Abstract: A substrate processing method of processing a substrate using a gas supplied to a chamber includes: (a) setting a threshold value of a pressure of the gas, which is a control target in a flow rate controller configured to measure the pressure of the gas supplied to the chamber and control a flow rate of the gas; (b) supplying the gas into the chamber; (c) measuring the pressure of the gas by the flow rate controller; (d) stopping the supply of the gas into of the chamber; (e) calculating a time when the pressure of the gas measured in (c) becomes equal to or higher than the threshold value; and (f) calculating a total flow rate of the gas supplied into the chamber based on the pressure of the gas measured in (c) and the time calculated in (e).

Abstract: A substrate processing method of processing a substrate using a gas supplied to a chamber includes: (a) setting a threshold value of a pressure of the gas, which is a control target in a flow rate controller configured to measure the pressure of the gas supplied to the chamber and control a flow rate of the gas; (b) supplying the gas into the chamber; (c) measuring the pressure of the gas by the flow rate controller; (d) stopping the supply of the gas into of the chamber; (e) calculating a time when the pressure of the gas measured in (c) becomes equal to or higher than the threshold value; and (f) calculating a total flow rate of the gas supplied into the chamber based on the pressure of the gas measured in (c) and the time calculated in (e).

Abstract: Provided is a substrate processing method including: referring to a memory unit in which an estimated model of sensor data generated from sensor data input to or output from each of the processing chamber when processing first test substrates are processed in the processing chambers under a same processing condition; adjusting an apparatus parameter of each of the processing chambers such that a deviation of the sensor data from an ideal sensor value is within an allowable range; loading product substrates continuously into the processing chambers without specifying a loading destination processing chamber; and, when the product substrate is loaded into a processing chamber of the processing chambers, adjusting the sensor data input to or output from the processing chamber into which the product substrate has been loaded based on the apparatus parameter of the processing chamber that has been adjusted in the adjusting; and processing the product substrate.

Abstract: Provided are a substrate for test use that is preferable for use in a test such as a culture test, and a method for manufacturing the substrate for test use. The substrate for test use, in which a solution retaining part for retaining water or an aqueous solution, is formed at a surface of a substrate of polydimethylsiloxane (PDMS). The solution retaining part is a concave part having a hydrophilic surface layer. The surface layer has a maximum thickness of 1 ?m or larger.

Abstract: An electron-beam-curing resin or a photocurable resin not containing a photopolymerization initiator is cured by photoirradiation under an atmosphere equal to or lower than predetermined oxygen concentration for not causing oxygen inhibition to polymerization of photocurable resin or electron beam-curable resin, an ultraviolet ray in wavelength region corresponding to a light absorption characteristic of the photocurable resin or the electron beam-curable resin is irradiated on the photocurable resin or the electron beam-curable resin to polymerize the photocurable resin or the electron beam-curable resin. After an ultraviolet ray is irradiated on the photocurable resin or the electron beam-curable resin to polymerize at least a surface layer, an electron beam is irradiated on the photocurable resin or the electron beam-curable resin to polymerize a deep part, and the entire photocurable resin or the entire electron beam-curable resin is cured.

Abstract: Provided is a substrate processing method including: referring to a memory unit in which an estimated model of sensor data generated from sensor data input to or output from each of the processing chamber when processing first test substrates are processed in the processing chambers under a same processing condition; adjusting an apparatus parameter of each of the processing chambers such that a deviation of the sensor data from an ideal sensor value is within an allowable range; loading product substrates continuously into the processing chambers without specifying a loading destination processing chamber; and, when the product substrate is loaded into a processing chamber of the processing chambers, adjusting the sensor data input to or output from the processing chamber into which the product substrate has been loaded based on the apparatus parameter of the processing chamber that has been adjusted in the adjusting; and processing the product substrate.

Abstract: To cure, with light irradiation, photocurable resin or electron beam-curable resin not containing a photopolymerization initiator. Under an atmosphere equal to or lower than predetermined oxygen concentration for not causing oxygen inhibition to polymerization of photocurable resin or electron beam-curable resin, an ultraviolet ray in wavelength region corresponding to a light absorption characteristic of the photocurable resin or the electron beam-curable resin is irradiated on the photocurable resin or the electron beam-curable resin to polymerize the photocurable resin or the electron beam-curable resin. After an ultraviolet ray is irradiated on the photocurable resin or the electron beam-curable resin to polymerize at least a surface layer, an electron beam is irradiated on the photocurable resin or the electron beam-curable resin to polymerize a deep part, and the entire photocurable resin or the entire electron beam-curable resin is cured.