Patents by Inventor Shinnosuke Sekiya

Shinnosuke Sekiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10250840
    Abstract: A projection apparatus includes a projection unit configured to project an image, an operation receiving unit configured to receive an operation, and a control unit configured to control the projection unit. The control unit controls the projection unit to project a first adjustment image for selecting a position to be subjected to an adjustment of the image to be projected by the projection unit. When the operation receiving unit receives an operation for determining the adjustment target position while the projection unit is projecting the first adjustment image, the control unit controls the projection unit to project a second adjustment image different from the first adjustment image in an area corresponding to the adjustment target position identified by the determination operation received by the operation receiving unit.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: April 2, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventor: Shinnosuke Sekiya
  • Publication number: 20180199005
    Abstract: A projection apparatus includes a projection unit configured to project an image, an operation receiving unit configured to receive an operation, and a control unit configured to control the projection unit. The control unit controls the projection unit to project a first adjustment image for selecting a position to be subjected to an adjustment of the image to be projected by the projection unit. When the operation receiving unit receives an operation for determining the adjustment target position while the projection unit is projecting the first adjustment image, the control unit controls the projection unit to project a second adjustment image different from the first adjustment image in an area corresponding to the adjustment target position identified by the determination operation received by the operation receiving unit.
    Type: Application
    Filed: January 3, 2018
    Publication date: July 12, 2018
    Inventor: Shinnosuke Sekiya
  • Patent number: 8941769
    Abstract: A display control unit controls an image presentation unit such that when an image display apparatus displays a partial area of an image stored in an image storage unit, an image presentation unit displays a whole image stored in the image storage unit and display information indicating the partial area in the whole image.
    Type: Grant
    Filed: July 6, 2012
    Date of Patent: January 27, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventor: Shinnosuke Sekiya
  • Publication number: 20130016257
    Abstract: A display control unit controls an image presentation unit such that when an image display apparatus displays a partial area of an image stored in an image storage unit, an image presentation unit displays a whole image stored in the image storage unit and display information indicating the partial area in the whole image.
    Type: Application
    Filed: July 6, 2012
    Publication date: January 17, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Shinnosuke Sekiya
  • Patent number: 7731567
    Abstract: In a semiconductor wafer processing method of forming a semiconductor wafer having a desired thickness by grinding a rear surface of the semiconductor wafer having a plurality of devices formed on a front surface thereof, the rear surface of the semiconductor wafer is ground so that the semiconductor wafer has a thickness of 10 ?m to 100 ?m, and a strain layer having a thickness of 0.05 ?m to 0.1 ?m is left on the rear surface of the semiconductor wafer by the grinding. The strain layer is left to provide the gettering effect, preventing a harmful influence exerted on the quality of the semiconductor devices. Degradation in transverse rupture strength can be prevented by the grinding.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: June 8, 2010
    Assignee: Disco Corporation
    Inventors: Shinnosuke Sekiya, Setsuo Yamamoto, Naoya Sukegawa, Naruto Fuwa
  • Publication number: 20080076329
    Abstract: In a semiconductor wafer processing method of forming a semiconductor wafer having a desired thickness by grinding a rear surface of the semiconductor wafer having a plurality of devices formed on a front surface thereof, the rear surface of the semiconductor wafer is ground so that the semiconductor wafer has a thickness of 10 ?m to 100 ?m, and a strain layer having a thickness of 0.05 ?m to 0.1 ?m is left on the rear surface of the semiconductor wafer by the grinding. The strain layer is left to provide the gettering effect, preventing a harmful influence exerted on the quality of the semiconductor devices. Degradation in transverse rupture strength can be prevented by the grinding.
    Type: Application
    Filed: September 20, 2007
    Publication date: March 27, 2008
    Applicant: Disco Corporation
    Inventors: Shinnosuke Sekiya, Setsuo Yamamoto, Naoya Sukegawa, Naruto Fuwa