Patents by Inventor Shinnosuke MASHIMA

Shinnosuke MASHIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layered film, method of manufacturing the same, and manufacturing apparatus of the same
    Patent number: 10553777
    Abstract: A multi-layered film includes a first electroconductive layer, a dielectric layer, and a second electroconductive layer, which are sequentially layered and disposed on a main surface of a substrate. A lower surface of the dielectric layer comes into contact with an upper surface of the first electroconductive layer, an upper surface and an side surface of the dielectric layer is coated with the second electroconductive layer, and an side end of a portion at which the first electroconductive layer directly overlaps the second electroconductive layer is located inside a side end of the substrate on the main surface of the substrate.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: February 4, 2020
    Assignee: ULVAC, INC.
    Inventors: Hiroki Kobayashi, Mitsunori Henmi, Mitsutaka Hirose, Shinnosuke Mashima, Isao Kimura, Koukou Suu
  • MULTI-LAYERED FILM, METHOD OF MANUFACTURING THE SAME, AND MANUFACTURING APPARATUS OF THE SAME
    Publication number: 20170141289
    Abstract: A multi-layered film includes a first electroconductive layer, a dielectric layer, and a second electroconductive layer, which are sequentially layered and disposed on a main surface of a substrate. A lower surface of the dielectric layer comes into contact with an upper surface of the first electroconductive layer, an upper surface and an side surface of the dielectric layer is coated with the second electroconductive layer, and an side end of a portion at which the first electroconductive layer directly overlaps the second electroconductive layer is located inside a side end of the substrate on the main surface of the substrate.
    Type: Application
    Filed: June 11, 2015
    Publication date: May 18, 2017
    Inventors: Hiroki KOBAYASHI, Mitsunori HENMI, Mitsutaka HIROSE, Shinnosuke MASHIMA, Isao KIMURA, Koukou SUU