Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The external electrodes each include a first Sn plated layer that covers an outer surface of the interposer board in a vicinity of at least one board end surface.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. One of the board main surfaces is in a vicinity of the electronic element and joined with a multilayer body main surface in a vicinity of the interposer board. The interposer board is an alumina board. At least one notch is in end regions including a board end surface, a board side surface in a vicinity thereof, a board main surface in a vicinity thereof, ridge portions between the board end surface and the board side surface, between the board end surface and the board main surface, and between the board side surface and the board main surface, and a corner portion between the board end surface, the board side surface, and the board main surface.

Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body in which dielectric layers and internal electrode layers are alternately laminated, and external electrodes respectively on two end surfaces of the multilayer body and connected to the internal electrode layers, an interposer at a board mounting surface of the capacitor main body, and an insulating resin film in a gap between the board mounting surface and a capacitor-facing surface of the interposer which is opposed to the board mounting surface.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A mark portion is provided on one of the board main surfaces.

Abstract: A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and layered inner electrode layers and having a rectangular parallelepiped shape, and outer electrodes covering both end surfaces of the multilayer body and extending from both end surfaces to cover at least a portion of a first main surface of the multilayer body. The multilayer ceramic capacitor includes an insulating layer continuously extending from a ceramic layer at the first main surface of the multilayer body so as to cover end edge portions of both the outer electrodes located on the first main surface of the multilayer body, and t2>t1 is satisfied.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The external electrodes each include a first Sn plated layer that covers an outer surface of the interposer board in a vicinity of at least one board end surface.

Abstract: A multilayer ceramic capacitor includes a capacitor body including a stack of alternating dielectric layers and internal electrode layers, and external electrodes on both end surfaces in a length direction perpendicular or substantially perpendicular to a stacking direction of the stack and connected to the internal electrode layers, the external electrodes each including an the underlying electrode layer and a first plating layer on an outer periphery of the underlying electrode layer, and joints on one of main surfaces in the stacking direction of the capacitor body and connected to the external electrodes, the joints each mainly including a metal with a melting point of about 240° C. or higher. Second plating layers each extend continuously on an outer periphery of a corresponding one of the external electrodes and an outer periphery of a corresponding one of the joints.

Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface in a lamination direction of the capacitor main body, and opposed and spaced apart from each other in a length direction connecting the two end surfaces. The two interposers each include a first recess portion on an end surface of the interposer opposed to an end surface facing the other interposer, in an area around a middle portion of the interposer in a width direction, and second recess portions on both sides in the width direction of the first recess portion, and each having a thickness of about ±10% of a half of a thickness of the interposer.

Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface in a lamination direction of the capacitor main body, and opposed and spaced apart from each other in a length direction connecting the two end surfaces. The two interposers each include a first recess portion on an end surface of the interposer opposed to an end surface facing the other interposer, in an area around a middle portion of the interposer in a width direction, and second recess portions on both sides in the width direction of the first recess portion, and each having a thickness of about ±10% of a half of a thickness of the interposer.

Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface of the capacitor main body, and opposed and spaced apart from each other. The two interposers include a nickel-plated layer and a tin-plated layer on an outer periphery thereof. The two interposers each include a non-plated region without the nickel-plated layer on an end surface at which the two interposers face each other.

Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated, and external electrodes at two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface of the capacitor main body, and opposed and spaced apart from each other. The two interposers each include a first surface at or adjacent to the capacitor main body, and a second surface opposite to the first surface, the first and second surfaces being parallel or substantially parallel with each other, and the first surface is sloped with respect to the surface of the capacitor main body at a predetermined angle to be spaced from the surface of the capacitor main body toward a side at which the two interposers face each other.

Abstract: A method of manufacturing a multilayer ceramic capacitor includes alternately laminating dielectric layers and internal electrode layers to manufacture a multilayer body, forming an external electrode connected with the internal electrode layers on each of two end surfaces of the multilayer body to manufacture a capacitor main body, connecting two interposers via a plate-shaped member, connecting the two interposers and the external electrode, and removing the plate-shape member.

Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated, and external electrodes each provided at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers provided on both sides in a length direction of a surface of the capacitor main body. The two interposers each include a protrusion extending from one of the two interposers to another of the two interposers.

Abstract: A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and layered inner electrode layers and having a rectangular parallelepiped shape, and outer electrodes covering both end surfaces of the multilayer body and extending from both end surfaces to cover at least a portion of a first main surface of the multilayer body. The multilayer ceramic capacitor includes an insulating layer continuously extending from a ceramic layer at the first main surface of the multilayer body so as to cover end edge portions of both the outer electrodes located on the first main surface of the multilayer body, and t2>t1 is satisfied.

Abstract: A supporting-terminal-equipped capacitor chip includes a capacitor chip, and first and second supporting terminals that are electrically conductive and hold the capacitor chip therebetween. A portion of the capacitor chip other than a first connection portion and the first supporting terminal are separated from each other. A portion of the capacitor chip other than a second connection portion and the second supporting terminal are separated from each other. The first connection portion is located on the first main surface adjacent to a first end surface. The second connection portion is located on the first main surface adjacent to a second end surface.

Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated, and external electrodes each at end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface in a lamination direction of the capacitor main body, and spaced apart from each other in a length direction connecting the two end surfaces and intersecting the lamination direction. The external electrodes each include a bulge portion protruding in the lamination direction on the surface of the capacitor main body. The interposers each include a recess portion on each of the end surfaces, and in a cross section extending in the lamination direction and the length direction and passing through a center in a width direction. The bulge portion is closer to the end surface in the length direction than the recess portion.

Abstract: A method of manufacturing a multilayer ceramic capacitor includes alternately laminating dielectric layers and internal electrode layers to manufacture a multilayer body, forming an external electrode connected with the internal electrode layers on each of two end surfaces of the multilayer body to manufacture a capacitor main body, connecting two interposers via an insulator, holding the two interposers connected via the insulator on a holding portion, placing the capacitor main body on the two interposers on the holding portion such that the external electrode is connected to each of the two interposers, and removing the holding portion.

Abstract: A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and layered inner electrode layers and having a rectangular parallelepiped shape, and outer electrodes covering both end surfaces of the multilayer body and extending from both end surfaces to cover at least a portion of a first main surface of the multilayer body. The multilayer ceramic capacitor includes an insulating layer continuously extending from a ceramic layer at the first main surface of the multilayer body so as to cover end edge portions of both the outer electrodes located on the first main surface of the multilayer body, and t2>t1 is satisfied.

Abstract: A mounted structure of a supporting-terminal-equipped capacitor chip includes first and second supporting terminals. The first supporting terminal includes a first helical electrically conductive portion extending in a first axial direction along a main surface. The second supporting terminal includes a second helical electrically conductive portion extending in a second axial direction along the main surface. The first helical electrically conductive portion is electrically connected to a first outer electrode at an outer peripheral side surface of the first helical electrically conductive portion. The second helical electrically conductive portion is electrically connected to a second outer electrode at an outer peripheral side surface of the second helical electrically conductive portion.

Abstract: A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and having a rectangular parallelepiped shape, and first and second outer electrodes covering both end surfaces of the multilayer body and extending from both the end surfaces so as to cover at least portions of a first main surface, a second main surface, a first side surface, and a second side surface of the multilayer body. An insulating layer is provided on a surface of the first main surface of the multilayer body. The first outer electrode and the second outer electrode disposed on the first main surface side are disposed on the insulating layer.