Abstract: A system for controlling process parameters. The system contains first and second storage devices, and first and second processors. The first storage device stores first process parameters for the tools. The first processor retrieves the first process parameters from the first storage device and calculates a control limit for each of the tools accordingly. The second storage device stores the control limit information. The second processor receives second process parameters for the tool, retrieves corresponding control limit information from the second storage device, performs a statistical process control analysis accordingly, and generates an alarm signal for directing adjustment of the tool process parameters.

Abstract: A method and system for collecting, storing and accessing semiconductor manufacturing data in a storage entity are provided. The semiconductor manufacturing data is collected from at least one process tool and stored in a first predefined area of the storage entity until the data storing in the first predefined area is complete, at which time additional semiconductor manufacturing data may be stored in a second predefined area of the storage entity. After the storing of data in the first predefined area is complete, it may be accessed.

Abstract: Each of a method for fabricating a single microelectronic product within a plurality of fabrication facilities and a system for fabricating the single microelectronic product within the plurality of fabrication facilities employs a benchmarking of a tool utilization factor for a specific comparable tool group employed for fabricating the single microelectronic product. The benchmarking provides for development and implementation of revised tool operating procedures within the specific comparable tool group such as to effect optimized tool utilization factors within the specific comparable tool group.