30,000 or more.

Abstract: An in-situ polymerized type thermoplastic prepreg is provided, which is excellent in productivity, has tack properties and drape properties that allow easy shaping in a mold, is excellent in handling properties, and allows a molded product obtained by curing to have both mechanical properties as high as those of a thermosetting composite and the features of the thermoplastic composite. An in-situ polymerized type thermoplastic prepreg 1 includes reinforcing fibers 2 and an in-situ polymerized type thermoplastic epoxy resin 3 as a matrix resin. The in-situ polymerized type thermoplastic epoxy resin 3 is cured to B-stage, with the weight-average molecular weight being 6,000 or less, and has tack properties and drape properties at 30° C. or less, and the in-situ polymerized type thermoplastic epoxy resin after curing has a weight-average molecular weight of 30,000 or more.

Abstract: An in-situ polymerized type thermoplastic prepreg is provided, which is excellent in productivity, has tack properties and drape properties that allow easy shaping in a mold, is excellent in handling properties, and allows a molded product obtained by curing to have both mechanical properties as high as those of a thermosetting composite and the features of the thermoplastic composite. An in-situ polymerized type thermoplastic prepreg 1 includes reinforcing fibers 2 and an in-situ polymerized type thermoplastic epoxy resin 3 as a matrix resin. The in-situ polymerized type thermoplastic epoxy resin 3 is cured to B-stage, with the weight-average molecular weight being 6,000 or less, and has tack properties and drape properties at 30° C. or less, and the in-situ polymerized type thermoplastic epoxy resin after curing has a weight-average molecular weight of 30,000 or more.

Abstract: An in-situ polymerized type thermoplastic prepreg is provided, which is excellent in productivity, has tack properties and drape properties that allow easy shaping in a mold, is excellent in handling properties, and allows a molded product obtained by curing to have both mechanical properties as high as those of a thermosetting composite and the features of the thermoplastic composite. An in-situ polymerized type thermoplastic prepreg 1 includes reinforcing fibers 2 and an in-situ polymerized type thermoplastic epoxy resin 3 as a matrix resin. The in-situ polymerized type thermoplastic epoxy resin 3 is cured to B-stage, with the weight-average molecular weight being 6,000 or less, and has tack properties and drape properties at 30° C. or less, and the in-situ polymerized type thermoplastic epoxy resin after curing has a weight-average molecular weight of 30,000 or more.

Abstract: A thin-plate-like flexible carbon plate having flexibility, excellent compressive strength, and even electrical conductivity is provided. A carbon plate 1 is a carbon plate having a thickness of 0.05 to 2.0 mm obtained by compression molding of a mixture of (a) 97 to 80 wt % carbon powder composed of 95 to 30 wt % expanded graphite powder and 5 to 70 wt % graphite powder, and (b) 3 to 20 wt % phenolic resin that do not contain ammonia, wherein a compressive strength is 3 MPa or more, a bending strain is 0.6% or more without a crack, and a contact resistance is 6 m?·cm2 or less.

Abstract: The present disclosure provides a shell component for an electronic device, an electronic device and a method for manufacturing the shell component. The shell component includes a first portion made of non-conductive fibers, wherein the first portion is positioned near to a location of an antenna of the electronic device when assembled; and a second portion made of fibers which are at least partially different from the non-conductive fibers of the first portion. When the shell component provided by embodiments of the present disclosure is assembled to an electronic device, the first portion does not block the radio frequency signals because it is made of non-conductive material woven of non-conductive fibers, thereby preventing radio frequency performance being affected.

Abstract: A thin-plate-like flexible carbon plate having flexibility, excellent compressive strength, and even electrical conductivity is provided. A carbon plate 1 is a carbon plate having a thickness of 0.05 to 2.0 mm obtained by compression molding of a mixture of (a) 97 to 80 wt % carbon powder composed of 95 to 30 wt % expanded graphite powder and 5 to 70 wt % graphite powder, and (b) 3 to 20 wt % phenolic resin that do not contain ammonia, wherein a compressive strength is 3 MPa or more, a bending strain is 0.6% or more without a crack, and a contact resistance is 6 m?·cm2 or less.

Abstract: A continuous reinforcing fiber sheet in which reinforcing fibers are arranged at an arbitrary angle to the main axis. The continuous reinforcing fiber sheet is well applicable to pultrusion forming without the risk of the reinforcing fibers being dispersed. This permits use of the continuous reinforcing fiber sheet in a long fiber-reinforced plastic structural member having remarkably improved torsional rigidity. The continuous reinforcing fiber sheet 1 has a continuous resin-penetrable support sheet 2 and a reinforcing fiber layer 3 held by the resin-penetrable support sheet 2. Long reinforcing fibers 4 in the reinforcing fiber layer 3 have substantially a certain length (F) and are arranged in the longitudinal direction of the resin-penetrable support sheet 2 at a prescribed angle (&agr;) to the longitudinal direction of the resin-penetrable support sheet 2.

Abstract: A flexible unidirectional glass prepreg comprising glass rovings having a thickness of 50 to 150 .mu.m and formed of glass fiber monofilaments having a diameter of 10 to 20 .mu.m and a matrix resin impregnated between the fiber monofilaments.

Abstract: An elongated lightweight fiber reinforced composite resin pultrusion-formed piece with a rectangular structural shape has an elongated light honeycomb structure body with a rectangular sectional shape and at least one fiber reinforced resin layer formed to cover at least a portion of the outer peripheral surface of the lightweight honeycomb structure body. The fiber reinforced resin layer comprises an axial fiber layer formed by aligning reinforcing fibers parallel to the longitudinal axis of the lightweight honeycomb structure body.

Abstract: This invention relates to fiber-reinforced composite resin pultrusion products of circular and noncircular cross-sectional contours, manufactured by impregnating fiber tows or rovings with a resin, drawing them into a die, and forming them into an article of predetermined size and shape, and then curing it, and relates also to a method for manufacturing the same.

Abstract: A two component-type curing agent composition is disclosed which comprises a first curing agent which is capable of cross-linking an epoxy resin and which is at least one member selected from primary amines, phenolic compounds and acid anhydrides, and a second curing agent which is at least one compounds represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attracting group; R is a lower alkyl; and m and n each is an integer of 1-4.

Abstract: A new thermosetting resin composition is disclosed which comprises a Bisphenol A-type epoxy resin having a number average molecular weight of smaller than 650 but not smaller than 450 and a ratio of the weight average molecular weight thereof to the number average molecular weight thereof of in the range of 1.3-3.0; and a curing agent capable of cross-linking the epoxy resin. The curing agent is preferably a compound represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attractive group; R is a lower alkyl; and m and n each is an integer of 1-4, or a mixture thereof with a primary amine, a phenolic compound or an acid anhydride.

Abstract: A new thermocurable composition is disclosed which comprises a Bisphenol A-type epoxy resin having a number average molecular weight of 650-1300, 10-40% by weight of the Bisphenol A-type epoxy resin having an epoxy equivalent of 180-195; and a curing agent capable of cross-linking the epoxy resin. The curing agent is preferably a compound represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attractive group; R is a lower alkyl; and m and n each is an integer of 1-4, or a mixture thereof with a primary amine, a phenolic compound or an acid anhydride.