Patents by Inventor Shinnosuke Fukuda

Shinnosuke Fukuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080144451
    Abstract: An information reproducer in which not only the accuracy at the time of reading a signal but also the stability of a servo circuit are enhanced by adding a servo error signal to parameters for judging acceptability of a data signal in an optical disc. An information reproduction method, an information reproduction program and an information recording medium having such program recorded therein are also provided. A light receiving means is moved in the radial direction of the recording medium and, in the radial direction of the recording medium determined by such movement in the radial direction, the light receiving means is moved in the focus direction substantially orthogonally crossing the surface of the recording medium.
    Type: Application
    Filed: March 28, 2006
    Publication date: June 19, 2008
    Inventor: Shinnosuke Fukuda
  • Patent number: 6901092
    Abstract: A resin package 1 is hollowed in order to house components of a hybrid optical module. Laser devices 7 and 8 are die-bonded to metal frames 2 and 3, respectively. Ends of the metal frames are bent, and then embedded into the resin package 1 as in-resin bent portions 4, 5, and 6. In a frame led-out portion 10, portions of the metal frames 2 and 3 are led out to the outside of the resin package 1. The led-out portion 10 is made in contact with a metal plate, an aluminum die cast member, or the like which is outside the package, whereby the heat radiation effect is improved.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: May 31, 2005
    Assignee: Pioneer Corporation
    Inventors: Masaki Okayasu, Shinnosuke Fukuda, Hirofumi Tanaka
  • Patent number: 6778568
    Abstract: A holding member, which beforehand fixedly holds a semiconductor laser element and has thermal conductivity, is fixed to a base member, which is fixed to a case and which has thermal conductivity, by the use of a thermal type adhesive member having thermal conductivity so that the semiconductor laser element is disposed at a predetermined optical position where optical adjustment has been carried out with respect to an optical system of the case.
    Type: Grant
    Filed: November 16, 2000
    Date of Patent: August 17, 2004
    Assignee: Pioneer Corporation
    Inventors: Shinnosuke Fukuda, Masaki Okayasu, Hirofumi Tanaka, Takeshi Ishida, Kiyoshi Shimomura
  • Patent number: 6587287
    Abstract: A multilayer ceramic substrate 11 is used, and a prism 14 serving as a component of a hybrid optical module and a chip 12 on which an optoelectric converting element is mounted are mounted on different layers of the multilayer ceramic substrate. The thickness of the chip on which the optoelectric converting element is mounted is substantially equal to the depth of the layer of the multilayer ceramic substrate on which the chip is mounted.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: July 1, 2003
    Assignee: Pioneer Corporation
    Inventors: Shinnosuke Fukuda, Masaki Okayasu, Hirofumi Tanaka
  • Publication number: 20030031429
    Abstract: A resin package 1 is hollowed in order to house components of a hybrid optical module. Laser devices 7 and 8 are die-bonded to metal frames 2 and 3, respectively. Ends of the metal frames are bent, and then embedded into the resin package 1 as in-resin bent portions 4, 5, and 6. In a frame led-out portion 10, portions of the metal frames 2 and 3 are led out to the outside of the resin package 1. The led-out portion 10 is made in contact with a metal plate, an aluminum die cast member, or the like which is outside the package, whereby the heat radiation effect is improved.
    Type: Application
    Filed: December 21, 2000
    Publication date: February 13, 2003
    Inventors: Masaki Okayasu, Shinnosuke Fukuda, Hirofumi Tanaka
  • Publication number: 20010040741
    Abstract: A multilayer ceramic substrate 11 is used, and a prism 14 serving as a component of a hybrid optical module and a chip 12 on which an optoelectric converting element is mounted are mounted on different layers of the multilayer ceramic substrate. The thickness of the chip on which the optoelectric converting element is mounted is substantially equal to the depth of the layer of the multilayer ceramic substrate on which the chip is mounted.
    Type: Application
    Filed: December 28, 2000
    Publication date: November 15, 2001
    Inventors: Shinnosuke Fukuda, Masaki Okayasu, Hirofumi Tanaka
  • Publication number: 20010006505
    Abstract: A corner portion of a hybrid optical module 4 which is closer to one of shafts or a shaft 2 when the hybrid optical module is mounted on a support member 6 is cut out in substantially parallel with the shaft 2, and by an angle which is substantially equal to an incident angle of an optical path concerning a tracking direction of an optical disk 7. A spindle motor is placed to be closer to one of the two shafts in the direction of light incidence of an optical system including the hybrid optical module. The hybrid optical module having a cut corner portion which is closer to another one of the two shafts is mounted with a pickup unit 6. The angle of the cut-out is adequately set to be in a range of 30° to 45° substantially.
    Type: Application
    Filed: December 28, 2000
    Publication date: July 5, 2001
    Inventors: Masaki Okayasu, Shinnosuke Fukuda, Hirofumi Tanaka