Abstract: A method of supporting or mounting a precision instrument for supporting a mask and a wafer in a vacuum container is disclosed. The method is particularly applicable to an SOR X-ray exposure apparatus wherein the mask and the wafer are disposed in a desired level of the reduced pressure, and exposure energy such as X-rays contained in synchrotron radiation is projected onto the wafer through the mask to print the pattern of the mask onto the wafer. In x-y-z coordinates with the x direction being vertical, the precision instrument is hung at at least two points which are spaced in the x direction, to the inside wall of the vacuum container. At one of the supporting points, the precision instrument is given latitude of x, y and z direction movement, and at the other supporting point, the precision instrument is fixed or is given latitude only in the x direction.

Abstract: A polishing apparatus for polishing optical components and mechanical parts requiring a high surface precision, such as lenses and mirrors, by pressing a running tape to such component.

Abstract: A polishing apparatus for polishing optical components and mechanical parts requiring a high surface precision, such as lenses and mirrors, by pressing a running tape to such component.

Abstract: A stage device usable, e.g., in an X-ray exposure apparatus, for moving a semiconductor wafer placed in a vacuum ambience and held by a wafer chuck, is disclosed. In the stage device, the wafer chuck holds the wafer so that the surface of the wafer onto which a circuit pattern is to be transferred is placed in a vertical plane, and the wafer chuck is moved vertically and horizontally for step-and-repeat exposure of the wafer. The device includes a guide mechanism, locking mechanism and a constant-tension spring mechanism, to thereby ensure high-accuracy movement of the wafer chuck in the vertical direction as well as high-precision positioning of the wafer. Further, in the stage device, a drive source producing a drive to move the wafer chuck is disposed in a vacuum ambience while, on the other hand, the supply of operating fluids to air bearing assemblies, for guiding the movement of the wafer chuck, is achieved by use of metal pipes coupled by rotary joints.