Abstract: A display device includes a display module, a rear cover that covers the rear surface of the display module, a main circuit board placed in an internal space formed between the rear cover and the rear surface of the display module, flexible wiring members that mutually connects the display module and the main circuit board, and a male screw having a head exposed to the outside of the rear cover, the male screw passing through the rear cover and engaging a female screw formed in the main circuit board. The main circuit board is fixed to the rear cover with the male screw in a state in which the main circuit board is not fixed to the display module.

Abstract: A front panel, a touchpad, and a display cell are adhered and fixed, and these and a back light are held by a bracket to construct a display body unit. When the display body unit is mounted on a support, the front panel is fixed to the support with an adhesive layer therebetween. In this state, each of mounting portions has position adjustability in the vertical direction (Z direction). In the state having position adjustability, the mounting portion is fixed to the support by a fixing mechanism.

Abstract: A display device includes a display module, a rear cover that covers the rear surface of the display module, a main circuit board placed in an internal space formed between the rear cover and the rear surface of the display module, flexible wiring members that mutually connects the display module and the main circuit board, and a male screw having a head exposed to the outside of the rear cover, the male screw passing through the rear cover and engaging a female screw formed in the main circuit board. The main circuit board is fixed to the rear cover with the male screw in a state in which the main circuit board is not fixed to the display module.

Abstract: A housing includes a first chassis and a second chassis which are each formed of a metal sheet. Support projections integrally formed with support pieces formed in the first chassis are fitted into support holes of a circuit board on both left and right sides of a connector. A lower surface of the circuit board is supported by receiving portions formed in the support pieces, and part of the circuit board facing the connector is pressed downward by a pressing projection formed in the second chassis.

Abstract: A front panel, a touchpad, and a display cell are adhered and fixed, and these and a back light are held by a bracket to construct a display body unit. When the display body unit is mounted on a support, the front panel is fixed to the support with an adhesive layer therebetween. In this state, each of mounting portions has position adjustability in the vertical direction (Z direction). In the state having position adjustability, the mounting portion is fixed to the support by a fixing mechanism.

Abstract: A housing includes a first chassis and a second chassis which are each formed of a metal sheet. Support projections integrally formed with support pieces formed in the first chassis are fitted into support holes of a circuit board on both left and right sides of a connector. A lower surface of the circuit board is supported by receiving portions formed in the support pieces, and part of the circuit board facing the connector is pressed downward by a pressing projection formed in the second chassis.

Abstract: In a display device to be mounted in a vehicle, a space is secured between a cover with which a first opening of a case main body is sealed and a liquid crystal panel of a display unit mounted on the backside of the case main body, ventilation openings (spaces around protrusions and through holes) that communicate with an external space are formed in portions of a casing, which is a component member of the display unit, except for the front surface of the casing, and protruding portions each partially supporting the outer edge portion of the front surface of the liquid crystal panel are formed on the inner surface of the front wall of the casing. Thus, a long and complicated air flow path is secured around the liquid crystal panel by the protruding portions, and the space and the external space communicates with each other via the path.

Abstract: In a display device to be mounted in a vehicle, a space is secured between a cover with which a first opening of a case main body is sealed and a liquid crystal panel of a display unit mounted on the backside of the case main body, ventilation openings (spaces around protrusions and through holes) that communicate with an external space are formed in portions of a casing, which is a component member of the display unit, except for the front surface of the casing, and protruding portions each partially supporting the outer edge portion of the front surface of the liquid crystal panel are formed on the inner surface of the front wall of the casing. Thus, a long and complicated air flow path is secured around the liquid crystal panel by the protruding portions, and the space and the external space communicates with each other via the path.

Abstract: In a photoelectric device-part, a bonding pad is formed without increasing a plane area of a concave part for housing a photoelectric device to implement miniaturization and improvement of the light usability efficiency. A light reflecting surface 3 of nearly a parabola configuration or the like provided for light emission and reception by a photoelectric device 5 is formed on a slanting curved surface constituting a concave part 2 of a circuit substrate 1. A convex portion 9a projecting from the light reflecting surface 3 and a receding concave portion 9b are formed in the middle of the concave part 2. A stage 9 is formed by an upper and bottom surfaces of the convex and concave portions 9a and 9b, respectively. A bonding pad 7 for connecting circuits of the photoelectric device 5 is formed at the stage 9.

Abstract: A semiconductor-chip mounting substrate with a high degree of reliability of an electrical connection between a substrate and a semiconductor chip such as IC chips is provided. The substrate has at least one projection thereon, which is integrally molded with the substrate. A conductive layer is formed on the projection to obtain a first bump. The semiconductor chip has a terminal projecting as a second bump on its surface. The semiconductor chip is mounted on the substrate such that the first bump contacts the second bump. A required contact pressure between the first bump and the second bump is held by use of a pressure holding means.

Abstract: In a photoelectric device-part, a bonding pad is formed without increasing a plane area of a concave part for housing a photoelectric device to implement miniaturization and improvement of the light usability efficiency. A light reflecting surface 3 of nearly a parabola configuration or the like provided for light emission and reception by a photoelectric device 5 is formed on a slanting curved surface constituting a concave part 2 of a circuit substrate 1. A convex portion 9a projecting from the light reflecting surface 3 and a receding concave portion 9b are formed in the middle of the concave part 2. A stage 9 is formed by an upper and bottom surfaces of the convex and concave portions 9a and 9b, respectively. A bonding pad 7 for connecting circuits of the photoelectric device 5 is formed at the stage 9.

Abstract: A semiconductor-chip mounting substrate with a high degree of reliability of an electrical connection between a substrate and a semiconductor chip such as IC chips is provided. The substrate has at least one projection thereon, which is integrally molded with the substrate. A conductive layer is formed on the projection to obtain a first bump. The semiconductor chip has a terminal projecting as a second bump on its surface. The semiconductor chip is mounted on the substrate such that the first bump contacts the second bump. A required contact pressure between the first bump and the second bump is held by use of a pressure holding means.