Patents by Inventor Shino Moritani

Shino Moritani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die-sorting sheet and method for transporting chips having adhesive layer
    Patent number: 8587130
    Abstract: A die-sorting sheet includes a pressure-sensitive adhesive layer exposed on an outer periphery of the carrier sheet, and a base film exposed on a central area that is inside the outer periphery. A method for transporting a chip having an adhesive layer includes the steps of: providing the above die-sorting sheet that is fixed with a frame through the pressure-sensitive adhesive layer on the outer periphery; temporarily attaching a picked up chip through an adhesive layer thereof onto the base film exposed on the die-sorting sheet; and transporting the die-sorting sheet to a subsequent step while the chip is temporarily attached on the sheet through the adhesive layer.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: November 19, 2013
    Assignee: Lintec Corporation
    Inventors: Akie Hamasaki, Shino Moritani, Mikio Komiyama
  • Die-Sorting Sheet and Method for Transporting Chips Having Adhesive Layer
    Publication number: 20100311226
    Abstract: A die-sorting sheet includes a pressure-sensitive adhesive layer exposed on an outer periphery of the carrier sheet, and a base film exposed on a central area that is inside the outer periphery. A method for transporting a chip having an adhesive layer according to the present invention includes the steps of: providing the above die-sorting sheet that is fixed with a frame through the pressure-sensitive adhesive layer on the outer periphery; temporarily attaching a picked up chip through an adhesive layer thereof onto the base film exposed on the die-sorting sheet; and transporting the die-sorting sheet to a subsequent step while the chip is temporarily attached on the sheet through the adhesive layer.
    Type: Application
    Filed: October 12, 2007
    Publication date: December 9, 2010
    Applicant: LINTEC CORPORATION
    Inventors: Akie Hamasaki, Shino Moritani, Mikio Komiyama