Abstract: A stereoilithography apparatus includes a first optical system, a second optical system, an area setter and a moving mechanism. The first optical system emits a first light to a photocurable material. The second optical system emits a second light to the photocurable material such that a target area is formed in the photocurable material. The target area linearly intersects the first light in a first direction. The area setter sets a first area and a second area for at least one of the first light and the second light in the first direction at the target area. The first area and the second areas have different optical properties from each other. The moving mechanism moves the target area. The stereolithography apparatus cures the photocurable material at the target area.

Abstract: In a stereolithography apparatus according to an embodiment, for example, a first optical system emits a first light to a photocurable material. A second optical system emits a second light to the photocurable material such that the second light linearly intersects the first light in a first direction in the photocurable material. An area setter sets, for at least one of the first light and the second light, a first area and a second area having different optical properties from each other, at an intersection of the first light and the second light in the first direction. A moving mechanism moves the intersection of the first light and the second light. The stereolithography apparatus cures the photocurable material at the intersection of the first light and the second light.

Abstract: When a wafer is pressed on a rotating polishing pad and its surface is polished, a retainer retains the periphery of the wafer to prevent the wafer from being detached from the polishing pad. The retainer includes a first ring which surrounds the wafer and contacts the polishing pad and a second ring which is provided outside the first ring in the radial direction of the wafer and contacts the polishing pad. The second ring has wear resistance that is higher than that of the first ring.

Abstract: When a wafer is pressed on a rotating polishing pad and its surface is polished, a retainer retains the periphery of the wafer to prevent the wafer from being detached from the polishing pad. The retainer includes a first ring which surrounds the wafer and contacts the polishing pad and a second ring which is provided outside the first ring in the radial direction of the wafer and contacts the polishing pad. The second ring has wear resistance that is higher than that of the first ring.

Abstract: A rectangular rear substrate which constitutes an envelope of an image display device is fitted with a reinforcing frame which reinforces the envelope. The reinforcing frame has a pair of first frame portions individually extending substantially parallel to long sides of the rear substrate and a pair of second frame portions extending substantially parallel to short sides of the rear substrate and connecting the first frame portions. Each of the second frame portions meets a relationship ?H/H=13 to 33%, where H is a length of each long side of the rear substrate and ?H is a distance between each short side of the rear substrate and each of the second frame portions.

Abstract: A polishing head includes a head body, a first recessed portion formed in the lower surface of the head body, a support plate which can be moved up and down in the first recessed portion, a first film-like member in which a first space is formed between the upper surface of the support plate and the head body, a second recessed portion formed in a lower surface of the support plate, a second film-like member, in which a second space is formed between the second film-like member and the support plate, and which holds a wafer on the lower, a communicating hole which is formed in the support plate to communicate the first space with the second space, and a gas supply device which increases pressures in the first and second spaces with a fluid to equal pressures to bring the object into press contact with the polishing pad.

Abstract: A polishing head includes a head body, a first recessed portion formed in the lower surface of the head body, a support plate which can be moved up and down in the first recessed portion, a first film-like member in which a first space is formed between the upper surface of the support plate and the head body, a second recessed portion formed in a lower surface of the support plate, a second film-like member, in which a second space is formed between the second film-like member and the support plate, and which holds a wafer on the lower, a communicating hole which is formed in the support plate to communicate the first space with the second space, and a gas supply device which increases pressures in the first and second spaces with a fluid to equal pressures to bring the object into press contact with the polishing pad.